Abstract: A liquid crystal display and a test circuit thereof are provided. The test circuit has a plurality of signal pads, a first data distributor, a plurality of logic circuit units and N switches. N is a positive integer. The signal pads are configured to receive a test data signal, a voltage signal, an enable signal and a plurality of first switch control signals. The first data distributor distributes the test data signal to N output terminals of the first data distributor. Each of the logic circuit units generates a second switch control signal according to the voltage signal, the enable signal and a corresponding one of the first switch control signals. Each of the switches controls the electrical connection between an output terminal of the first data distributor coupled thereto and at least a data line coupled thereto.

Abstract: Conductive cores for use in cables, where the conductive core comprises a filled-polymeric-composite material concentrically surrounded by a conductive layer. The filled-polymeric-composite material comprises a polymeric continuous phase having dispersed therein a filler material. Such conductive cores can be employed in various cable designs and further include one or more outer layers, such as dielectric insulation layers, conductive shield layers, and jackets.

Abstract: Disclosed is a halogen-free, flame retardant thermoplastic resin composition based on polypropylene and one or more thermoplastic elastomers with an organic nitrogen- and/or phosphorus-based intumescent flame retardant comprising a piperazine component. The composition is processed easily to make a wire and cable sheath exhibiting a balance of high flame retardancy, good flexibility, high wet electrical resistance and excellent heat deformation properties, and which passes the VW-I flame retardancy test, the UL1581 heat deformation test at 150° C. and the wet electrical resistance test, and also exhibits good tensile and flexibility properties. Also disclosed is a wire and cable sheath made from the composition.

Abstract: A shift register includes shift register units, in which at least one shift register unit is coupled to a forestage shift register unit and a post-stage shift register unit, where the at least one shift register unit includes a signal input circuit, a signal output circuit, a pull down circuit and a switching circuit. The signal input circuit electrically coupled to the forestage shift register unit can receive a logic signal from the forestage shift register. The signal output circuit is electrically coupled to the signal input circuit via a control signal terminal and is electrically coupled to the post-stage shift register unit. The signal output to circuit can receive a first clock signal. The pull down circuit is electrically coupled to or electrically isolated from the control signal terminal through the switching circuit.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier and colloidal silica abrasive particles dispersed in the liquid carrier. The colloidal silica abrasive particles have a permanent positive charge of at least 6 mV. About 30 percent or more of the colloidal silica abrasive particles include three or more aggregated primary particles.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine containing polymer in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, and a polycationic amine compound in solution in the liquid carrier. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine compound in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A display panel includes scan lines, data lines and a multiplexer circuit. The data lines interlace with the scan lines. The multiplexer circuit includes switches, in which first terminals of the plurality of switches are electrically coupled to one terminals of the data lines, respectively, and the switches are configured to switch on in response to control signals. The data lines are configured to receive image data signals through the switches during enabling periods of the control signals, and at least two control signals of the control signals are synchronously asserted and have enabling periods that are partially overlapped. A method of transmitting signals in a display panel is also disclosed herein.

Abstract: A system and method include acquisition of projection data from a scanned object, the set of projection data comprising a plurality of projection measurements. The system and method also include calculation of a set of modified statistical weights from the projection data, wherein a respective modified statistical weight of the set of modified statistical weights comprises a deviation from an inverse variance of a corresponding projection measurement of the projection data. The system and method further include reconstruction of an image of the scanned object using the set of modified statistical weights as coefficients in an iterative reconstruction algorithm.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine compound in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A display device includes multiple pixels, a gate driver and a data driver. Each pixel includes a transistor and a pixel capacitor electrically coupled to the transistor. The gate driver is configured to turn on the transistor of a first pixel for one time during a first turn-on period of multiple turn-on cycles of a frame cycle of a frame displayed by the display device. The data driver is configured to charge the pixel capacitor of the first pixel via the transistor of the first pixel to a first over-charge voltage and a data voltage during an over-charge period and a recovery period of the first turn-on period. The first over-charge voltage is different from the data voltage. A method for driving the display device is also provided.

Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of a layer.

Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles having a chemical compound incorporated therein. The chemical compound may include a nitrogen-containing compound such as an aminosilane or a phosphorus-containing compound. Methods for employing such compositions include applying the composition to a semiconductor substrate to remove at least a portion of at least one of a copper, a copper barrier, and a dielectric layer.

Abstract: A process for preparing a cured composite material useful for radio frequency filter applications comprising the steps of: (a) providing a curable thermoset epoxy resin composition comprising (i) at least one epoxy resin; (ii) at least one toughening agent; (iii) at least one hardener; and (iv) at least one filler, (b) curing the curable thermoset epoxy resin composition of step (a) to form a cured composite; wherein the curable thermoset epoxy resin composition upon curing provides a cured composite product with a balance of properties comprising Tg, coefficient of thermal expansion, tensile strength, thermal conductivity; and having a density of less than 2.7 g/cc; and (c) coating at least a portion of the surface of the cured composite of step (b) with an electrically conductive metal layer to form a metalized coating on at least a portion of the surface of the cured composite.

Abstract: Polymeric compositions suitable for use as insulation materials in electrical applications. Such polymeric compositions comprise an ethylene/?-olefin-based elastomer and a filler, where the filler consists essentially of an amorphous silica. Such polymeric compositions can optionally further comprise an ethylene-based thermoplastic polymer. Also disclosed are coated conductors comprising such polymeric compositions as insulation materials.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier and colloidal silica abrasive particles dispersed in the liquid carrier. The colloidal silica abrasive particles have a permanent positive charge of at least 6 mV. About 30 percent or more of the colloidal silica abrasive particles include three or more aggregated primary particles.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, and a polycationic amine compound in solution in the liquid carrier. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine containing polymer in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Abstract: A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine compound in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.