Patents by Inventor Ling Chen

Ling Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137829
    Abstract: A method of wireless communication by a user equipment (UE) supporting multiple subscriptions, includes camping on a first cell of a first radio access technology (RAT) with a first data subscription, and camping on a second cell of a second RAT with a second data subscription. The method also includes triggering a transition to the first cell of the first RAT for the second data subscription. The method further includes performing, with the first data subscription, activities on behalf of the second data subscription.
    Type: Application
    Filed: May 5, 2021
    Publication date: April 25, 2024
    Inventors: Daowei LIN, Zengran WAN, Xin JIANG, Weifeng DENG, Boting WANG, Jun DENG, Hewu GU, Xiaochen CHEN, Zengyu HAO, Ling XIE, Tom CHIN, Zhongyue LOU, Bhupesh Manoharlal UMATT
  • Publication number: 20240136472
    Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Inventors: Chao-Hsing CHEN, Jia-Kuen WANG, Tzu-Yao TSENG, Tsung-Hsun CHIANG, Bo-Jiun HU, Wen-Hung CHUANG, Yu-Ling LIN
  • Publication number: 20240134268
    Abstract: A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chien-Cheng Chen, Huan-Ling Lee, Ta-Cheng Lien, Chia-Jen Chen, Hsin-Chang Lee
  • Publication number: 20240137649
    Abstract: An operation mode switching control method, an electronic device, and a computer-readable storage medium are provided. The electronic device includes a processor and a camera. An image sensor in the camera includes at least two operation modes. The operation mode switching control method includes: The processor sends a signal to the image sensor through an I2C interface, where the signal is used to control the image sensor to run in an operation mode corresponding to the signal.
    Type: Application
    Filed: April 25, 2022
    Publication date: April 25, 2024
    Applicant: Honor Device Co., Ltd.
    Inventors: Ling YE, Guoqiao CHEN
  • Patent number: 11965833
    Abstract: A detection device includes a frame, a transport mechanism, detection mechanisms, and a grasping mechanism. The transport mechanism includes a feeding line, a first flow line, and a second flow line arranged in parallel on the frame. The detection mechanisms are arranged on the frame and located on two sides of the transport mechanism. The grasping mechanism is arranged on the frame and used to transport workpieces on the feeding line to the detection mechanisms, transport qualified workpieces to the first flow line, and transport unqualified workpieces to the second flow line.
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: April 23, 2024
    Assignees: HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jing-Zhi Hou, Lin-Hui Cheng, Yan-Chao Ma, Jin-Cai Zhou, Zi-Long Ma, Neng-Neng Zhang, Yi Chen, Chen-Xi Tang, Meng Lu, Peng Zhou, Ling-Hui Zhang, Lu-Hui Fan, Shi-Gang Xu, Cheng-Yi Chao, Liang-Yi Lu
  • Patent number: 11968122
    Abstract: The present invention provides a joint optimization method and system for delay and spectrum occupation in a cloud-edge collaborative network. The method includes: initializing a cloud-edge collaborative network, and generating a set of user requests; establishing a target function of minimum average end-to-end delay and minimum spectrum slot occupation of a user request; during processing of each user request based on the target function, sequentially determining whether a node and path selection uniqueness constraint, a mobile edge computing (MEC) server load constraint, a spectrum resource occupation and uniqueness constraint, a spectrum continuity constraint, and a spectrum consistency constraint are satisfied, where if all constraints are satisfied, the user request is successfully processed, and the process turns to step S4; or if any constraint is not satisfied, the user request fails to be processed; and calculating average end-to-end delay and spectrum resource occupancy of the user request.
