Patents by Inventor Lien-Fang Lin

Lien-Fang Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5883919
    Abstract: A furnace system for preventing gas leakage is disclosed. The furnace system includes a bottom board for holding a furnace tube. A gas injection device is connected to the furnace tube at a first port for injecting reaction gas into the furnace tube. An exhaust subsystem is connected to the furnace tube at a second port. The exhaust subsystem has a first node, a second node, a third node and a fourth node. A vacuum seal is connected to the furnace tube at a third port for preventing the exhaust gas from leaking. The vacuum seal is connected to the exhaust subsystem at the first node and the second node. Finally, an N.sub.2 sealing tube is connected to furnace tube and surrounding the seam between the furnace tube and the bottom board.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: March 16, 1999
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Cheng-Chang Hung, Lien-Fang Lin
  • Patent number: 5769628
    Abstract: A furnace exhaust system with a regulator is disclosed. The furnace exhaust system comprises a furnace for providing a reaction chamber wherein a semiconductor process takes place, exhaust gas reacted from the semiconductor process being released through an exhaust pipe. An air pressure controller is connected to the furnace through the pipe for maintaining the pressure of the exhaust gas in the furnace and the pipe, the air pressure controller comprising a sensor for monitoring the pressure of the exhaust gas in the pipe, and a valve for controlling the passage of the exhaust gas according to the sensor. A regulator is connected to the pipe for providing an air block and an air buffer, the regulator comprising at least one cup-shaped structure with at least one hole in the bottom of the cup-shaped structure, the hole allowing condensed liquid from the furnace to be drained out.
    Type: Grant
    Filed: May 3, 1996
    Date of Patent: June 23, 1998
    Assignee: Vanguard International Semiconductor Corporation
    Inventor: Lien-Fang Lin