Patents by Inventor Liqiang Cao
Liqiang Cao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071873Abstract: The present invention discloses a package structure for reducing warpage of plastic package wafer, including an adapter board, a chip mounted on the adapter board, and a first plastic package layer covering the chip, through-silicon-vias are disposed on the adapter board, the first and second surfaces of the adapter board are respectively provided with external connection solder balls and/or external connection solder pads electrically connected with the through-silicon-vias. The process of manufacturing the package structure includes: after the first surface process of the adapter board is completed, bonding the first carrier on its first surface, then cutting the first carrier to expose the chip-mounting area, and then carrying out subsequent processes such as chip mounting, and finally cutting and removing the first carrier to complete the package.Type: ApplicationFiled: March 5, 2021Publication date: February 29, 2024Applicants: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD, SHANGHAI XIANFANG SEMICONDUCTOR CO., LTDInventors: Liqiang CAO, Cheng XU, Peng SUN, Fei GENG
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Patent number: 11854794Abstract: A method for cleaning a through via including the following steps is provided: heating a cleaning fluid to a predetermined temperature; mixing the cleaning liquid with an inert gas and entering into a cleaning cavity; atomizing the cleaning liquid in an atomizer to spray on a wafer surface and to wet an inner wall and a bottom of the through via; and closing a cleaning liquid valve.Type: GrantFiled: December 18, 2018Date of Patent: December 26, 2023Assignee: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.Inventors: Daping Yao, Liqiang Cao
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Publication number: 20230257827Abstract: A compound for forming a conjugate with an active agent such as an oligonucleotide having a structure represented by Formula (321). The present disclosure also provides a corresponding conjugate. The conjugate of the present disclosure can specifically target hepatocytes, thereby effectively solve the problems associated with delivery of oligonucleotide drugs in vivo, and have low toxicity and excellent delivery efficiency while maintaining high stability for the delivered oligonucleotide.Type: ApplicationFiled: March 9, 2023Publication date: August 17, 2023Applicant: SUZHOU RIBO LIFE SCIENCE CO., LTD.Inventors: Hongyan ZHANG, Zhiwei YANG, Liqiang CAO, Liangyi WAN
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Patent number: 11633482Abstract: A compound for forming a conjugate with an active agent such as an oligonucleotide having a structure represented by Formula (321). The present disclosure also provides a corresponding conjugate. The conjugate of the present disclosure can specifically target hepatocytes, thereby effectively solve the problems associated with delivery of oligonucleotide drugs in vivo, and have low toxicity and excellent delivery efficiency while maintaining high stability for the delivered oligonucleotide.Type: GrantFiled: November 29, 2018Date of Patent: April 25, 2023Assignee: SUZHOU RIBO LIFE SCIENCE CO., LTD.Inventors: Hongyan Zhang, Zhiwei Yang, Liqiang Cao, Liangyi Wan
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Publication number: 20230091513Abstract: A wafer-level chip structure, a multiple-chip stacked and interconnected structure and a fabricating method thereof, wherein the wafer-level chip structure includes: a through-silicon via, which penetrates a wafer; a first surface including an active region, a multi-layered redistribution layer and a bump; and a second surface including an insulation dielectric layer, and a frustum transition structure connected with the through-silicon via. In an embodiment of the present application, a frustum type impedance transition structure is introduced into a position between a TSV exposed area on a backside of a wafer and a UBM so as to implement an impedance matching between TSV and UBM, thereby alleviating the problem of signal distortion that is caused by an abrupt change of impedance.Type: ApplicationFiled: March 5, 2021Publication date: March 23, 2023Applicants: SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD., NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.Inventors: Liqiang CAO, Yangyang YAN, Peng SUN, Tianfang CHEN, Fengwei DAI
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Publication number: 20230076803Abstract: Disclosed is a compound with a structure as shown in Formula (101) and a corresponding drug conjugate, wherein the drug conjugate can be specifically targeted at cells and has a low toxicity and an excellent delivery efficiency.Type: ApplicationFiled: August 28, 2020Publication date: March 9, 2023Applicant: SUZHOU RIBO LIFE SCIENCE CO., LTD.Inventors: Hongyan ZHANG, Zhiwei YANG, Shan GAO, Liqiang CAO, Guocheng LIU
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Publication number: 20220115356Abstract: The present application discloses a fan-out packaging structure and a packaging method for a chip. The structure includes first and second chips with oppositely fitted bottoms; metal terminals distributed around the first chip, one side of the metal terminals being on a same plane with the front of the first chip; a lead connected between the front of the second chip and the other side of the metal terminal; a packaging layer for packaging the first chip, the second chip, the lead the metal terminals; and a lead-out layer disposed on a first surface of the packaging layer and electrically connected to one side of the metal terminals and/or the front of the first chip.Type: ApplicationFiled: October 8, 2019Publication date: April 14, 2022Applicant: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.Inventors: Peng SUN, Yulong REN, Liqiang CAO
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Publication number: 20210296115Abstract: A method for cleaning a through via including the following steps is provided: heating a cleaning fluid to a predetermined temperature; mixing the cleaning liquid with an inert gas and entering into a cleaning cavity; atomizing the cleaning liquid in an atomizer to spray on a wafer surface and to wet an inner wall and a bottom of the through via; and closing a cleaning liquid valve.Type: ApplicationFiled: December 18, 2018Publication date: September 23, 2021Applicant: NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.Inventors: Daping YAO, Liqiang CAO
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Publication number: 20210223122Abstract: The present invention discloses a stress sensor structure and a manufacturing method thereof, wherein the stress sensor structure comprises: a substrate; a blind-hole, provided on a first surface of the substrate; a first piezoresistive layer and a second piezoresistive layer, formed by material with piezoresistive effect, provided on a lateral wall of the blind-hole and interconnected at bottom portions of the layers; a second insulating layer, provided between the first piezoresistive layer and the second piezoresistive layer; a first electrode, provided on the first surface of the substrate and connected to the first piezoresistive layer; a second electrode, provided on the first surface of the substrate and connected to the second piezoresistive layer.Type: ApplicationFiled: November 24, 2017Publication date: July 22, 2021Inventors: Wen Yin, Heng Yang, Chuanguo Dou, Wenqi Zhang, Tingyu Lin, Liqiang Cao
