Patents by Inventor Liu Chang

Liu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12002451
    Abstract: Techniques for performing automatic speech recognition (ASR) are described. In some embodiments, an ASR component integrates contextual information from user profile data into audio encoding data to predict a token(s) corresponding to a spoken input. The user profile data may include personalized words, such as, contact names, device names, etc. The ASR component determines word embedding data using the personalized words. The ASR component is configured to apply attention to audio frames that are relevant to the personalized words based on processing the audio encoding data and the word embedding data.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: June 4, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Jing Liu, Feng-Ju Chang, Athanasios Mouchtaris, Martin Radfar, Maurizio Omologo, Siegfried Kunzmann
  • Publication number: 20240178348
    Abstract: A light-emitting device includes: an epitaxial structure having a first surface and a second surface opposite to the first surface, and including a first type semiconductor layered unit that includes a first type window layer and a first type ohmic contact layer disposed at one side of the first type window layer; an active layer; and a second type semiconductor layered unit. The first type window layer is disposed between the first type ohmic contact layer and the active layer. The first type ohmic contact layer contains a material represented by Alx1Gay1InP, where 0?x1?1, 0?y1?1. The first type window layer contains a material represented by Alx2Gay2InP, where 0<x2?1, 0?y2?1. The first type ohmic contact layer has an Al content lower than an Al content of the first type window layer. A light-emitting apparatus that includes a light-emitting device according to the disclosure is also disclosed.
    Type: Application
    Filed: October 17, 2023
    Publication date: May 30, 2024
    Inventors: Weihuan LI, JInghua CHEN, Peng GAO, Fuyang NING, Xiaofeng LIU, Yu-Ren PENG, Huanshao KUO, Duxiang WANG, Chia-Hung CHANG
  • Publication number: 20240178102
    Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.
    Type: Application
    Filed: April 21, 2023
    Publication date: May 30, 2024
    Inventors: Chun-Ti LU, Hao-Yi TSAI, Chiahung LIU, Ken-Yu CHANG, Tzuan-Horng LIU, Chih-Hao CHANG, Bo-Jiun LIN, Shih-Wei CHEN, Pei-Rong NI, Hsin-Wei HUANG, Zheng GangTsai, Tai-You LIU, Steve SHIH, Yu-Ting HUANG, Steven SONG, Yu-Ching WANG, Tsung-Yuan YU, Hung-Yi KUO, CHung-Shi LIU, Tsung-Hsien CHIANG, Ming Hung TSENG, Yen-Liang LIN, Tzu-Sung HUANG, Chun-Chih CHUANG
  • Patent number: 11986653
    Abstract: A wireless implant and associated system for motor function recovery after spinal cord injury, and more particularly a multi-channel wireless implant with small package size. The wireless implant can further be used in various medical applications, such as retinal prostheses, gastrointestinal implant, vagus nerve stimulation, and cortical neuromodulation. The system also includes a method and its implementation to acquire the impedance model of the electrode-tissue interface of the implant.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: May 21, 2024
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Yi-Kai Lo, Wentai Liu, Victor R. Edgerton, Chih-Wei Chang
  • Publication number: 20240148301
    Abstract: The present invention provides a smart wearable device, which is held on an upper body of a wearer by a plurality of contact pad sets, and has a connection unit, a first sensing module, a second sensing module, and an extension unit.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 9, 2024
    Inventors: Chien-Hsiang Chang, Yang-Cheng Lin, Wei-Chih Lien, Tseng-Ping Chiu, Pei-Yun Wu, Bo Liu
  • Publication number: 20240145411
    Abstract: Integrated circuit (IC) protections that prevent exposure or examination of integrated circuitry through backside analysis include a layer or mesh of an electrically conductive, electromagnetic radiation blocking material disposed over a backside of an IC device to prevent backside analysis. An electrically conductive conduit couples the material to a node of the integrated circuitry to provide a signal and/or voltage reference to the node through the layer/mesh. If the layer/mesh is tampered with, the integrated circuitry loses the voltage reference or signal thereby disabling the integrated circuitry. The IC device may include detection circuitry to monitor the node and to generate an alert and/or disable the circuitry upon tampering. The IC device may further include a support substrate, where a substrate between the material/mesh and the integrated circuitry is sufficiently thin that the IC device would be mechanically weak if the support substrate were removed.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 2, 2024
    Inventors: Myongseob KIM, Henley LIU, Cheang-whang CHANG
  • Publication number: 20240140782
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a first device and a second device disposed adjacent to the first device; a conductive pillar disposed adjacent to the first device or the second device; a molding surrounding the first device, the second device and the conductive pillar; and a redistribution layer (RDL) over the first device, the second device, the molding and the conductive pillar, wherein the RDL electrically connects the first device to the second device and includes an opening penetrating the RDL and exposing a sensing area over the first device.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 2, 2024
    Inventors: PO CHEN YEH, YI-HSIEN CHANG, FU-CHUN HUANG, CHING-HUI LIN, CHIAHUNG LIU, SHIH-FEN HUANG, CHUN-REN CHENG
  • Publication number: 20240145630
