Abstract: The present invention provides a kit and method for package-to-package conversion of a pick and place handler. An input arm assembly is provided with interchangeable vacuum leads such that package-to-package conversion only requires replacing the vacuum lead with a different size vacuum lead. An input/output shuttle plate is provided comprising a block and base plate. The block has a plurality of pocket groupings and a two or more alignment hole groupings. The base plate has two or more alignment pins. Package-to-package conversion is achieved by changing which alignment hole in each alignment hole grouping is set on the alignment pins, thereby selecting the pocket in each pocket grouping corresponding to the alignment hole used. A soak plate is provided having an array of pocket groupings, wherein each pocket grouping has the same pattern of different size/shape pockets to accommodate different packages.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: The present invention provides a kit and method for package-to-package conversion of a pick and place handler. An input arm assembly is provided with interchangeable vacuum leads such that package-to-package conversion only requires replacing the vacuum lead with a different size vacuum lead. An input/output shuttle plate is provided comprising a block and base plate. The block has a plurality of pocket groupings and a two or more alignment hole groupings. The base plate has two or more alignment pins. Package-to-package conversion is achieved by changing which alignment hole in each alignment hole grouping is set on the alignment pins, thereby selecting the pocket in each pocket grouping corresponding to the alignment hole used. A soak plate is provided having an array of pocket groupings, wherein each pocket grouping has the same pattern of different size/shape pockets to accommodate different packages.

Abstract: A new method and apparatus is provided to quickly and reliably position, connect and dock a handler plate with a test head plate of a Universal Docking System. A handler plate is provided with roller assemblies while a test head plate is provided with matching receiver block assemblies. The roller assemblies are aligned with and partially inserted into the receiver block assemblies. Part of the roller assembly is mechanically engaged by the receiver block assembly, a mechanical linkage between an operator handle and the receiver block assembly allows the operator to complete the locking of the test head plate with the handler plate thereby at the same time establishing electrical contacts between arrays of pins that are mounted on surfaces of the handler base plate and the test head.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: A new method and apparatus is provided to quickly and reliably position, connect and dock a handler plate with a test head plate of a Universal Docking System. A handler plate is provided with roller assemblies while a test head plate is provided with matching receiver block assemblies. The roller assemblies are aligned with and partially inserted into the receiver block assemblies. Part of the roller assembly is mechanically engaged by the receiver block assembly, a mechanical linkage between an operator handle and the receiver block assembly allows the operator to complete the locking of the test head plate with the handler plate thereby at the same time establishing electrical contacts between arrays of pins that are mounted on surfaces of the handler base plate and the test head.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: An apparatus was described which allows accurate and fast positioning of device kits for the input shuttle, the output shuttle, the docking plates, hot plate and testing stations within the semiconductor device manufacturing and testing applications for Ball Grid Array sockets. A method was highlighted by means of which the sockets in these shuttles and plates can be adapted to different sizes and different types of semiconductor devices. A pick up shaft described resulted in added flexibility within the semiconductor device manufacturing and testing environment.

Abstract: A method and apparatus for handling small semiconductor devices in the testing of these devices. Multiple devices are mounted within a device strip carrier and are positioned in the testing position. This positioning of the device strip carriers is performed using device strip carrier alignment tools; the device strip carrier can readily be repositioned with respect to the test head/probe card for testing of multiple devices contained within the device strip carrier.

Abstract: An arrangement of three plates where the top plate interfaces with the BGA device, the center plate has a structure of channels or openings which is matched with the size and ball pitch of the BGA device that is being handled while the bottom plate interfaces with the tester or target plate. A plurality of center plates is provided to match and equal the plurality of BGA devices that is handled in the BGA testing or BGA semiconductor-manufacturing environment.

Abstract: A new probe socket is provided that allows for high speed and dependable contacting of points of contact on the Device Under Test. The new probe socket is aimed at a testing environment where semiconductor devices are mounted on device or package strips.