Patents by Inventor Liwei Ju

Liwei Ju has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • A TUBULAR LED LAMP AND A CIRCUIT USED FOR THE LAMP
    Publication number: 20240107644
    Abstract: A tubular LED lamp to be used with an external electronic power controlling device which is adapted to provide an input voltage to the lamp, comprising: a LED unit; a driving circuit for the LED unit; and a safety detection circuit adapted to detect whether the tubular LED lamp is correctly connected to an external lamp fixture; characterized in that further comprising: a holding current providing circuit adapted to provide a holding current through the electronic controlling device so as to maintain the electronic controlling device to be conductive; and a controlling circuit adapted to synchronize the safety detection circuit with the holding current providing circuit such that the safety detection circuit is adapted to carry out the detection when the hold current providing circuit is adapted to provide the holding current and the electronic controlling device is conductive; wherein the controlling circuit is adapted to deactivate the holding current providing circuit and the safety detection circuit after
    Type: Application
    Filed: June 15, 2021
    Publication date: March 28, 2024
    Inventors: Deyong KONG, Xin LIU, Feng JU, Liwei SUN, Han LU, Jing YANG, Yuanqiang LIU
  • Self-repair logic for stacked memory architecture
    Patent number: 10224115
    Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: March 5, 2019
    Assignee: Intel Corporation
    Inventors: Joon-Sung Yang, Darshan Kobla, Liwei Ju, David Zimmerman
  • SELF-REPAIR LOGIC FOR STACKED MEMORY ARCHITECTURE
    Publication number: 20180005709
    Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
    Type: Application
    Filed: May 8, 2017
    Publication date: January 4, 2018
    Applicant: Intel Corporation
    Inventors: Joon-Sung YANG, Darshan KOBLA, Liwei JU, David ZIMMERMAN
  • Self-repair logic for stacked memory architecture
    Patent number: 9646720
    Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: May 9, 2017
    Assignee: Intel Corporation
    Inventors: Joon-Sung Yang, Darshan Kobla, Liwei Ju, David Zimmerman
  • SELF-REPAIR LOGIC FOR STACKED MEMORY ARCHITECTURE
    Publication number: 20160055922
    Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
    Type: Application
    Filed: July 29, 2015
    Publication date: February 25, 2016
    Inventors: Joon-Sung Yang, Darshan Kobla, Liwei Ju, David Zimmerman
  • Self-repair logic for stacked memory architecture
    Patent number: 9136021
    Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: September 15, 2015
    Assignee: Intel Corporation
    Inventors: Joon-Sung Yang, Darshan Kobla, Liwei Ju, David Zimmerman
  • SELF-REPAIR LOGIC FOR STACKED MEMORY ARCHITECTURE
    Publication number: 20130294184
    Abstract: Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.
    Type: Application
    Filed: December 23, 2011
    Publication date: November 7, 2013
    Inventors: Joon-Sung Yang, Darshan Kobla, Liwei Ju, David Zimmerman