Abstract: An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

Abstract: The present disclosure provides a flexible display device and a preparation method thereof. The flexible display device has different base materials and adhesives for the back supporting film at the bonding region and the non-bonding region, so that it can satisfy the requirements for AOI and bending resistance respectively, and can be advantageous for a patterning step for base material including subtractive manufacturing.

Abstract: The disclosure provides a method of manufacturing an encapsulation layer and a display substrate. The method of manufacturing the encapsulation layer includes: forming a strippable layer on a first region of a substrate; forming an organic material layer on a second region of the substrate, the organic material layer comprising a portion covering the second region and an overflow portion exceeding the second region and at least partially covering the first region, wherein the first region and the second region are adjoined to each other; and stripping the strippable layer from the substrate to remove the overflow portion of the organic material layer and form an organic encapsulation layer.

Abstract: A display panel is provided which comprises a substrate, a backboard, and an electroluminescent device layer, which are stacked in sequence, the electroluminescent device layer having a hole at a display region of the display panel, a laser protection layer is provided on a periphery of the hole of the electroluminescent device layer.

Abstract: A display substrate and a preparation method thereof, a display device and a preparation method thereof and a display apparatus are proposed in the disclosure. The preparation method of the display substrate includes: providing a flexible base, an upper surface thereof having a display area and a circuit connection area, and a portion of the flexible base including a bending portion and a connection portion; disposing a groove on the lower surface, and an orthographic projection of the groove on the upper surface corresponding to a position of an orthographic projection of the bending portion on the upper surface; disposing a back plate, an OLED light emitting device and a package structure in a sequence on the display area, and disposing a circuit connection layer on the circuit connection area. Bending the bending portion downward to extend, the connection portion is located on a side of the lower surface.

Abstract: A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.

Abstract: A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.

Abstract: An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.

Abstract: A display panel is provided which comprises a substrate, a backboard, and an electroluminescent device layer, which are stacked in sequence, the electroluminescent device layer having a hole at a display region of the display panel, a laser protection layer is provided on a periphery of the hole of the electroluminescent device layer.

Abstract: The present disclosure relates to the field of display panel technology. An embodiment of the present disclosure provides a back film for a flexible display panel, a flexible display panel and fabrication method thereof, where the back film comprises a base material having an elastic modulus of 6 to 10 GPa and a breaking elongation of 5% to 20%. An embodiment of the present disclosure is used in manufacture of the display panel.

Abstract: A display panel. The display panel includes a base substrate; a plurality of light emitting elements on the base substrate; and an encapsulating structure encapsulating the plurality of light emitting elements. The encapsulating structure includes a first inorganic encapsulating sublayer; a first organic encapsulating sublayer; and a first amphiphilic cross-linking sublayer between the first inorganic encapsulating sublayer and the first organic encapsulating sublayer.

Abstract: The disclosure provides a method of manufacturing an encapsulation layer and a display substrate. The method of manufacturing the encapsulation layer includes: forming a strippable layer on a first region of a substrate; forming an organic material layer on a second region of the substrate, the organic material layer comprising a portion covering the second region and an overflow portion exceeding the second region and at least partially covering the first region, wherein the first region and the second region are adjoined to each other; and stripping the strippable layer from the substrate to remove the overflow portion of the organic material layer and form an organic encapsulation layer.

Abstract: A display substrate and a preparation method thereof, a display device and a preparation method thereof and a display apparatus are proposed in the disclosure. The preparation method of the display substrate includes: providing a flexible base, an upper surface thereof having a display area and a circuit connection area, and a portion of the flexible base including a bending portion and a connection portion; disposing a groove on the lower surface, and an orthographic projection of the groove on the upper surface corresponding to a position of an orthographic projection of the bending portion on the upper surface; disposing a back plate, an OLED light emitting device and a package structure in a sequence on the display area, and disposing a circuit connection layer on the circuit connection area. Bending the bending portion downward to extend, the connection portion is located on a side of the lower surface.

Abstract: The present disclosure relates to the field of display panel technology. An embodiment of the present disclosure provides a back film for a flexible display panel, a flexible display panel and fabrication method thereof, where the back film comprises a base material having an elastic modulus of 6 to 10 GPa and a breaking elongation of 5% to 20%. An embodiment of the present disclosure is used in manufacture of the display panel.

Abstract: A display area drilling and packaging structure includes a back plate assembly, an emitting layer having a drilling area, and a hot melted adhesive layer. The emitting layer is disposed on the back plate assembly, and an annular cutting groove surrounding the drilling is disposed on the emitting layer. The hot melted adhesive layer at least covers an edge of a mouth of the annular cutting groove away from a center. A packaging layer is disposed on the back plate assembly, the hot melted adhesive layer, and the emitting layer.