    Abstract: A light-emitting device includes a substrate and an epitaxial structure. The epitaxial structure includes a first semiconductor layer, an active layer, and a second semiconductor layer which are disposed on the upper surface of the substrate in such order. The substrate has a substrate edge region surrounding and exposed from the epitaxial structure. The substrate edge region includes a first substrate edge region and a second substrate edge region which is more proximate to the epitaxial structure than the first substrate edge region. The first substrate edge region has a first uneven toothed surface or an even flat surface. The second substrate edge regions are formed with second uneven toothed surfaces which have a height greater than a height of the first even toothed surface, or the even flat surface.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Minyou HE, Xiaoliang LIU, Qing WANG, Ling-Yuan HONG, Chung-Ying CHANG
  • Patent number: 11973302
    Abstract: The present disclosure provides a method for aligning a master oscillator power amplifier (MOPA) system. The method includes ramping up a pumping power input into a laser amplifier chain of the MOPA system until the pumping power input reaches an operational pumping power input level; adjusting a seed laser power output of a seed laser of the MOPA system until the seed laser power output is at a first level below an operational seed laser power output level; and performing a first optical alignment process to the MOPA system while the pumping power input is at the operational pumping power input level, the seed laser power output is at the first level, and the MOPA system reaches a steady operational thermal state.
    Type: Grant
    Filed: February 20, 2023
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Lin Louis Chang, Henry Tong Yee Shian, Alan Tu, Han-Lung Chang, Tzung-Chi Fu, Bo-Tsun Liu, Li-Jui Chen, Po-Chung Cheng
  • Patent number: 11960573
    Abstract: Neural network-based categorization can be improved by incorporating graph neural networks that operate on a graph representing the taxonomy of the categories into which a given input is to be categorized by the neural network based-categorization. The output of a graph neural network, operating on a graph representing the taxonomy of categories, can be combined with the output of a neural network operating upon the input to be categorized, such as through an interaction of multidimensional output data, such as a dot product of output vectors. In such a manner, information conveying the explicit relationships between categories, as defined by the taxonomy, can be incorporated into the categorization. To recapture information, incorporate new information, or reemphasize information a second neural network can also operate upon the input to be categorized, with the output of such a second neural network being merged with the output of the interaction.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Tianchuan Du, Keng-Hao Chang, Ruofei Zhang, Paul Liu
  • Publication number: 20240113259
    Abstract: A light-emitting device includes a semiconductor epitaxial structure including a first semiconductor layer, an active layer, and a second semiconductor layer, and having holes; a first insulation layer disposed on the semiconductor epitaxial structure and having first and second grooves; a first pad electrically connected to the first semiconductor layer through the first grooves; and a second pad electrically connected to the second semiconductor layer through the second grooves. A projection of the first pad does not overlap projections of the holes. A projection of the second pad does not overlap the projections of the holes. The first pad includes a first pad connection portion and first pad extension portions; the second pad includes a second pad connection portion and second pad extension portions. Projections of the second grooves fall between projections of the first and second pad extension portions. Two other aspects of the light-emitting device are also provided.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 4, 2024
    Inventors: Xiushan ZHU, Qi JING, Yan LI, Xiaoliang LIU, Zhilong LU, Chunhsien LEE, Chi-Ming TSAI, Juchin TU, Chung-Ying CHANG
  • Publication number: 20240113032
    Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 4, 2024
    Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
  • Patent number: 11944814
    Abstract: A wireless implant and associated system for motor function recovery after spinal cord injury, and more particularly a multi-channel wireless implant with small package size. The wireless implant can further be used in various medical applications, such as retinal prostheses, gastrointestinal implant, vagus nerve stimulation, and cortical neuromodulation. The system also includes a method and its implementation to acquire the impedance model of the electrode-tissue interface of the implant.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: April 2, 2024
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Yi-Kai Lo, Wentai Liu, Victor R. Edgerton, Chih-Wei Chang
  • Patent number: 11943643
    Abstract: An access point (AP) and a station (STA) communicate with each other, with the AP indicating to the STA either or both of a preamble detection (PD) channel and a signaling (SIG) content channel and with the STA being initially monitoring a primary frequency segment of a plurality of frequency segments in an operating bandwidth of the AP. A downlink (DL) or triggered uplink (UL) communication is performed between the AP and the STA during a transmission opportunity (TXOP) such that: (i) during the TXOP, the STA monitors a preamble on the PD channel and decodes a SIG content on the SIG content channel; and (ii) after an end of the TXOP, the STA switches to the primary frequency segment.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: March 26, 2024
    Assignee: MediaTek Singapore Pte. Ltd.
