Patents by Inventor Liangzhong Wei

Liangzhong Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Combined leg structure of micro bridge unit of focal plane array
    Patent number: 9897487
    Abstract: A combined leg structure of a micro bridge unit of a focal plane array adopts a conductive polymer film or a doped conductive polymer film to serve as an extraction electrode in the micro bridge unit of the focal plane array, which contacts a vanadium oxide thermosensitive film or a doped vanadium oxide thermosensitive film of a bridge surface layer, so as to electrically connect the thermosensitive film of the micro bridge unit with a read-out circuit. The combined leg structure includes three layers: respectively an upper SiNx film layer, a lower SiNx film layer and a middle layer of the conductive polymer film or the doped conductive polymer film. The present invention adopts the conductive polymer film or the doped conductive polymer film having a low thermal conductivity to serve as an electrode material. A bridge leg absorption structure is arranged in the combined leg structure.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: February 20, 2018
    Assignee: Wuxi Aleader Intelligent Technology Co., LTD
    Inventors: Tao Wang, Liangzhong Wei, Wanglong Zhu, Yan Liu
  • Combined leg structure of micro bridge unit of focal plane array
    Publication number: 20160097675
    Abstract: A combined leg structure of a micro bridge unit of a focal plane array adopts a conductive polymer film or a doped conductive polymer film to serve as an extraction electrode in the micro bridge unit of the focal plane array, which contacts a vanadium oxide thermosensitive film or a doped vanadium oxide thermosensitive film of a bridge surface layer, so as to electrically connect the thermosensitive film of the micro bridge unit with a read-out circuit. The combined leg structure includes three layers: respectively an upper SiNx film layer, a lower SiNx film layer and a middle layer of the conductive polymer film or the doped conductive polymer film. The present invention adopts the conductive polymer film or the doped conductive polymer film having a low thermal conductivity to serve as an electrode material. A bridge leg absorption structure is arranged in the combined leg structure.
    Type: Application
    Filed: December 9, 2015
    Publication date: April 7, 2016
    Inventors: Tao Wang, Liangzhong Wei, Wanglong Zhu, Yan Liu