Patents by Inventor Liang Ma

Liang Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11752943
    Abstract: A method for automatically panning a view for a commercial vehicle includes receiving a video feed from at least one camera defining a field of view. A plurality of objects in the video feed, includes at least one wheel and at least one line, are identified. A path of each object in the plurality of objects is tracked through an image plane of the video feed. A trailer angle corresponding to each path is identified, the identified trailer angle is associated with the corresponding path, thereby generating a plurality of trailer angle measurements. The plurality of paths are down selected to a single path and identifying a single trailer angle measurement corresponding to the single path.
    Type: Grant
    Filed: June 6, 2022
    Date of Patent: September 12, 2023
    Assignee: STONERIDGE, INC.
    Inventors: Liang Ma, Utkarsh Sharma, Saif Imran, Mohammad Gudarzi, Nguyen Phan, Wenpeng Wei
  • Patent number: 11742987
    Abstract: This application discloses a method and an apparatus for processing information, a communications device, and a communications system. The communications device is configured to obtain a starting position of an output bit sequence in a coded block in a circular buffer, and determine the output bit sequence in the coded block based on a length of the output bit sequence and the starting position. A value of the starting position is one of {p0, p1, p2, . . . , pkmax?1}, where 0?pk<NCB, pk is an integer, k is an integer, 0?k<kmax, NCB is a size of the coded block, and kmax is an integer greater than or equal to 4.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: August 29, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Liang Ma, Xin Zeng, Yuejun Wei, Carmela Cozzo
  • Patent number: 11715718
    Abstract: Embodiments of bonded semiconductor structures and fabrication methods thereof are disclosed. In an example, a method for forming a semiconductor device is disclosed. A first device layer is formed on a first substrate. A first bonding layer including a first bonding contact is formed above the first device layer. A first capping layer is formed at an upper end of the first bonding contact. The first capping layer has a conductive material different from a remainder of the first bonding contact. A second device layer is formed on a second substrate. A second bonding layer including a second bonding contact is formed above the second device layer. The first substrate and the second substrate are bonded in a face-to-face manner, so that the first bonding contact is in contact with the second bonding contact by the first capping layer.
    Type: Grant
    Filed: November 21, 2020
    Date of Patent: August 1, 2023
    Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Si Ping Hu, Xianjin Wan
  • Patent number: 11703933
    Abstract: Examples described herein provide for a first core to map a measurement of packet processing activity and operating parameters so that a second core can access the measurement of packet processing activity and potentially modify an operating parameter of the first core. The second core can modify operating parameters of the first core based on the measurement of packet processing activity. The first and second cores can be provisioned on start-up with a common key. The first and second cores can use the common key to encrypt or decrypt measurement of packet processing activity and operating parameters that are shared between the first and second cores. Accordingly, operating parameters of the first core can be modified by a different core while providing for secure modification of operating parameters.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: July 18, 2023
    Assignee: Intel Corporation
    Inventors: Liang Ma, Weigang Li, Madhusudana Raghupatruni, Hongjun Ni, Xuekun Hu, Changzheng Wei, Chris MacNamara, John J. Browne
  • Publication number: 20230220219
    Abstract: Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 13, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Marvin M. Pollum, Jr., Masayuki Nakajima, Daniel P. Willis, Lorraine Hsu, Allison G. Condie, Maria S. French, Hongying Zhou, Qi Zheng, Hong Li, Calum H. Munro
  • Publication number: 20230212435
    Abstract: Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.
    Type: Application
    Filed: April 14, 2021
    Publication date: July 6, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Allison G. Condie, Marvin M. Pollum, Jr., Maria S. French, Lorraine Hsu, Shuyu Fang, Hong Li, Calum H. Munro, Cynthia Kutchko, Eric S. Epstein, Gobinda Saha
  • Publication number: 20230202395
    Abstract: A camera monitor system including a first mirror replacement assembly including a housing supporting a rear facing camera and a rear facing range sensor, a controller in communication with the mirror replacement assembly, the controller including a processor and a memory, the memory storing instructions for identifying at least one object in an image feed from the camera and determining an angular position of the object using image analysis, identifying a distance of the at least one object from the mirror replacement assembly using the range sensor; and fusing the distance and the angular position of the object into a single data set, and a display connected to the controller and configured to display a mirror replacement view including at least a portion of the image feed.
