Abstract: The invention relates to gyroscopes having a vibrating structure that is micromachined in a silicon substrate. A novel vibrating structure is described, which has two moving masses 14 and 14?, connected by a vibration energy coupling structure (transverse arms 26, 26?, longitudinal arms 22, 22?, and a short transverse link 24 between the longitudinal links 22, 22?). The moving masses are also suspended from U-shaped flexure arms (13), having one branch end connected to the mass and another end connected to a fixed anchoring point 18. The flexure arms are not inserted between the coupling structure and the mass, but are independent of the coupling structure. The masses are excited so as to vibrate in their plane by electrostatic forces applied by interdigitated combs 11. The Coriolis forces make them vibrate perpendicular to the plane, and this vibration is detected by electrodes forming part of the moving masses.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.

Abstract: The invention relates to a microgyroscope, that is to say an inertial micromechanical sensor dedicated to the measurement of angular velocities, which is produced by micromachining techniques on a silicon wafer. The gyroscope comprises two symmetrical moving assemblies coupled via a coupling structure. Each of the two assemblies comprises a moving mass surrounded by a moving intermediate frame. The frame is connected to the coupling structure and can vibrate in two degrees of freedom in orthogonal directions Ox and Oy in the plane of the wafer. The mass is connected on one side to the frame and on the other side to fixed anchoring regions via linking means that allow the vibration movement along the Oy direction to be transmitted to the mass without permitting movement of the mass along the Ox direction. An excitation structure is associated with the frame in order to excite its vibration along Ox. A movement detection structure is associated with the mass in order to detect its vibration along Oy.

Abstract: The invention relates to gyroscopes having a vibrating structure that is micromachined in a silicon substrate. A novel vibrating structure is described, which has two moving masses 14 and 14′, connected by a vibration energy coupling structure (transverse arms 26, 26′, longitudinal arms 22, 22′, and a short transverse link 24 between the longitudinal links 22, 22′). The moving masses are also suspended from U-shaped flexure arms (13), having one branch end connected to the mass and another end connected to a fixed anchoring point 18. The flexure arms are not inserted between the coupling structure and the mass, but are independent of the coupling structure. The masses are excited so as to vibrate in their plane by electrostatic forces applied by interdigitated combs 11. The Coriolis forces make them vibrate perpendicular to the plane, and this vibration is detected by electrodes forming part of the moving masses.