Abstract: A method for setting or monitoring operating parameters of a workpiece processing machine having a tool holder and means for moving a workpiece and the holder relative to one another along a first axis. During milling of the holder fitted with a workpiece and during application of the tool to a workpiece, values for at least one measured variable are registered and recorded. The variables include an axial force acting in a direction parallel to the first axis, a torque relative to the first axis or to an axis oriented parallel to the first axis, and bending torques or bending torque components according to direction and amount. The values are used to set the operating parameters with respect to an extended service life of the tool in conjunction with a processing time falling below a maximum machining time, monitoring tool wear or a machine error.

Abstract: A method for setting or monitoring operating parameters of a workpiece processing machine having a tool holder and means for moving a workpiece and the holder relative to one another along a first axis. During milling of the holder fitted with a workpiece and during application of the tool to a workpiece, values for at least one measured variable are registered and recorded. The variables include an axial force acting in a direction parallel to the first axis, a torque relative to the first axis or to an axis oriented parallel to the first axis, and bending torques or bending torque components according to direction and amount. The values are used to set the operating parameters with respect to an extended service life of the tool in conjunction with a processing time falling below a maximum machining time, monitoring tool wear or a machine error.

Abstract: A method of manufacturing a chip card, such as a dual interface card, is provided. The method generally includes collocating multiple card support sheets one onto the other, depositing a conductive adhesive onto contact pads on at least one of the sheets, positioning a dual interface module in a recess established in at least one of the sheets, and executing a lamination step.

Abstract: A winding core (WC) having a tubular body portion (B) and two ends is mounted by one of its ends to a module tape (MT), a module antenna (MA) is wound around the winding core (WC), a chip (CM) is disposed on the module tape (MT) within the winding core (WC). Connections (wb) are made, and glob-top (GT) is applied over the chip (CM), substantially filling the interior area of the winding core (WC). The module antenna (MA), winding core (WC) and chip (CM) may subsequently be overmolded with a mold mass (MM). The winding core (WC) may have a flange (F) at one end. Using the module antenna (MA) itself as a dam for the glob-top is disclosed. Double-sided and single-sided module tapes (MT) having vias, openings, or vias and openings are disclosed.

Abstract: The invention relates to a tensioning device (15) for an endless transport belt (14), whereby the tensioning device (15) comprises two tensioning edges (16) around which the transport belt (14) is deflectable, and at least one spring section (26, 26?) integrally formed with the tensioning edges (16) and arranged between the two tensioning edges (16). This tensioning device (15) can be provided with a transport belt (14) and used in an automatic gripper system (1).

Abstract: A winding core (WC) having a tubular body portion (B) and two ends is mounted by one of its ends to a module tape (MT), a module antenna (MA) is wound around the winding core (WC), a chip (CM) is disposed on the module tape (MT) within the winding core (WC). Connections (wb) are made, and glob-top (GT) is applied over the chip (CM), substantially filling the interior area of the winding core (WC). The module antenna (MA), winding core (WC) and chip (CM) may subsequently be overmolded with a mold mass (MM). The winding core (WC) may have a flange (F) at one end. Using the module antenna (MA) itself as a dam for the glob-top is disclosed. Double-sided and single-sided module tapes (MT) having vias, openings, or vias and openings are disclosed.

Abstract: The invention relates to a tensioning device (15) for an endless transport belt (14), whereby the tensioning device (15) comprises two tensioning edges (16) around which the transport belt (14) is deflectable, and at least one spring section (26, 26?) integrally formed with the tensioning edges (16) and arranged between the two tensioning edges (16). This tensioning device (15) can be provided with a transport belt (14) and used in an automatic gripper system (1).

Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.

Abstract: A coupling device is formed by a continuous conductive path having a central section and two extremity sections, the central section forming at least a small spiral for inductive coupling with the transponder device, the extremities sections forming each one large spiral for inductive coupling with the reader device, wherein the small spiral shows a larger pitch than the ones of the large spirals, and wherein the two extremities of the continuous path are loose such that the coupling device forms an open circuit. The pitches of the large spirals are chosen such as that the interturn stray capacitances is important and that the large spirals have mainly a capacitive behavior. And the pitch of the small spiral is chosen such as that the interturn stray capacitances are negligible, and that the small spiral has mainly an inductive behavior.

Abstract: A coupling device is formed by a continuous conductive path having a central section and two extremity sections, the central section forming at least a small spiral for inductive coupling with the transponder device, the extremities sections forming each one large spiral for inductive coupling with the reader device, wherein the small spiral shows a larger pitch than the ones of the large spirals, and wherein the two extremities of the continuous path are loose such that the coupling device forms an open circuit. The pitches of the large spirals are chosen such as that the interturn stray capacitances is important and that the large spirals have mainly a capacitive behaviour. And the pitch of the small spiral is chosen such as that the interturn stray capacitances are negligible, and that the small spiral has mainly an inductive behaviour.

Abstract: A method for manufacturing a dual interface card includes at least the following step: collocating multiple card support sheets one onto the other, some of these sheets showing holes, in order to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess depositing a conductive adhesive onto the contact pads positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive executing one single lamination step of the sheets with the module in order to: laminate the multiple layers together in order to form the card body embed the dual interface module in the recess and achieve the curing of the isotropic conductive adhesive and the permanent electrical contact between the antenna and the dual interface module.

Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.