Patents by Inventor Lingli Duan

Lingli Duan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11761107
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: September 19, 2023
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Patent number: 11732374
    Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: August 22, 2023
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Publication number: 20230083562
    Abstract: A system, method, and apparatus for observing member behavior and managing a care gap associated with the member are proided that include: determining a current gap-in-care for the member by: receiving an electronic record associated with the member that describes a current health-related behavior of the member; receiving guideline behavior for the member supported by a professional clinical recommendation; and determining a difference between the current health-related behavior of the member and the guideline behavior for the member. Some examples of the system, method, and apparatus may include determining, for a current gap-in-care for the member, actions that, if followed, are capable of at least partially closing the current gap-in-care within a clinically-defined period of time for the member; determining an impact associated with at least partially closing the current gap-in-care for the member according to the actions; and providing a communication to the member that describes the actions.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 16, 2023
    Inventors: Eli Goldberg, Lauren Lamonica, Paul Raff, Michael Turner, Eugenio Zuccarelli, Lingli Duan
  • Publication number: 20230080313
    Abstract: A system, method, and apparatus for managing care gaps associated with a member are provided. The method may include determining a plurality of current gaps-in-care for the member, where each of the plurality of current gaps-in-care for the member is defined as a difference between a current health-related behavior of the member and a guideline behavior for the member; determining for each of the plurality of current gaps-in-care for the member a potential expected value to be captured by reducing the difference; selecting a current gap-in-care from among the plurality of gaps-in-care as a gap-to-address, where the current gap-in-care is selected based on having a higher potential value as compared to at least one other gap-in-care among the plurality of gaps-in-care; and communicating one or more actions for the member to take in connection with at least partially closing the gap-in-care.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 16, 2023
    Inventors: Eli Goldberg, Lauren Lamonica, Paul Raff, Michael Turner, Eugenio Zuccarelli, Lingli Duan
  • Publication number: 20210205052
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: February 4, 2020
    Publication date: July 8, 2021
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen CHEN, Maria RZEZNIK
  • Patent number: 10892802
    Abstract: A method of providing spatial diversity for critical data delivery in a beamformed mmWave small cell is proposed. The proposed spatial diversity scheme offers duplicate or incremental data/signal transmission and reception by using multiple different beams for the same source and destination. The proposed spatial diversity scheme can be combined with other diversity schemes in time, frequency, and code, etc. for the same purpose. In addition, the proposed spatial diversity scheme combines the physical-layer resources associated with the beams with other resources of the same or different protocol layers. By spatial signaling repetition to avoid Radio Link Failure (RLF) and Handover Failure (HOF), mobility robustness can be enhanced. Mission-critical and/or time-critical data delivery can also be achieved without relying on retransmission.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: January 12, 2021
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 10738388
    Abstract: Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: August 11, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Patent number: 10738039
    Abstract: Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: August 11, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Publication number: 20200179087
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: February 4, 2020
    Publication date: June 11, 2020
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen CHEN, Maria RZEZNIK
  • Patent number: 10662541
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 26, 2020
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Publication number: 20200149176
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Application
    Filed: January 17, 2020
    Publication date: May 14, 2020
    Inventors: Weijing LU, Lingli DUAN, Zukhra NIAZIMBETOVA, Chen Chen, Maria RZEZNIK
  • Publication number: 20200149175
    Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
    Type: Application
    Filed: January 17, 2020
    Publication date: May 14, 2020
    Inventors: Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 10604858
    Abstract: Copper electroplating baths include reaction products of amines, polyacrylamides and sultones. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 31, 2020
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Patent number: 10604856
    Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: March 31, 2020
    Assignees: Rohm and Haas Electronics Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 10590556
    Abstract: A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: March 17, 2020
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Lingli Duan, Zukhra Niazimbetova, Chen Chen, Maria Rzeznik
  • Publication number: 20200031818
    Abstract: A method of providing spatial diversity for critical data delivery in a beamformed mmWave small cell is proposed. The proposed spatial diversity scheme offers duplicate or incremental data/signal transmission and reception by using multiple different beams for the same source and destination. The proposed spatial diversity scheme can be combined with other diversity schemes in time, frequency, and code, etc. for the same purpose. In addition, the proposed spatial diversity scheme combines the physical-layer resources associated with the beams with other resources of the same or different protocol layers. By spatial signaling repetition to avoid Radio Link Failure (RLF) and Handover Failure (HOF), mobility robustness can be enhanced. Mission-critical and/or time-critical data delivery can also be achieved without relying on retransmission.
    Type: Application
    Filed: April 28, 2015
    Publication date: January 30, 2020
    Inventors: Lingli DUAN, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 10435380
    Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: October 8, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Publication number: 20190100499
    Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.
    Type: Application
    Filed: October 11, 2018
    Publication date: April 4, 2019
    Inventors: Lingli DUAN, Chen CHEN, Shaoguang FENG, Zhkhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
  • Patent number: 10196751
    Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 5, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Zuhra I. Niazimbetova, Chen Chen, Tong Sun, Maria Rzeznik
  • Patent number: 10201097
    Abstract: Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: February 5, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Yang Li, Tong Sun, Shaoguang Feng, Chen Chen, Zuhra Niazimbetova, Maria Rzeznik