    Type: Application
    Filed: December 21, 2022
    Publication date: June 29, 2023
    Inventors: Liang Ma, Troy Otis Cooprider, Dominik Marx
  • Publication number: 20230202394
    Abstract: A method for estimating a trailer wheel position includes identifying a first set of wheel locations in a first image. Each of the wheel locations in the first set of wheel locations is associated with a corresponding trailer angle. The first set of wheel locations is clustered and a primary cluster in the first set of wheel locations is identified. A best fit curve is applied to the primary cluster. The best fit curve is a curve associating wheel position to trailer angle. An estimated wheel position is determined by applying a determined trailer angle to the best fit curve in response to the wheel being hidden in the first image. The estimated wheel position is output to at least one additional vehicle system.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 29, 2023
    Inventors: Wenpeng Wei, Liang Ma, Yifan Men, Troy Otis Cooprider
  • Publication number: 20230206497
    Abstract: A camera monitoring system includes a first mirror replacement camera extending outward from a vehicle. The first mirror replacement camera defines a rearward facing field of view including at least one image feature during at least a first set of operating conditions. The at least one image feature has a fixed position within the field of view during the at least the first set of operating conditions. A camera monitoring system controller is configured to automatically calibrate an orientation of the first mirror replacement camera relative to the vehicle by comparing an expected position of the at least one image feature to an actual position of the at least one image feature while the vehicle is operating under the first set of operating conditions and identifying a shift of camera orientation based on the difference.
    Type: Application
    Filed: December 13, 2022
    Publication date: June 29, 2023
    Inventors: Utkarsh Sharma, Liang Ma, Nguyen Phan, Troy Otis Cooprider, Banuprakash Murthy
  • Publication number: 20230193106
    Abstract: The present invention is directed to a composition comprising a thermoplastic polymer and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles having a thermal conductivity of at least 5 W/m.K measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257) and being present in an amount of at least 50% by volume based on total volume of the filler package. The present invention also is directed to coatings comprising a thermal conductivity of at least 0.5 W/m·K (measured according to ASTM D7984) and to substrates, at least a portion of which is coated with such a coating.
    Type: Application
    Filed: January 20, 2021
    Publication date: June 22, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Marvin M. Pollum, Jr., Calum H. Munro, Maria S. French, Allison G. Condie, Fabien Mezzanotti, Josiane Léon, Hong Li
  • Publication number: 20230183445
    Abstract: Disclosed herein is a composition comprising a thiol-terminated compound; an oxidant; and a thermally conductive filler package comprising thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 1 ?·m (measured according to ASTM D257, C611, or B193) and may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of 15% by volume to 90% by volume based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein.
    Type: Application
    Filed: January 20, 2021
    Publication date: June 15, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Liang Ma, Maria S. French, Allison G. Condie, Lorraine Hsu, Marvin M. Pollum, Jr., Hong Li, Calum H. Munro
  • Publication number: 20230167311
    Abstract: The present invention relates to a substrate having (a) a first material applied to at least a portion of the substrate, and (b) a coating layer deposited from a powder coating composition including a film-forming resin, and optionally a thermally conductive, electrically insulative filler material and/or a crosslinker that is reactive with the film-forming resin, in direct contact with at least a portion of the substrate to which the first material has been applied. The first material is (i) a catalyst that catalyzes cure of the powder coating composition, (ii) a component reactive with the film-forming resin and/or the crosslinker of the powder coating composition, and/or (iii) a rheology modifier.
    Type: Application
    Filed: February 26, 2021
    Publication date: June 1, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Brian E. Woodworth, John R. Schneider, Anthony M. Chasser, Liang Ma, Calum H. Munro, Marvin M. Pollum, Jr., Maria S. French, Allison G. Condie, Holli A. Gonder-Jones, Daniel K. Dei, Christopher Apanius, Cassandra Noelle Bancroft
  • Patent number: 11661675
    Abstract: The present disclosure provides high-purity semi-insulating single-crystal silicon carbide wafer and crystal which include one polytype single crystal. The semi-insulating single-crystal silicon carbide wafer has silicon vacancy inside, wherein the silicon-vacancy concentration is greater than 5E11 cm{circumflex over (?)}-3.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: May 30, 2023
    Assignee: TAISIC MATERIALS CORP.