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Patent number: 11067459Abstract: The present invention discloses a stress sensor structure and a manufacturing method thereof, wherein the stress sensor structure comprises: a substrate; a blind-hole, provided on a first surface of the substrate; a first piezoresistive layer and a second piezoresistive layer, formed by material with piezoresistive effect, provided on a lateral wall of the blind-hole and interconnected at bottom portions of the layers; a second insulating layer, provided between the first piezoresistive layer and the second piezoresistive layer; a first electrode, provided on the first surface of the substrate and connected to the first piezoresistive layer; a second electrode, provided on the first surface of the substrate and connected to the second piezoresistive layer.Type: GrantFiled: November 24, 2017Date of Patent: July 20, 2021Assignee: NATIONAL CENTER FOR ADVANCED PACKAGEInventors: Wen Yin, Heng Yang, Chuanguo Dou, Wenqi Zhang, Tingyu Lin, Liqiang Cao
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Publication number: 20200338201Abstract: A compound for forming a conjugate with an active agent such as an oligonucleotide having a structure represented by Formula (321). The present disclosure also provides a corresponding conjugate. The conjugate of the present disclosure can specifically target hepatocytes, thereby effectively solve the problems associated with delivery of oligonucleotide drugs in vivo, and have low toxicity and excellent delivery efficiency while maintaining high stability for the delivered oligonucleotide.Type: ApplicationFiled: November 29, 2018Publication date: October 29, 2020Inventors: Hongyan Zhang, Zhiwei Yang, Liqiang Cao, Liangyi Wan
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Patent number: 9520942Abstract: The present disclosure provides a millimeter-wave waveguide communication system. The millimeter-wave waveguide communication system may comprise: a clock component, and at least two sets of millimeter-wave receiving/transmitting channels. The clock component is configured to provide a clock signal to sending ends and receiving ends of the two sets of millimeter-wave receiving/sending channels respectively. Each set of millimeter-wave receiving/sending channels comprises: a transmitter component, a receiver component and a transmission waveguide. The transmission waveguide is located between the transmitter component and the receiver component and is configured to provide a channel for millimeter-wave transmission. The top face, side face and/or bottom face of the transmission waveguide, except for active devices and accessories thereof, are plated with a metal conductive wall to form an electromagnetic shield from a transmission waveguide in an adjacent millimeter-wave receiving/sending channel.Type: GrantFiled: February 24, 2012Date of Patent: December 13, 2016Assignee: Institute of Microelectronics, Chinese Academy of SciencesInventors: Liqiang Cao, Qidong Wang, Daniel Guidotti
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Patent number: 8433347Abstract: The present invention relates to a method and apparatus for verifying a network management short message of a wireless public phone. The method comprises: receiving a network management short message containing a sending party number, a sending party short message center number and a short message content; comparing the sending party number with a pre-stored number; when the sending party number is consistent with the pre-stored number, comparing the sending party short message center number with a pre-stored short message center number; when the sending party short message center number is consistent with the pre-stored short message center number, comparing the short message content in the network management short message with a pre-stored short message content; and when the short message content in the network management short message is consistent with the pre-stored short message content, confirming that the verification of the network management short message succeeds.Type: GrantFiled: October 19, 2010Date of Patent: April 30, 2013Assignee: ZTE CorporationInventor: Liqiang Cao
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Publication number: 20130072238Abstract: The present invention relates to a method and apparatus for verifying a network management short message of a wireless public phone. The method comprises: receiving a network management short message containing a sending party number, a sending party short message center number and a short message content; comparing the sending party number with a pre-stored number; when the sending party number is consistent with the pre-stored number, comparing the sending party short message center number with a pre-stored short message center number; when the sending party short message center number is consistent with the pre-stored short message center number, comparing the short message content in the network management short message with a pre-stored short message content; and when the short message content in the network management short message is consistent with the pre-stored short message content, confirming that the verification of the network management short message succeeds.Type: ApplicationFiled: October 19, 2010Publication date: March 21, 2013Applicant: ZTE CORPORATIONInventor: Liqiang Cao
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Publication number: 20100317714Abstract: The present invention provides a complex molecule interfering the expression of target genes and the methods for preparing the complex molecule, wherein the complex molecule contains two siRNA strands X1 and X2 having at least 80% complementarity, the 5? end of X1 and 3? end of X2 are linked through non-nucleic acid molecule L1, the 5? end of X2 and 3? end of X1 are linked through non-nucleic acid molecule L2. Since both 5? and 3? ends of two siRNA strands X1 and X2 of the complex molecule according to the present invention are linked through non-nucleic acid molecules, it is not easy to unwind and degraded for the siRNA strands, and therefore the chemical stability of siRNA and the remaining time in the blood are greatly improved. After being administered, the Dicer enzyme in the cells is utilized to release the locked siRNAs from the complex molecules, and after unwinding, the antisense strand of the siRNA is released from the double-stranded siRNA to inhibit the expression of the target genes.Type: ApplicationFiled: November 28, 2008Publication date: December 16, 2010Applicant: SUZHOU RIBO LIFE SCIENCE CO., LTDInventors: Zhen Xi, Zicai Liang, Liqiang Cao, Junbin Zhang, Jinyu Huang