Patents by Inventor Lieyi Sheng

Lieyi Sheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11152236
    Abstract: The disclosed embodiments include systems and methods of manufacturing a product. The system may include a non-transitory computer readable medium comprising computer readable program code for performing the method. The method may include manufacturing batches of the product according to steps of a process flow, determining output data for each batch, sequencing the batches by output data, determining a plurality of modes of output data based on grouping the batches, identifying a detrimental factor to output data in a process flow step based on a correlation between the process flow step and a mode of the plurality of modes, and correcting the detrimental factor.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: October 19, 2021
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Lieyi Sheng
  • Publication number: 20190333795
    Abstract: The disclosed embodiments include systems and methods of manufacturing a product. The system may include a non-transitory computer readable medium comprising computer readable program code for performing the method. The method may include manufacturing batches of the product according to steps of a process flow, determining output data for each batch, sequencing the batches by output data, determining a plurality of modes of output data based on grouping the batches, identifying a detrimental factor to output data in a process flow step based on a correlation between the process flow step and a mode of the plurality of modes, and correcting the detrimental factor.
    Type: Application
    Filed: April 23, 2019
    Publication date: October 31, 2019
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Lieyi SHENG
  • Publication number: 20020132490
    Abstract: A microstructure comprising a spider-like membrane and a wedge beneath is designed and fabricated on the silicon substrate using common IC techniques and silicon anisotropic etching process. The wedge beneath can contact the membrane to provide mechanical support, or form a narrow gap with the membrane to realize several device functions. The microstructures are adaptable for many applications and can be easily implemented into standard CMOS chips.
    Type: Application
    Filed: March 16, 2001
    Publication date: September 19, 2002
    Inventor: Lieyi Sheng