Patents by Inventor Limin Lin

Limin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942053
    Abstract: Disclosed are a display panel and a driving method therefor, and a display device. Two adjacent rows of sub-pixels are taken as a row group, and the row group is provided with a first sub row group and a second sub row group that are arranged in a column direction; a gate electrode of a first transistor in the first sub row group is electrically connected to a first gate line; a gate electrode of a second transistor in the second sub row group is electrically connected to a second gate line; two adjacent sub-pixels in the column direction share one third transistor, and a gate electrode of the third transistor in the row group is electrically connected to a third gate line; and the first transistor and the second transistor in one column of sub-pixels are electrically connected to a data line by means of the shared third transistor.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: March 26, 2024
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xianglei Qin, Jian Lin, Yong Zhang, Limin Zhang, Zepeng Sun, Zhichao Yang, Liangzhen Tang, Zhilong Duan, Honggui Jin, Yashuai An, Lingfang Nie, Jian Wang, Li Tian, Jing Pang, Xuechao Song
  • Patent number: 11927844
    Abstract: Provided is a display substrate. The display substrate includes: a base substrate including a display region and a non-display region surrounding the display region; a gate drive circuit disposed in the non-display region; a plurality of first signal lines disposed in the peripheral region and connected to the gate drive circuit; and a plurality of second signal lines disposed in the non-display region and connected to the gate drive circuit; wherein each of the first signal line and the second signal line is configured to supply a signal to the gate drive circuit, and a frequency of the signal supplied by the first signal line is lower than a frequency of the signal supplied by the second signal line.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 12, 2024
    Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Groups Co., Ltd.
    Inventors: Zepeng Sun, Yong Zhang, Xianglei Qin, Jian Wang, Yanchen Li, Jian Lin, Limin Zhang, Zhichao Yang, Liangzhen Tang, Zhilong Duan, Yashuai An, Lingfang Nie, Honggui Jin, Li Tian
  • Patent number: 11815776
    Abstract: Provided are an array substrate, a display panel and a display device. The array substrate includes a first base; a switch array layer including transistors; a pixel electrode layer including pixel electrodes, each of which being connected to a drain electrode of a pixel electrode through a via; and a color resist array layer including color resists, each of which includes a first edge and a second edge opposite to each other in a first direction. First and second recesses are formed at first and second edges; for two color resists adjacent in the first direction, the first recess of one color resist is opposite to the second recess of the other color resist; and projections of the first and second recesses overlap at least partially with a projection of the via in a second direction, and the second direction is parallel to a thickness direction of the array substrate.
    Type: Grant
    Filed: June 28, 2020
    Date of Patent: November 14, 2023
    Assignee: Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Yongjin Teng, Xiaoli Liu, Yingzhang Qiu, Limin Lin, Jiao Gao, Tingxi Huang
  • Patent number: 11796879
    Abstract: Provided are an array substrate, a display panel, and a display device. The array substrate includes a base substrate, a thin-film transistor disposed on one side of the base substrate, a pixel electrode, and at least two color resist layers disposed between the TFT and the pixel electrode. A medium layer is disposed between any two adjacent color resist layers. The pixel electrode is electrically connected to a first electrode of the thin-film transistor through a via.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: October 24, 2023
    Assignee: Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Jiao Gao, Yingzhang Qiu, Limin Lin, Xiaoli Liu, Yongjin Teng
  • Patent number: 11774815
    Abstract: Provided display panel includes color film substrate, array substrate disposed opposite to color film substrate, first color resist layer disposed on color film substrate and including first-type color resist blocks, second color resist layer disposed on array substrate, and first metal wires disposed on array substrate. Second color resist layer is disposed on side of first metal wires facing color film substrate. First metal wires extend along first direction. Second color resist layer includes second-type color resist blocks. Color of second-type color resist blocks different from color of first-type color resist blocks. Each first-type color resist block and each second-type color resist block are disposed alternatively along second direction.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: October 3, 2023
    Assignee: Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Yongjin Teng, Xiaoli Liu, Limin Lin, Yingzhang Qiu, Jiao Gao, Tingxi Huang
  • Publication number: 20230122677
    Abstract: Provided display panel includes color film substrate, array substrate disposed opposite to color film substrate, first color resist layer disposed on color film substrate and including first-type color resist blocks, second color resist layer disposed on array substrate, and first metal wires disposed on array substrate. Second color resist layer is disposed on side of first metal wires facing color film substrate. First metal wires extend along first direction. Second color resist layer includes second-type color resist blocks. Color of second-type color resist blocks different from color of first-type color resist blocks. Each first-type color resist block and each second-type color resist block are disposed alternatively along second direction.
