Abstract: A compact appliance includes a housing that has a planar bottom surface and sidewalls that define a cavity. A cooking assembly is operably coupled to the housing. The cooking assembly includes heat conductors that are proximate to the planar bottom surface of the housing. A heating plate is operably coupled to the heat conductors and define a portion of the planar bottom surface of the housing. A seal is disposed around and coupled to the heating plate. A tray is selectively disposed within the cavity defined by the housing and removably coupled to the heating plate. The tray includes a ceramic coating.

Abstract: A RF module and an electronic device. The RF module includes a RF transceiver module; a first antenna configured to transmit a first transmission signal, and receive a first main reception signal and a second diversity reception signal; a first triplexer connected to the RF transceiver module and the first antenna, and being configured to isolate the first transmission signal, the first main reception signal, and the second diversity reception signal; a second antenna configured to transmit a second transmission signal, receive a second main reception signal and a first diversity reception signal, and a frequency band of the first transmission signal being different from that of the second transmission signal; and a second triplexer connected to the RF transceiver module and the second antenna, and being configured to isolate the second transmission signal, the second main reception signal, and the first diversity reception signal.

Abstract: A structure for performing analysis includes a first opening formed on a back side of a substrate and passing through the substrate, a second opening connected with a bottom of the first opening and penetrating into a first dielectric layer formed on a front side of the substrate, a first conductive layer formed on a sidewall of the second opening and a contact element in the first dielectric layer, and a second conductive layer formed on a second dielectric layer. The first conductive layer contacts the second conductive layer electrically.

Abstract: A radio-frequency system is provided, which includes a radio-frequency transceiver and a radio-frequency transceiving circuit connected to the radio-frequency transceiver. The radio-frequency transceiving circuit includes a first transceiving channel and a second transceiving channel; the first transceiving channel includes a first transceiving module, the first transceiving module is connected to a first antenna; and the second transceiving channel includes a second transceiving module, and the second transceiving module is connected to a second antenna.

Abstract: Provided are a radio frequency front-end module, an antenna system and an electronic device. The radio frequency front-end module includes an antenna switch module connected with a first antenna interface, a first amplifier unit, a second amplifier unit, and a first switch unit. The first amplifier unit is configured to amplify a signal at a first frequency band and transmit the signal to the antenna switch module. The first switch unit is connected with each of a second antenna interface and the antenna switch module. The second amplifier unit is configured to amplify a signal at a second frequency band and transmit the signal to the first switch unit. The first switch unit is configured to transmit the signal at the second frequency band to the second antenna interface or the antenna switch module.

Abstract: The present disclosure relates to a radio frequency assembly and an electronic device. The radio frequency assembly includes: a radio frequency transceiver module, a first antenna, a second antenna, a first duplexer, and a second duplexer; the radio frequency transceiver module is configured to transmit and receive radio frequency signals; the first antenna is configured to transmit a first transmission signal and receive a first primary reception signal; the first duplexer is configured to insulate the first transmission signal from the first primary reception signal; the second antenna is configured to transmit a second transmission signal and receive a second primary reception signal; the second duplexer is configured to insulate the second transmission signal from the second primary reception signal.

Abstract: The invention provides a surface treatment method for a magnesium alloy hub. The process includes: cleaning a to-be-treated surface of the magnesium alloy hub; blackening the cleaned to-be-treated surface; and laser cladding the blackened to-be-treated surface, wherein a laser cladding mode is a synchronous powder feeding mode, and a coating material is chromium. According to the surface treatment method for the magnesium alloy hub, air holes can be avoided.

Abstract: A RF module and an electronic device. The RF module includes a RF transceiver module; a first antenna configured to transmit a first transmission signal, and receive a first main reception signal and a second diversity reception signal; a first triplexer connected to the RF transceiver module and the first antenna, and being configured to isolate the first transmission signal, the first main reception signal, and the second diversity reception signal; a second antenna configured to transmit a second transmission signal, receive a second main reception signal and a first diversity reception signal, and a frequency band of the first transmission signal being different from that of the second transmission signal; and a second triplexer connected to the RF transceiver module and the second antenna, and being configured to isolate the second transmission signal, the second main reception signal, and the first diversity reception signal.

Abstract: The present disclosure relates to a radio frequency assembly and an electronic device. The radio frequency assembly includes: a radio frequency transceiver module, a first antenna, a second antenna, a first duplexer, and a second duplexer; the radio frequency transceiver module is configured to transmit and receive radio frequency signals; the first antenna is configured to transmit a first transmission signal and receive a first primary reception signal; the first duplexer is configured to insulate the first transmission signal from the first primary reception signal; the second antenna is configured to transmit a second transmission signal and receive a second primary reception signal; the second duplexer is configured to insulate the second transmission signal from the second primary reception signal.

Abstract: Disclosed are a multi-dimensional segmentation method and apparatus for a 5G-oriented protocol stack, and a terminal. The method comprises: segmenting an MAC layer in a protocol stack, and putting HARQ entities of a physical layer and the MAC layer together in a pre-set physical resource for processing; and moving a relevant partial module of the physical layer to an FPGA for processing according to a calculation amount and functional requirements. The hardware configuration requirements are reduced on the basis of guaranteeing the performance.

