Abstract: A semiconductor module includes: a chip carrier having a first side and a second, opposite side; a semiconductor chip arranged on the first side of the chip carrier; an encapsulation body that encapsulates the semiconductor chip; and at least two external contacts made of a metal or an alloy and arranged next to each other, which are electrically and mechanically connected to the first side of the first chip carrier and protrude laterally out of the encapsulation body. At least one of the external contacts has at least one wing arranged within the encapsulation body and located opposite the other external contact. The wing includes one or more cutouts that are filled with the encapsulation material of the encapsulation body.

Abstract: A child's footwear is disclosed and includes comprises-a boot member having a foot enclosing member and a lower leg encircling member attached to the foot enclosing member, a fastening mechanism having a strap and hook-and-loop fastener components for fastening the lower leg encircling member about the child's lower leg, and a signalling mechanism constructed of reflective material. The signalling mechanism has an elongate configuration in the form of an exclamation point and extends substantially from an upper extremity of the lower leg encircling member to a juncture between the lower leg encircling member and the foot enclosing member, a non-vertical orientation, and at least two rows of stitches, one of which is spaced along each side of the signalling mechanism such that the signalling mechanism is caused to bulge convexly outwardly between the two rows of stitches.