Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.

Abstract: In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.

Abstract: A method for forming a device, comprising providing a first substrate carrying a first set of components disposed in a first encapsulating layer over the first set of components, providing a second substrate carrying a second set of components disposed in a second encapsulating layer over the second set of components, bonding the first and second substrates and functionally interconnecting at least one of the predefined components in the first set of components with at least one of the components in the second set of components.

Abstract: Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.

Abstract: Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: A method for forming a device, comprising providing a first substrate carrying a first set of components disposed in a first encapsulating layer over the first set of components, providing a second substrate carrying a second set of components disposed in a second encapsulating layer over the second set of components, bonding the first and second substrates and functionally interconnecting at least one of the predefined components in the first set of components with at least one of the components in the second set of components.

Abstract: Magnetostrictive actuator. The actuator includes a flexible substrate and a magnetostrictive film on the substrate. The shape of the flexible substrate is altered in the presence of a magnetic field.

Abstract: An optical component 100 adapted for attachment to an optical bench or submount has an alignment feature 310 that is used in the positioning of the optical component 100 relative to the optical bench. This alignment feature 310 is formed in an exterior wall 210 of the optical component. Further, according to the preferred embodiment, the alignment feature 310 has a re-entrant sidewall 320. This last characteristic facilitates the identification of precise location of the alignment by a vision system, for example, thus, allowing the accurate placement and installation of the optical component on the optical bench 10.

Abstract: 12 of 12 An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

Abstract: Mounting and alignment structures for optical components allow optical components to be connected to an optical bench and then subsequently aligned, i.e., either passively or actively, in a manufacturing or subsequent calibration or recalibration, alignment or realignment processes. The structures comprise quasi-extrusion portions. This portion is “quasi-extrusion” in the sense that it has a substantially constant cross section in a z-axis direction as would be yielded in an extrusion manufacturing process. The structures further comprise at least one base, having a laterally-extending base surface, and an optical component interface. At least one armature connects the optical component interface with the base. In the preferred embodiment, the base surface is securable to an optical bench.

Abstract: An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

Abstract: An optical component is adapted for pick-and-place-style installation on an optical submount or bench and compatible with a chuck of a bonder that picks-up the optical component, places it on the optical bench, and then typically solder bonds the optical component to the bench. In the current implementation, this optical component comprises an optical element, such as an optical fiber, lens, or MOEMS device, that is attached to a plastically deformable mounting structure. The optical component has a bench-attach surface that is used to bond the optical component to an optical bench. Further, the optical component has a bonder chuck engagement surface to which a bonder chuck attaches to manipulate the optical component, such as install it, on the optical bench.

Abstract: An optical component 100 adapted for attachment to an optical bench or submount has an alignment feature 310 that is used in the positioning of the optical component 100 relative to the optical bench. This alignment feature 310 is formed in an exterior wall 210 of the optical component. Further, according to the preferred embodiment, the alignment feature 310 has a re-entrant sidewall 320. This last characteristic facilitates the identification of precise location of the alignment by a vision system, for example, thus, allowing the accurate placement and installation of the optical component on the optical bench 10.