    Type: Grant
    Filed: October 11, 2021
    Date of Patent: April 23, 2024
    Assignee: SOOCHOW UNIVERSITY
    Inventors: Bowen Chen, Ling Liu, Ruixin Liang, Shoucui Wang, Qi Chen, Gangxiang Shen, Mingyi Gao, Weidong Shao, Hong Chen
  • Patent number: 11964409
    Abstract: A multi-shot moulding part structure includes a first structural part, an ink decoration layer, and a second structural part. The first structural part has a first area surface, a second area surface, and a joining surface located on the second area surface. The joining surface is non-parallel to the second area surface. The ink decoration layer is spread on the first area surface and the second area surface, but not on the joining surface. The second structural part is combined with the first structural part and covers the second area surface. The second structural part touches the joining surface. By the second structural part touching the joining surface of the first structural part that is not coated with the ink decoration layer, the structural bonding strength between the first structural part and the second structural part is enhanced.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: April 23, 2024
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Wen-Ching Lin, Ting-Yu Wang, Fa-Chih Ke, Yu-Ling Lin, Wen-Hsiang Chen
  • Patent number: 11966322
    Abstract: A method, computer program product and system are provided for preloading debug information based on the presence of incremental source code files. Based on parsed input parameters to a source code debugger, a source code repository and a local storage area are searched for an incremental file. In response to the incremental file being located, a preload indicator in the incremental file, which is a source code file, is set. Based on the preload indicator being set, debug symbol data from the incremental file is merged to a preload symbol list. In response to receiving a command to examine the debug symbol data from the incremental file, the preload symbol list is searched for the requested debug symbol data.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: April 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Xiao Ling Chen, Xiao Xuan Fu, Jiang Yi Liu, Zhan Peng Huo, Wen Ji Huang, Qing Yu Pei, Min Cheng, Yan Huang
  • Publication number: 20240124558
    Abstract: The embodiments of the present disclosure provide an antibody or antigen-binding fragment against SARS-CoV-2 spike(S) protein, comprising: three complementarity determining regions (HCDRs) of a heavy chain variable region or one or more variants thereof, the heavy chain variable region set forth as SEQ ID NO. 30 or SEQ ID NO. 46, each of the one or more variants having at most two amino acid changes compared to the corresponding CDR; and three complementarity determining regions (LCDRs) of a light chain variable region or one or more variants thereof, the light chain variable region set forth as SEQ ID NO. 32 or SEQ ID NO. 48, each of the one or more variants having at most two amino acid changes compared to the corresponding CDR.
    Type: Application
    Filed: December 20, 2023
    Publication date: April 18, 2024
    Applicant: ASSURE TECH. (HANGZHOU) CO., LTD.
    Inventors: Yiding CHEN, Xiangxi WANG, Ling ZHU, Yinan JIANG, Jingyun MIAO, Lili QIN, Pingju GE
  • Publication number: 20240123058
    Abstract: Provided are an epitope peptide (or a variant thereof) that can be used for preventing or treating an EBV infection, a recombinant protein containing the epitope peptide (or variant thereof) and a carrier protein, and the use of the epitope peptide (or variant thereof) and the recombinant protein. Further provided are an antibody against the epitope peptide, and the use thereof in the detection, prevention and/or treatment of an EBV infection and/or diseases caused by the infection.
    Type: Application
    Filed: January 29, 2022
    Publication date: April 18, 2024
    Inventors: Yixin CHEN, Xiao ZHANG, Junping HONG, Miao XU, Qian WU, Ling ZHONG, Ningshao XIA
  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240120313
    Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Publication number: 20240119283
    Abstract: A method of performing automatic tuning on a deep learning model includes: utilizing an instruction-based learned cost model to estimate a first type of operational performance metrics based on a tuned configuration of layer fusion and tensor tiling; utilizing statistical data gathered during a compilation process of the deep learning model to determine a second type of operational performance metrics based on the tuned configuration of layer fusion and tensor tiling; performing an auto-tuning process to obtain a plurality of optimal configurations based on the first type of operational performance metrics and the second type of operational performance metrics; and configure the deep learning model according to one of the plurality of optimal configurations.
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: MEDIATEK INC.
