Patents by Inventor Linda J. Mayer

Linda J. Mayer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4555315
    Abstract: An improved electrolyte composition and process for electrodepositing bright, level and ductile copper deposits on a substrate enabling use of conventional electroplating equipment for high-speed copper plating employing average cathode current densities substantially higher than heretofore feasible. The electrolyte contains an additive system comprising carefully controlled relative concentrations of:(a) a bath soluble polyether compound;(b) a bath soluble organic divalent sulfur compound;(c) a bath soluble adduct of a tertiary alkyl amine with epichlorohydrin; and(d) a bath soluble reaction product of polyethyleneimine and an alkylating agent.
    Type: Grant
    Filed: May 29, 1984
    Date of Patent: November 26, 1985
    Assignee: OMI International Corporation
    Inventors: Stephen C. Barbieri, Linda J. Mayer
  • Patent number: 4411744
    Abstract: Electroplating baths for producing semi-bright, ductile, low stressed nickel deposits in an electrodeposition process utilizing insoluble anodes are disclosed. The nickel baths contain, in addition to nickel salts, ortho-formyl benzene sulfonic acid and perfluorocyclohexyl potassium sulfonate.
    Type: Grant
    Filed: August 16, 1982
    Date of Patent: October 25, 1983
    Assignee: Occidental Chemical Corporation
    Inventors: Donald R. Rosegren, Linda J. Mayer
  • Patent number: 4411965
    Abstract: A method of electrodepositing a gold alloy layer having improved corrosion protection is disclosed. Prior to the gold layer an underlayer of ductile, low-stress nickel is electrodeposited from a solution containing ortho-formyl benzene sulfonic acid and perfluorocyclohexyl potassium sulfonate.
    Type: Grant
    Filed: August 16, 1982
    Date of Patent: October 25, 1983
    Assignee: Occidental Chemical Corporation
    Inventors: Donald R. Rosegren, Linda J. Mayer
  • Patent number: 4401527
    Abstract: A process for the electrodeposition of palladium in which palladium is electrodeposited from an aqueous plating bath which contains a bath soluble palladium compound, an electrolyte compound and a nitrite compound in an amount sufficient to provide an excess of free nitrite ions relative to the palladium ions. In a preferred embodiment, the bath also contains a buffering agent to maintain the bath pH at from about 6.5 to 7.5. The electrodeposition is carried out using an insoluble anode, while maintaining the excess of free nitrite ions in the bath relative to the palladium ions. In this manner, the plating efficiency of the bath is maintained at a substantially constant, high level for extended periods of plating at current densities in excess of 10 amps per square decimeter.
    Type: Grant
    Filed: August 20, 1981
    Date of Patent: August 30, 1983
    Assignee: Occidental Chemical Corporation
    Inventors: Robert Duva, Linda J. Mayer
  • Patent number: 4381228
    Abstract: An electroplating bath for the high speed deposition of bright metallic tin utilizing tin fluoroborate and sulfuric acid as the electrolyte; wherein, in addition to certain other additives, the bath contains a perfluoroalkyl sulfonate wetting agent to promote anode corrosion. Brighteners used in the system include aromatic amines and aliphatic aldehydes. For certain purposes it may be advantageous to include boric acid as part of the electrolyte; and, in other instances, to use an aromatic sulfonic acid to enhance bath stability and brightness. The method for utilizing a bath containing tin fluoroborate in a sulfuric acid matrix containing these perfluoroalkyl sulfonate wetting agents is also described.
    Type: Grant
    Filed: June 16, 1981
    Date of Patent: April 26, 1983
    Assignee: Occidental Chemical Corporation
    Inventors: Robert J. Teichmann, Linda J. Mayer
  • Patent number: 4347107
    Abstract: Improved electroplating bath for depositing bright, metallic tin wherein divalent tin, in the form of stannous sulfate or fluoroborate, is present in conjunction with sulfuric or fluoroboric acid, brighteners including an aromatic amine and an aliphatic aldehyde, a polyalkylene ether surfactant, and an aromatic sulfonic acid to ensure bath stability as well as the requisite brightness. The divalent tin-containing electroplating bath may also be provided with copper or rhodium salts to achieve codeposition of tin with at least one of these alloying metals. The method of utilizing such divalent tin electroplating baths to plate substrates with bright metallic tin is also described and claimed.
    Type: Grant
    Filed: April 2, 1981
    Date of Patent: August 31, 1982
    Assignee: Hooker Chemicals & Plastics Corp.
    Inventors: Robert J. Teichmann, Linda J. Mayer
  • Patent number: 4336114
    Abstract: A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating electrolyte particularly suited for plating electronic circuit boards containing a brightening and leveling amount of a brightening and leveling system comprising (a) a bath soluble substituted phthalocyanine radical, (b) a bath soluble adduct of a tertiary alkyl amine with polyepichlorohydrin, (c) a bath soluble organic divalent sulfur compound, and (d) a bath soluble reaction product of polyethyleneimine and an alkylating agent which will alkylate the nitrogen on the polyethyleneimine to produce a quaternary nitrogen. The electrolyte optionally also contains bath soluble polyether compounds as a supplemental brightening agent.
    Type: Grant
    Filed: March 26, 1981
    Date of Patent: June 22, 1982
    Assignee: Hooker Chemicals & Plastics Corp.
    Inventors: Linda J. Mayer, Stephen C. Barbieri