Patents by Inventor Liusheng Wang

Liusheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microwave assisted bonding method and joint
    Patent number: 6734409
    Abstract: A method of bonding together first and second components and a joint are provided. The method includes the steps of applying a film coating of electrically conductive material to an adjoining interface of a first component surface of the first component and a second component surface of the second component. The film coating has a thickness of less than 200 nanometers. The method also includes the step of positioning the first and second components such that the film coating is disposed between the first and second component surfaces. The method further includes the step of irradiating microwave energy to the film coating to generate thermal energy on the film coating to bond together the first and second components.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: May 11, 2004
    Assignee: Corning Incorporated
    Inventors: Liusheng Wang, Scott Hellman, Paul Townley-Smith, Michael Ushinsky
  • MICROWAVE ASSISTED BONDING METHOD AND JOINT
    Publication number: 20040084444
    Abstract: A method of bonding together first and second components and a joint are provided. The method includes the steps of applying a film coating of electrically conductive material to an adjoining interface of a first component surface of the first component and a second component surface of the second component. The film coating has a thickness of less than 200 nanometers. The method also includes the step of positioning the first and second components such that the film coating is disposed between the first and second component surfaces. The method further includes the step of irradiating microwave energy to the film coating to generate thermal energy on the film coating to bond together the first and second components.
    Type: Application
    Filed: October 31, 2002
    Publication date: May 6, 2004
    Inventors: Liusheng Wang, Scott Hellman, Paul Townley-Smith, Michael Ushinsky