Abstract: Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.

Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Abstract: Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.

Abstract: Embodiments of the present invention provide a computer-implemented method for identifying a specified object. The method includes collecting attributes of a physical object within a physical space, in which the attributes include an object temperature obtained via an (IR) sensor and an object shape obtained via an image sensor. A machine learning algorithm is executed to allocate a coordinate to the object based on the attributes. In response to a request from a user to locate the object, the physical space is scanned via the IR sensor and the image sensor to identify the object and to detect a present location. An indication of a location of the object is then displayed to the user, in which the indication is at least one of the present location of the object or a predicted location of the object.

Abstract: A method for cleaving a fiber comprises rotating an actuator to apply a positioning force to a blade in a scoring assembly. The positioning force produces a score in the surface of a fiber, and the method further comprise applying a cleaving force to the fiber to cleave the fiber. The method can further include measuring the magnitude of the positioning force and rotating the actuator until the magnitude corresponds to a pre-determined magnitude. A cleaver comprises a scoring assembly, drive assembly, and a cleaving assembly. The scoring assembly includes a holder having one or more blades, and an actuator. The cleaving assembly secures a fiber in the scoring assembly. The drive assembly rotates the actuator to position one or more blades to score the surface of the fiber. The cleaving assembly applies a cleaving force to the fiber to cleave the fiber at the location of the score.

Abstract: Technical solutions are described for testing a light emitting diode (LED) device. An example method includes driving, by a controller, a filter unit to filter a light from the LED device using a first filter. The method further includes, in response to a sensor not receiving a measurable signal because of the first filter, driving, by the controller, the filter unit to filter the light using a second filter. Further, in response to the sensor not receiving the measureable signal because of the second filter, the method includes outputting an indication that the LED device is rejected. Further, in response to the sensor receiving the measureable signal, the method includes outputting an indication that the LED device is of a color representative of the second filter.

Abstract: Embodiments of the present invention provide a computer-implemented method for identifying a specified object. The method includes collecting attributes of a physical object within a physical space, in which the attributes include an object temperature obtained via an (IR) sensor and an object shape obtained via an image sensor. A machine learning algorithm is executed to allocate a coordinate to the object based on the attributes. In response to a request from a user to locate the object, the physical space is scanned via the IR sensor and the image sensor to identify the object and to detect a present location. An indication of a location of the object is then displayed to the user, in which the indication is at least one of the present location of the object or a predicted location of the object.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A method for cleaving a fiber comprises rotating an actuator to apply a positioning force to a blade in a scoring assembly. The positioning force produces a score in the surface of a fiber, and the method further comprise applying a cleaving force to the fiber to cleave the fiber. The method can further include measuring the magnitude of the positioning force and rotating the actuator until the magnitude corresponds to a pre-determined magnitude. A cleaver comprises a scoring assembly, drive assembly, and a cleaving assembly. The scoring assembly includes a holder having one or more blades, and an actuator. The cleaving assembly secures a fiber in the scoring assembly. The drive assembly rotates the actuator to position one or more blades to score the surface of the fiber. The cleaving assembly applies a cleaving force to the fiber to cleave the fiber at the location of the score.

Abstract: Technical solutions are described for testing a light emitting diode (LED) device. An example method includes driving, by a controller, a filter unit to filter a light from the LED device using a first filter. The method further includes, in response to a sensor not receiving a measurable signal because of the first filter, driving, by the controller, the filter unit to filter the light using a second filter. Further, in response to the sensor not receiving the measureable signal because of the second filter, the method includes outputting an indication that the LED device is rejected. Further, in response to the sensor receiving the measureable signal, the method includes outputting an indication that the LED device is of a color representative of the second filter.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement. A potential electrostatic danger condition is determined based on the electrostatic discharge history.

Abstract: A first electrostatic discharge measurement is received from a first sensor. The first sensor utilizes a wireless network to send the first measurement from a first stage of the assembly line of electronic components susceptible to electrostatic discharge damage. A second electrostatic discharge measurement is received from a second sensor. The second sensor utilizes the wireless network to send the second measurement from a second stage of the assembly line. An electrostatic discharge history is updated for the first assembly stage based on the first electrostatic discharge measurement. The electrostatic discharge history is updated for the second assembly stage based on the second electrostatic discharge measurement. A potential electrostatic danger condition is determined based on the electrostatic discharge history.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.

Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.