Abstract: The present disclosure relates to an electrical connection apparatus provided on a substrate, comprising a base, a flexible circuit board, two connectors, and a fixing member. The flexible circuit board has a mating portion with a plurality of soldering pads; a mounting portion with a plurality of conductive blocks; and a plurality of conductive traces connecting the plurality of pads and the plurality of conductive blocks. The two connectors each have an insulative housing and a terminal. Each terminal has a soldering portion connected to the soldering pad. The substrate has a plurality of soldering pads connecting the conductive blocks. The fixing member fixes the base to the substrate. The present disclosure utilizes a ground layer of the flexible circuit board to reduce a signal crosstalk between the conductive traces, and utilizes the conductive blocks to connect the flexible circuit board and the substrate to improve coplanarity.

Abstract: Disclosed are a multi-dimensional segmentation method and apparatus for a 5G-oriented protocol stack, and a terminal. The method comprises: segmenting an MAC layer in a protocol stack, and putting HARQ entities of a physical layer and the MAC layer together in a pre-set physical resource for processing; and moving a relevant partial module of the physical layer to an FPGA for processing according to a calculation amount and functional requirements. The hardware configuration requirements are reduced on the basis of guaranteeing the performance.

Abstract: The present disclosure relates to an electrical connection apparatus provided on a substrate, comprising a base, a flexible circuit board, two connectors, and a fixing member. The flexible circuit board has a mating portion with a plurality of soldering pads; a mounting portion with a plurality of conductive blocks; and a plurality of conductive traces connecting the plurality of pads and the plurality of conductive blocks. The two connectors each have an insulative housing and a terminal. Each terminal has a soldering portion connected to the soldering pad. The substrate has a plurality of soldering pads connecting the conductive blocks. The fixing member fixes the base to the substrate. The present disclosure utilizes a ground layer of the flexible circuit board to reduce a signal crosstalk between the conductive traces, and utilizes the conductive blocks to connect the flexible circuit board and the substrate to improve coplanarity.

Abstract: A power control device includes a connector, a detecting module, a control module, a first output module, a second output module, a first switch module, and a second switch module. The detecting module measures a current and outputs different signals according to a comparison result between the current and a preset value. The first output module and the second output module are selectively used to supply power for the connector according to a value of the current.

Abstract: A power supply test device includes a function generator, a loading circuit, a current detection circuit, and a controller. The function generator outputs a square-wave signal to the loading circuit. The loading circuit is electronically connected to a power supply, the loading circuit regulates an output current of the power supply according to the square-wave signal. The current detection circuit cooperates with the controller in detecting a slope of the output current. The controller compares the detected slope with a preset value, and regulates the square-wave signal according to the comparison to regulate the slope of the output current.

Abstract: A power supply control circuit includes a main controller, a current detection unit electronically connected to the main controller, and a mode switch unit electronically connected to the main controller. The current detection unit cooperates with the main controller in detecting a value of an output current of a power supply circuit. The main controller determines whether the power supply circuit is operating in a discontinuous conduction mode or in a continuous conduction mode according to the value of the output current of the power supply circuit, and controls the mode switch unit to switch the power supply circuit to the continuous conduction mode when the power supply circuit operates in the discontinuous conduction mode.

Abstract: A test device includes a transformer, a loop analyzer, and a protection circuit. The protection circuit includes a control unit, a signal acquisition and amplification unit, and an electronic switch. When the loop analyzer outputs a signal, the signal acquisition and amplification unit acquires the signal output from the loop analyzer, amplifies the acquired signal, and outputs the amplified signal to the control unit. The control unit transforms the received signal from analog form to digital form, and compares the digital signal with a reference value. If the digital signal is greater than the reference value, the control unit outputs a control signal to the electronic switch, to turn off the electronic switch. The signal output from the loop analyzer cannot be transmitted to a buck circuit.

Abstract: A device for testing capacitive loads of a power supply includes a controller, a power supply switching circuit, a capacitive load switching circuit, and a current sampling circuit. The power supply switching circuit selects one of output voltages of the power supply to be electronically connected to the capacitive load switching circuit and the current sampling circuit. The current sampling circuit samples an output current of one output of the power supply selected by the controller. The controller turns on and off switches of the capacitive load switching circuit for matching an output current of the power supply with a reference current until the output current equals to the reference current. The controller outputs a total magnitude of the capacitive loads.

Abstract: A power control device includes a connector, a detecting module, a control module, a first output module, a second output module, a first switch module, and a second switch module. The detecting module measures a current and outputs different signals according to a comparison result between the current and a preset value. The first output module and the second output module are selectively used to supply power for the connector according to a value of the current.

Abstract: A power supply circuit which ceases the supply of power to an external device if the ground connection of the external device is broken includes a connector module, a test module, and a switch module. The connector module connects to the external device. The test module tests the connection between the connector module and the external device and can output a first or a second signal. The switch module is connected between the test module and the connector module, when the switch module receives the first signal from the test module, the switch module permits a connection between the connector module and power supply. When the switch module receives the second signal from the test module, the switch module disconnects the connector module from the power supply.