    Inventors: Dai-Liang Ma, Bang-Ying Yu, Bo-Cheng Lin
  • Patent number: 11655600
    Abstract: The disclosure relates to the technical field of bridge construction, in particular to a method for installing steel tube arches, which comprises the following steps: step S1, erecting steel tube arch assembling brackets; step S2, assembling a steel tube arch of longitudinally moving segment; step S3, installing temporary tie rods; step S4, dismantling the assembling brackets; step S5, longitudinally moving the steel tube arch of longitudinally moving segment; step S6, erecting an arch springing bracket and assembling small mileage arch springing segments; step S7, closing the steel tube arch; S8, arch falling and temporary auxiliary facilities dismantling; step S9, construction of concrete and suspenders in arch. The method for installing steel tube arches provided by the disclosure is safe, standardized and reliable, and the construction standard is prone to control.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: May 23, 2023
    Assignee: China Railway No.3 Engineering Group Co.Ltd
    Inventors: Yugen Zhang, Chenghong Liu, Liang Ma, Yubo Chen, Changyong Ji, Yingmei Wang, Boxuan Zhang, Guoying Song, Tengfei Dong
  • Publication number: 20230150434
    Abstract: A camera monitor system includes a camera arm that has a camera with an image capture unit that is configured to capture an image of a desired field of view. A display is configured to display the desired field of view, and an IR LED illuminates at least a portion of the desired field of view. A controller is in communication with the image capture unit and the IR LED and select at least first and second regions of interest (ROI) from the captured image. The first ROI is indicative of an amount of ambient light. The controller determines a luminance of each of said first and second ROIs. The controller regulates an IR LED state of the IR LED based upon the first ROI luminance, and adjusts the IR LED state based upon the second ROI luminance.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 18, 2023
    Inventors: Yifan Men, Liang Ma, Troy Cooprider
  • Publication number: 20230143426
    Abstract: The present invention is directed towards a system for coating a substrate comprising an electrodepositable coating composition and a powder coating composition. Also disclosed are coated substrates comprising a first coating layer comprising an electrodepositable coating layer, and a second coating layer comprising a powder coating layer on at least a portion of the first coating layer, as well as methods of coating substrates.
    Type: Application
    Filed: February 26, 2021
    Publication date: May 11, 2023
    Applicant: PPG Industries Ohio, Inc.
    Inventors: Sijmen J. Visser, Brian E. Woodworth, Holli A. Gonder-Jones, John R. Schneider, Kelly L. Moore, Mark L. Follet, Liang Ma, Calum H. Munro, Marvin M. Pollum, JR., Maria S. French, Allison G. Condie, Amy E. Harrison, Irina G. Schwendeman, Daniel K. Dei, Cassandra Noelle Bancroft, Christopher Apanius, Kevin T. Sylvester, Corey J. Dedomenic, Egle Puodziukynaite
  • Patent number: 11637570
    Abstract: One example method includes obtaining L1 first decoding paths of an (i?1)th group of to-be-decoded bits, where i is an integer, received data corresponds to P groups of to-be-decoded bits, and 1<i?P, determining at least one second decoding path corresponding to each first decoding path, where a quantity of second decoding paths corresponding to each first decoding path is less than 2n, and where n is a quantity of information bits included in an ith group of to-be-decoded bits, and determining at least one reserved decoding path of the ith group of to-be-decoded bits in second decoding paths corresponding to the L1 first decoding paths. The at least one reserved decoding path includes a decoding result of the ith group of to-be-decoded bits.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: April 25, 2023
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Liang Ma, Hang Li, Yuejun Wei
  • Patent number: D989425
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: June 13, 2023
    Assignee: 22 THRASIO TWENY TWO, INC.
    Inventor: Ling Liang Ma
  • Patent number: D991215
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: July 4, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Liang Ma, Qiuhua Chen
  • Patent number: D993932
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: August 1, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Liang Ma, Muyao Li