    Inventors: Kai Ying Lu, Yongho Seok, Hung-Tao Hsieh, Cheng-Yi Chang, James Chih-Shi Yee, Jianhan Liu, Po-Yuen Cheng
  • Publication number: 20240097661
    Abstract: A scan flip-flop circuit includes a selection circuit including first and second input terminals coupled to first and second I/O nodes, a flip-flop circuit coupled to the selection circuit, a first driver coupled between the flip-flop circuit and the first I/O node, and a second driver coupled between the flip-flop circuit and the second I/O node. The selection circuit and drivers receive a scan direction signal. In response to a first logic level of the scan direction signal, the selection circuit responds to a first signal received at the first input terminal, and the second driver outputs a second signal responsive to a flip-flop circuit output signal. In response to a second logic level of the scan direction signal, the selection circuit responds to a third signal received at the second input terminal, and the first driver outputs a fourth signal responsive to the flip-flop circuit output signal.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 21, 2024
    Inventors: Huaixin XIAN, Tzu-Ying LIN, Liu HAN, Jerry Chang Jui KAO, Qingchao MENG, Xiangdong CHEN
  • Publication number: 20240088327
    Abstract: A light emitting device includes a light-emitting laminate and an insulating reflective structure. The insulating reflective structure includes n pairs of dielectric layers stacked on the light-emitting laminate. Each of the n pairs of dielectric layers includes a first material layer and a second material layer. The first material layer has a first refractive index, and the second material layer has a second refractive index that is greater than the first refractive index of the first material layer. For each pair of dielectric layers among m1 pairs of dielectric layers out of the n pairs of dielectric layers, the first material layer has an optical thickness that is greater than that of the second material layer, where 0.5n?m1?n, and n and m1 are natural numbers greater than 0.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Inventors: Shiwei LIU, Jin XU, Baojun SHI, Shuijie WANG, Ke LIU, Chung-ying CHANG
  • Patent number: 11919284
    Abstract: A rotary seat including a base includes an outer surface, and a composite material layer attached to at least a part of the outer surface. The base also includes a recess for accommodating a turntable and including a first opening on the outer surface. The material of the composite material layer includes fibers and a resin. Therefore, the rotary seat may be more lightweight. A rotary table is also provided and includes the rotary seat, a driving device which drives the rotary seat to rotate, and a turntable which is rotatably disposed in the recess of the base.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: March 5, 2024
    Assignee: Hiwin Technologies Corp.
    Inventors: Yung-Tsai Chuo, Yaw-Zen Chang, Jui-Che Lin, Yu-Hsien Ho, Yu Liu
  • Patent number: 9016856
    Abstract: A temple assembly of a pair of eyeglasses is coupled to a frame body without screws. The temple assembly of eyeglasses includes a first connecting member and a second connecting member. The first connecting member includes a lever arm portion and a latching portion extended by the lever arm portion along the direction distal from said frame body. The second connecting member includes an elastic portion and an engaging portion extended by the elastic portion along the direction distal from the frame body; wherein the latching portion detachably coupled to the engaging portion, the elastic portion approached elastically to the lever arm portion. Thereby, an end piece of the frame body is rotatably coupled between the lever arm portion and the elastic portion.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: April 28, 2015
    Assignee: Action Eyewear Corp.
    Inventor: Tuo-Liu Chang
  • Publication number: 20140247421
    Abstract: A temple assembly of a pair of eyeglasses is coupled to a frame body without screws. The temple assembly of eyeglasses includes a first connecting member and a second connecting member. The first connecting member includes a lever arm portion and a latching portion extended by the lever arm portion along the direction distal from said frame body. The second connecting member includes an elastic portion and an engaging portion extended by the elastic portion along the direction distal from the frame body; wherein the latching portion detachably coupled to the engaging portion, the elastic portion approached elastically to the lever arm portion. Thereby, an end piece of the frame body is rotatably coupled between the lever arm portion and the elastic portion.
    Type: Application
    Filed: July 22, 2013
    Publication date: September 4, 2014
    Applicant: ACTION EYEWEAR CORP.
    Inventor: TUO-LIU CHANG
  • Patent number: D1020786
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: April 2, 2024
    Assignee: GOOGLE LLC
    Inventors: Ramachandran Ramaswamy, Daniel Sim, Jason Gouliard, Lilu Xu, Umesh Unnikrishan, Amit Chandak, Francois Toit Spies, Xi Liu, Jen-Feng Chang, Jamey Lorine Robnett-Conover, Sharon Lee