Abstract: The concept of electromagnetic bandgaps (EBG) is used to develop a high quality filter that can be integrated monolithically with other components due to a reduced height, planar design. Coupling adjacent defect elements in a periodic lattice creates a filter characterized by ease of fabrication, high-Q performance, high port isolation and integrability to planar or 3-D circuit architectures. The filter proof of concept has been demonstrated in a metallodielectric lattice. The measured and simulated results of 2, 3 and 6 pole filters are presented at 10.7 GHz, along with the equivalent circuits.

Abstract: An integrated planar antenna including a metalized ground plane printed on a dielectric slab. One or more slot antenna elements are etched into the metalized layer, and resonate at a particular resonant frequency band. A plurality of voids extend through the slab and act to vary the dielectric constant of the slab so that resonant waves are suppressed in the slab, thus reducing power loss in the antenna. The voids can be selectively localized in the slab to provide various functions, such as impedance matching and reduction of antenna element coupling. The voids can take on any shape and configuration in accordance with a particular antenna design scheme so as to optimize the effective dielectric constant for a particular application. In one particular design, the voids are formed in a random manner completely through slab, and the voids have an opening diameter less than {fraction (1/20)}th of the operational wavelength of the antenna.

Abstract: A multifunction printed antenna for wireless and telematic applications. In one embodiment, GPS and satellite radio patch antenna elements are printed on one side of a printed circuit board and AMPS, PCS, GSM and terrestrial radio slot antenna elements are etched in a ground plane on an opposite side of the same printed circuit board. In an alternate embodiment, the GPS and satellite radio patch antenna elements are elements mounted on one printed circuit board and the AMPS, GSM, PCS and terrestrial radio slot antenna elements are etched in a ground plane on another printed circuit board rigidly secured orthogonal to the GPS and satellite printed circuit board. The AMPS, GSM and PCS circuit board can be curved to reduce the nulls at the edges of the circuit board. Further, the edge of the AMPS, GSM and PCS circuit board that contacts the GPS and satellite radio circuit board can have a saw-tooth pattern so that edge currents are reduced.

Abstract: An omni-directional printed antenna that includes at least two wound slot antenna elements. The spacing between the elements, the lengths of the elements and the feed location of the elements are selected to provide a desirable electromagnetic coupling between the elements that causes the narrow bandwidth of the individual elements to combine into a wide bandwidth while providing an omni-directional radiation pattern. Winding the elements together in this manner also allows different antennas for different frequency bands to be combined as a single antenna in a small space. Further, the printed antenna can be patterned on a copper tape to create a sticker type antenna that can be readily mounted on different surfaces.

Abstract: An integrated planar antenna including a metalized ground plane printed on a dielectric slab. One or more slot antenna elements are etched into the metalized layer, and resonate at a particular resonant frequency band. A plurality of voids extend through the slab and act to vary the dielectric constant of the slab so that resonant waves are suppressed in the slab, thus reducing power loss in the antenna. The voids can be selectively localized in the slab to provide various functions, such as impedance matching and reduction of antenna element coupling. The voids can take on any shape and configuration in accordance with a particular antenna design scheme so as to optimize the effective dielectric constant for a particular application. In one particular design, the voids are formed in a random manner completely through slab, and the voids have an opening diameter less than {fraction (1/20)}th of the operational wavelength of the antenna.

Abstract: A microwave and millimeter-wave electric-field mapping system based on electro-optic sampling has been developed using micromachined Gallium Arsenide crystals mounted on gradient index lenses and single-mode optical fibers. The probes are able to detect three orthogonal polarizations of electric fields and, due to the flexibility and size of the optical fiber, can be positioned not only from the extreme near-field to the far-field regions of microwave and millimeter-wave structures, but also inside of enclosures such as waveguides and packages. A microwave electric-field-mapping system based on micromachined GaAs electro-optic sampling probes mounted on gradient index lenses and single-mode optical fibers can extract field images from the interior of an enclosed microwave cavity.

Abstract: An omni-directional printed antenna that includes at least two wound slot antenna elements. The spacing between the elements, the lengths of the elements and the feed location of the elements are selected to provide a desirable electromagnetic coupling between the elements that causes the narrow bandwidth of the individual elements to combine into a wide bandwidth while providing an omni-directional radiation pattern. Winding the elements together in this manner also allows different antennas for different frequency bands to be combined as a single antenna in a small space. Further, the printed antenna can be patterned on a copper tape to create a sticker type antenna that can be readily mounted on different surfaces.

Abstract: Structures and methods that provide for via transitions between opposite sides of a high resistivity silicon micro-machined membrane substrate. The via transitions provide ground-signal-ground interconnection between coplanar waveguides disposed on opposite sides of substrate. Adjacent via transitions are anisotropically etched from opposite surfaces of the substrate to form the via transitions. The ground-signal-ground configuration provides RF impedance matching at the via transition.

Abstract: A planar antenna that includes a high dielectric constant superstrate lens having a plurality of air holes that vary the actual dielectric constant of the lens to provide an effective dielectric constant superstrate lens. The holes can take on any shape and configuration in accordance with a particular antenna design scheme so as to optimize the effective dielectric constant for a particular application. In one particular design, the holes are formed in a random manner completely through superstrate lens, and the holes have an opening diameter less than 1/20th of the operational wavelength of the antenna. The holes act to vary the dielectric constant of the superstrate lens so that the resonant waves do not form in the lens, thus reducing power loss in the antenna. The holes are formed by a suitable mechanical or laser drilling operation.

Abstract: A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of semi-conductor material having a recess and receiving a metallized layer therebeneath and a second wafer of semi-conductor material having a groove in a bottom face against which is received a metallized layer. The first wafer metallized face is then adhesively bonded to the second wafer on a surface opposite the metallized layer to which a circuit is affixed. The second wafer metallized face and metallized grooves cooperate with the first wafer metallized face to provide a shielded circuit cavity therebetween. Alternatively, the first or second wafer can be used alone to partially shield a circuit element.

Abstract: A high frequency micromachined filter assembly comprises at least one microresonator having at least one metal-lined resonance chamber and at least two openings. Input means couples an electromagnetic input signal to the resonance chamber through a first one of the openings. The output signal is coupled to output means from the resonance chamber through a second one of the openings. Dielectric material is arranged between the input means and the resonance chamber to maintain the resonator and the input means separated from one another. Dielectric material is arranged between the output means and the resonance chamber to maintain the resonator and the output means separated from one another.

Abstract: A micromachined self-packaged circuit provides at least partial shielding of a circuit element. Preferably, all the elements comprising a circuit are completely shielded between a first wafer of semi-conductor material having a recess and receiving a metallized layer therebeneath and a second wafer of semi-conductor material having a groove in a bottom face against which is received a metallized layer. The first wafer metallized face is then adhesively bonded to the second wafer on a surface opposite the metallized layer to which a circuit is affixed. The second wafer metallized face and metallized grooves cooperate with the first wafer metallized face to provide a shielded circuit cavity therebetween. Alternatively, the first or second wafer can be used alone to partially shield a circuit element.