    Type: Application
    Filed: August 31, 2020
    Publication date: April 20, 2023
    Inventors: Yongjin Teng, Xiaoli Liu, Limin Lin, Yingzhang QIU, Jiao Gao, Tingxi Huang
  • Publication number: 20230071313
    Abstract: Provided are an array substrate, a display panel and a display device. The array substrate includes a first base: a switch array layer including transistors: a pixel electrode layer including pixel electrodes, each of which being connected to a drain electrode of a pixel electrode through a via; and a color resist array layer including color resists, each of which includes a first edge and a second edge opposite to each other in a first direction. First and second recesses are formed at first and second edges; for two color resists adjacent in the first direction, the first recess of one color resist is opposite to the second recess of the other color resist; and projections of the first and second recesses overlap at least partially with a projection of the via in a second direction, and the second direction is parallel to a thickness direction of the array substrate.
    Type: Application
    Filed: June 28, 2020
    Publication date: March 9, 2023
    Applicant: Xiamen Tianma Micro-Electronics Co.,Ltd.
    Inventors: Yongjin TENG, Xiaoli LIU, Yingzhang QIU, Limin LIN, Jiao GAO, Tingxi HUANG
  • Publication number: 20220334422
    Abstract: Provided are an array substrate, a display panel, and a display device. The array substrate includes a base substrate, a thin-film transistor disposed on one side of the base substrate, a pixel electrode, and at least two color resist layers disposed between the TFT and the pixel electrode. A medium layer is disposed between any two adjacent color resist layers. The pixel electrode is electrically connected to a first electrode of the thin-film transistor through a via.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 20, 2022
    Applicant: Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Jiao GAO, Yingzhang QIU, Limin LIN, Xiaoli LIU, Yongjin TENG
  • Publication number: 20220317494
    Abstract: Embodiments of the present disclosure provide a low temperature poly-silicon display panel, a manufacturing method thereof, and a liquid crystal device, which relate to the display technology and improve the light leakage of the metal. The low temperature poly-silicon display panel includes an array substrate and an alignment substrate that are opposite to each other, and liquid crystals filled between the array substrate and the alignment substrate. The array substrate includes a base substrate, and a low temperature poly-silicon active layer, a gate layer, and a source-drain layer are arranged on the base substrate. The low temperature poly-silicon display panel further includes a color filter layer disposed on the array substrate and located on a side of the source-drain layer facing away from the base substrate, and a light shielding layer configured to define an opening region of the low temperature poly-silicon display panel.
    Type: Application
    Filed: May 19, 2020
    Publication date: October 6, 2022
    Applicant: Xiamen Tianma Micro-Electronics Co., Ltd.
    Inventors: Xiaoli LIU, Yongjin TENG, Limin LIN, Yingzhang QIU
  • Patent number: 11065360
    Abstract: A medical hydrogel composition, a medical hydrogel, a preparation method therefore and an application thereof, and a medical hydrogel kit. The medical hydrogel composition comprises a first component and a second component; the first component comprises polylysine and polyethylene imine; the second component comprises one or more of 4-arm-polyethylene glycol-succinimidyl glutarate, 4-arm-polyethylene glycol-succinimidyl succinate, and 4-arm-polyethylene glycol-succinimidyl carbonate; the degree of polymerization of the polylysine is 20 or more. The medical hydrogel is formed by reacting the first component with the second component of the medical hydrogel composition. The medical hydrogel kit comprises the medical hydrogel composition and a buffer solution used for dissolving the components of the medical hydrogel composition. The medical hydrogel has a degree of swelling of ?10%-50%, and can be applied in narrow parts where cranial, spinal, and peripheral nerves are densely distributed.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: July 20, 2021
    Assignee: Medprin Regenerative Medical Technologies Co., Ltd.
    Inventors: Limin Lin, Yaya Yang, Cheng Ma, Kunxue Deng, Yuyu Yuan
  • Patent number: 11036959
    Abstract: Embodiments of the present disclosure provide a display device and relate to the display technology field. The display device includes: a first base substrate, a plurality of pixels arranged in an array, a light source, configured to emit visible light, at least one photoluminescence unit, configured to convert the visible light into invisible light, and at least one light sensing element, configured to perform fingerprint recognition according to the invisible light reflected by a touch body. The display device implements the fingerprint recognition with the invisible light, and then the influence on the fingerprint recognition caused by the visible light from the external environment or backlight source and irradiated onto the light sensing element is avoided, thereby improving a fingerprint recognition precision.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: June 15, 2021
    Assignee: XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.
    Inventors: Limin Lin, Yongjin Teng, Yingzhang Qiu, Limei Shen, Huifang Zhou
  • Publication number: 20200082144
    Abstract: Embodiments of the present disclosure provide a display device and relate to the display technology field. The display device includes: a first base substrate, a plurality of pixels arranged in an array, a light source, configured to emit visible light, at least one photoluminescence unit, configured to convert the visible light into invisible light, and at least one light sensing element, configured to perform fingerprint recognition according to the invisible light reflected by a touch body. The display device implements the fingerprint recognition with the invisible light, and then the influence on the fingerprint recognition caused by the visible light from the external environment or backlight source and irradiated onto the light sensing element is avoided, thereby improving a fingerprint recognition precision.
