Abstract: The present application provides a comfortable lightweight bullet-proof and stab-resistant suit and a preparation method thereof. A first aspect of the present application provides a comfortable lightweight bullet-proof and stab-resistant suit, including a sheath and a protection core sheet disposed in the sheath, and the protection core sheet includes a first protection layer, a second protection layer, a third protection layer and a buffer layer which are sequentially stacked together. The bullet-proof and stab-resistant suit provided in the present application has better response protection characteristics in the process of bullet penetration or knife tip stab, and the prepared aramid unidirectional cloth has low areal density, apparent flatness, no bubbles, and excellent softness, so that any bending within 180° can be realized.

Abstract: Systems and methods for deep neural network (DNN)-based cross component prediction are provided. A method includes inputting a reconstructed luma block of an image or video into a DNN; and predicting, by the DNN, a reconstructed chroma block of the image or video based on the reconstructed luma block that is input. Luma and chroma reference information and side information may also be input into the DNN to predict the reconstructed chroma block. The various inputs may also be generated using processes such as downsampling and transformation.

Abstract: The present invention discloses a package structure for reducing warpage of plastic package wafer, including an adapter board, a chip mounted on the adapter board, and a first plastic package layer covering the chip, through-silicon-vias are disposed on the adapter board, the first and second surfaces of the adapter board are respectively provided with external connection solder balls and/or external connection solder pads electrically connected with the through-silicon-vias. The process of manufacturing the package structure includes: after the first surface process of the adapter board is completed, bonding the first carrier on its first surface, then cutting the first carrier to expose the chip-mounting area, and then carrying out subsequent processes such as chip mounting, and finally cutting and removing the first carrier to complete the package.

Abstract: A packaged semiconductor device, such as a power QFN device, has (rectangular) ribbon wires, instead of circular bond wires. A proximal end of each ribbon wire is connected to a pad on an IC die, and a distal end of each ribbon wire forms a device lead. The die and the ribbon wires are encapsulated in a molding compound with a side of each device lead exposed. Such devices can be assembled without using lead frames. The omission of lead frames and the use of ribbon wires enable assembly of smaller devices having enhanced thermal dissipation capabilities.

Abstract: The invention introduces a flexible growth model of hydroponics including frame, growing modules and growing medium. The frame acts as a skeleton to provide support for the whole growing modules. The growing module is made of flexible materials to hold the hydroponics growing medium. The invention also provides a model of flexible hydroponic system, through which store less water (through the way of storing less water in each individual flexible growing modules). It effectively reduces the needed water pumped to the plants. The system can connect up to 48 growing modules, by using this system, users can save the needed water and nutrients ½ less than the present flood and drain system.

Abstract: A packaged semiconductor device, such as a power QFN device, has (rectangular) ribbon wires, instead of circular bond wires. A proximal end of each ribbon wire is connected to a pad on an IC die, and a distal end of each ribbon wire forms a device lead. The die and the ribbon wires are encapsulated in a molding compound with a side of each device lead exposed. Such devices can be assembled without using lead frames. The omission of lead frames and the use of ribbon wires enable assembly of smaller devices having enhanced thermal dissipation capabilities.

Abstract: A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.

Abstract: A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.

Abstract: A wire bonding machine and a method for testing wire bond connection s using the wire bonding machine. The method includes providing a semiconductor assembly that has a semiconductor die mounted to a substrate, each of which has bonding pads. The method includes bonding a wire to one of the bonding pads to form a first wire bond. A shear force then is applied to the first wire bond. A fault signal is generated when a sensor detects the first wire bond moving during application of the shear force.

Abstract: A diesel oxidation catalyst comprising a honeycomb substrate washcoated with a mixture of clay, a refractory oxide and a zeolite is disclosed. The washcoated substrate is subsequently deposited with a precious metal catalyst and a sulfur oxidation suppressant.