Patents by Inventor Lisa J. Loparco

Lisa J. Loparco has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrochemical planarization of metal feature surfaces
    Patent number: 6848975
    Abstract: One aspect is directed to an improved method for polishing an integrated circuit. According to one aspect, metal features deposited on an integrated circuit are polished using electropolishing techniques. Because electropolishing is used, polishing avoids removal of softer insulating materials of the integrated circuit.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: February 1, 2005
    Assignee: Rensselaer Polytechnic Institute
    Inventors: David J. Duquette, Lisa J. Loparco
  • Electrochemical planarization of metal feature surfaces
    Publication number: 20030220052
    Abstract: One aspect is directed to an improved method for polishing an integrated circuit. According to one aspect, metal features deposited on an integrated circuit are polished using electropolishing techniques. Because electropolishing is used, polishing avoids removal of softer insulating materials of the integrated circuit.
    Type: Application
    Filed: April 9, 2003
    Publication date: November 27, 2003
    Inventors: David J. Duquette, Lisa J. Loparco