Patents by Inventor Lipkong Yap

Lipkong Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10444639
    Abstract: A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for the exposure of a current layer of the sample to generate a full-field reference overlay signature, identify one or more alignment fields of the set of correctable fields, generate an alignment-correctable signature by modeling alignment corrections for the set of correctable fields, subtract the alignment-correctable signature from the full-field reference overlay signature to generate feedforward overlay corrections for the current layer when the one or more overlay reference layers are the same as the one or more alignment reference layers, generate lithography tool corrections based on the feedforward overlay corrections, and provide the lithography tool corrections for the current layer to the lithography tool.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: October 15, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Onur Nihat Demirer, William Pierson, Mark D. Smith, Jeremy S. Nabeth, Miguel Garcia-Medina, Lipkong Yap
  • Publication number: 20180253016
    Abstract: A process control system includes a controller configured to generate a reference overlay signature based on one or more overlay reference layers of a sample, extrapolate the reference overlay signature to a set of correctable fields for the exposure of a current layer of the sample to generate a full-field reference overlay signature, identify one or more alignment fields of the set of correctable fields, generate an alignment-correctable signature by modeling alignment corrections for the set of correctable fields, subtract the alignment-correctable signature from the full-field reference overlay signature to generate feedforward overlay corrections for the current layer when the one or more overlay reference layers are the same as the one or more alignment reference layers, generate lithography tool corrections based on the feedforward overlay corrections, and provide the lithography tool corrections for the current layer to the lithography tool.
    Type: Application
    Filed: December 15, 2017
    Publication date: September 6, 2018
    Inventors: Onur Nihat Demirer, William Pierson, Mark D. Smith, Jeremy S. Nabeth, Miguel Garcia-Medina, Lipkong Yap
  • Patent number: 8192534
    Abstract: Devices and systems for capturing and removing accumulated gas bubbles in a liquid-carrying line wherein the device is an expanded double-layered chamber designed and adapted to be integrally placed within the flow pathway of a liquid-carrying line. The device allows insertion of tubes and wires through the device while in use without occlusion of the fluid flow path and without interruption of the bubble-removing function. The efficiency of the air venting and bubble-removing process is not dependent on the fluid flow rate under stable flow conditions, and the device works to remove air bubbles under a range of orientations.
    Type: Grant
    Filed: October 13, 2007
    Date of Patent: June 5, 2012
    Inventors: Neema Hekmat, Lipkong Yap
  • Publication number: 20100218679
    Abstract: Devices and systems for capturing and removing accumulated gas bubbles in a liquid-carrying line wherein the device is an expanded double-layered chamber designed and adapted to be integrally placed within the flow pathway of a liquid-carrying line. The device allows insertion of tubes and wires through the device while in use without occlusion of the fluid flow path and without interruption of the bubble-removing function. The efficiency of the air venting and bubble-removing process is not dependent on the fluid flow rate under stable flow conditions, and the device works to remove air bubbles under a range of orientations.
    Type: Application
    Filed: October 13, 2007
    Publication date: September 2, 2010
    Inventors: Neema Hekmat, Lipkong Yap
  • Publication number: 20060079923
    Abstract: A device for occluding an aneurysm comprising: a detachable, semi-compliant, radially-expanding balloon mounted on a catheter, wherein the balloon is in fluid communication with the catheter, wherein the balloon comprises a plurality of micropores, and wherein the micropores in the balloon allow expression of a bio-adhesive fluid at a defined pressure from the inside to the outside of the balloon.
    Type: Application
    Filed: August 9, 2005
    Publication date: April 13, 2006
    Inventors: Manik Chhabra, Neema Hekmat, Peter Johnson, Amy Lee, Lipkong Yap