    Type: Application
    Filed: November 11, 2019
    Publication date: March 12, 2020
    Inventors: Limin LIN, Yongjin TENG, Yingzhang QIU, Limei SHEN, Huifang ZHOU
  • Publication number: 20190142994
    Abstract: A medical hydrogel composition, a medical hydrogel, a preparation method therefore and an application thereof, and a medical hydrogel kit. The medical hydrogel composition comprises a first component and a second component; the first component comprises polylysine and polyethylene imine; the second component comprises one or more of 4-arm-polyethylene glycol-succinimidyl glutarate, 4-arm-polyethylene glycol-succinimidyl succinate, and 4-arm-polyethylene glycol-succinimidyl carbonate; the degree of polymerization of the polylysine is 20 or more. The medical hydrogel is formed by reacting the first component with the second component of the medical hydrogel composition. The medical hydrogel kit comprises the medical hydrogel composition and a buffer solution used for dissolving the components of the medical hydrogel composition. The medical hydrogel has a degree of swelling of ?10%-50%, and can be applied in narrow parts where cranial, spinal, and peripheral nerves are densely distributed.
    Type: Application
    Filed: April 28, 2017
    Publication date: May 16, 2019
    Applicant: Medprin Regenerative Medical Technologies Co., Ltd.
    Inventors: Limin Lin, Yaya Yang, Cheng Ma, Kunxue Deng, Yuyu Yuan
  • Patent number: 9772410
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: September 26, 2017
    Assignee: OY AJAT LTD.
    Inventors: Konstantinos Spartiotis, Henri Tapio Nykanen, Limin Lin, Tuomas Heikki Elmeri Lahtinen, Pasi Juhani Laukka
  • Publication number: 20160181306
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Konstantinos SPARTIOTIS, Henri Tapio NYKANEN, Limin LIN, Tuomas Heikki Elmeri LAHTINEN, Pasi Juhani LAUKKA
  • Patent number: 9329284
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: May 3, 2016
    Assignee: OY AJAT LTD.
    Inventors: Konstantinos Spartiotis, Henri Tapio Nykanen, Limin Lin, Tuomas Heikki Elmeri Lahtinen, Pasi Juhani Laukka
  • Publication number: 20150276945
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by capillary bump bonds.
    Type: Application
    Filed: March 25, 2014
    Publication date: October 1, 2015
    Inventors: Konstantinos Spartiotis, Henri Tapio Nykanen, Limin Lin, Tuomas Heikki Elmeri Lahtinen, Pasi Juhani Laukka
  • Publication number: 20150279890
    Abstract: A high pixel density intraoral x-ray imaging sensor includes a direct conversion, fully depleted silicon detector bump bonded to a readout CMOS substrate by cu-pillar bump bonds.
    Type: Application
    Filed: March 24, 2015
    Publication date: October 1, 2015
    Inventors: Konstantinos SPARTIOTIS, Henri Tapio NYKANEN, Limin LIN, Tuomas Heikki Elmeri LAHTINEN, Pasi Juhani LAUKKA
  • Patent number: 8222064
    Abstract: A method of fabricating a compound semiconductor vertical LED is provided. A first growth substrate capable of supporting compound semiconductor epitaxial growth thereon is provided. One or more epitaxial layers of compound semiconductor material such as GaN or InGaN is formed on the first growth substrate to create a portion of a vertical light emitting diode. Plural trenches are formed in the compound semiconductor material. Passivating material is deposited in one or more trenches. A hard material is at least partially deposited in the trenches and optionally on portions of the compound semiconductor material. The hard material has a hardness greater than the hardness of the compound semiconductor. A metal layer is deposited over the compound semiconductor material followed by metal planarization. A new host substrate is bonded to the metal layer and the first growth substrate is removed. Dicing is used to form individual LED devices.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: July 17, 2012
    Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
    Inventors: Limin Lin, Xiangfeng Shao
  • Patent number: 8211721
    Abstract: A method of making quasi-vertical light emitting devices includes growing semiconductor layers on a growth substrate and etching the semiconductor layers to produce device isolation trenches forming separable semiconductor devices and holes. Blind holes are drilled in the substrate at the location of each of the holes in the semiconductor layers. The drilling of the blind holes defines blind hole walls and a blind hole end in each of the blind holes. N-semiconductor metal is deposited in each of the blind holes. An n-electrode contact is formed in each of the blind holes by plating each of the blind holes with an n-electrode metal connected to the n-semiconductor metal. The substrate is thinned to expose the n-electrode metal as an n-electrode. Bonding metal is deposited to the n-electrode for packaging.
    Type: Grant
    Filed: March 29, 2011
    Date of Patent: July 3, 2012
    Assignee: Hong Kong Applied Science and Technology Research Institute Co. Ltd.
    Inventors: Limin Lin, Hung Shen Chu, Ka Wah Chan