    Inventors: Jui-Yang Hsu, Cheng-Sheng Chan, Jen-Chieh Tsai, Huai-Ting Li, Bo-Yu Kuo, Yen-Hao Chen, Kai-Ling Huang, Ping-Yuan Tseng, Tao Tu, Sheng-Je Hung
  • Patent number: 11955430
    Abstract: A method of manufacturing a semiconductor device includes forming a first dielectric layer over a substrate, forming a metal layer in the first dielectric layer, forming an etch stop layer on a surface of the first dielectric layer and the metal layer, removing portions of the metal layer and the etch stop layer to form a recess in the metal layer, and forming a tungsten plug in the recess. The recess is spaced apart from a bottom surface of the etch stop layer.
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Hsuan Lin, Hsi Chung Chen, Ji-Ling Wu, Chih-Teng Liao
  • Publication number: 20240111956
    Abstract: Disclosed are a Nested Named Entity Recognition method based on part-of-speech awareness, system, device and storage medium therefor. The method uses a BiLSTM model to extract a feature of text word data in order to obtain a text word depth feature, and each text word of text to be recognized is initialized into a corresponding graph node, and a text heterogeneous graph of the text to be recognized is constructed according to a preset part-of-speech path, the text word data of the graph nodes is updated by an attention mechanism, and the features of all graph nodes of the text heterogeneous graph are extracted using the BiLSTM model, and a nested named entity recognition result is obtained after decoding and annotating. The present disclosure can recognize ordinary entities and nested entities accurately and effectively, and enhance the performance and advantages of the nested named entity recognition model.
    Type: Application
    Filed: November 28, 2023
    Publication date: April 4, 2024
    Inventors: Jing Qiu, Ling Zhou, Chengliang Gao, Rongrong Chen, Ximing Chen, Zhihong Tian, Lihua Yin, Hui Lu, Yanbin Sun, Junjun Chen, Dongyang Zheng, Fei Tang, Jiaxu Xing
  • Publication number: 20240111550
    Abstract: A computer-implemented process is disclosed. An application is loaded into a local address space. A request by the application to load a target shared library is intercepted by an interceptor. Using the interceptor and based upon the request being intercepted, a shared library correlation table is searched for a loading count and a loading policy associated with the target shared library. Based upon the loading count and the loading policy, a selection is made between loading the target shared library as a shared library container, and loading the target shared library into the local address space. The target shared library is loaded based upon the selecting. The loading count represents a number of times the target shared library was loaded, and the loading policy indicates how the target shared library is to be loaded.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Heng Wang, Xiao Ling Chen, Xin Peng Liu, Tao Guan, Wei Wu
  • Publication number: 20240113002
    Abstract: The present technology can include a semiconductor device assembly comprising an RDL with a top surface and a side surface intersecting the top surface. The assembly can further comprise a semiconductor device coupled to the top surfaces, and a mold material encasing the semiconductor device (when included) and directly coupled to at least a portion of the top surface and the side surface of the RDL. In other embodiments, the assembly can comprise an RDL with a top surface, a bottom surface opposite thereto, and a sloped side surface extending between the top surface and the bottom surface. The assembly similarly can further comprise a semiconductor device coupled to the top surface, and a mold material encasing the semiconductor device and directly coupled to at least a portion of the top surface and the side surface of the RDL.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Inventors: Ya Ling Huang, Jong Sik Paek, Lihao Lyu, Syuan-Ye Chen
  • Publication number: 20240110200
    Abstract: A recombinant AAV vector including a sequence for introducing the expression of G protein-coupled receptor 173 (GPR173) and specifically targeting GPR173 expressing neurons in a brain is provided. A method of restoring the excitatory/inhibitory (E/I) balance in brain or for prophylaxis and/or therapy of a neurological condition in a subject in need thereof by administrating the recombinant AAV vector or a GPR173 agonist to the subject is also provided.
    Type: Application
    Filed: September 27, 2022
    Publication date: April 4, 2024
    Inventors: Jufang He, Ling He, Heng Shi, Yujie Yang, Ge Zhang, Xi Chen, Ezra Yoon, Siuhin Lau
  • Patent number: D1024096
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: April 23, 2024
    Assignee: LEMON INC.
    Inventors: Ling Zhong, Yue Chen