Abstract: This disclosure provides modified T cells possessing both cell killing function and antigen presenting cell function and method of culturing the same. By administration of the modified T cell, cancer cells in a subject may be effectively inhibited via cell-mediated immunity.

Abstract: A semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: A vehicle electronic device is provided, including a vehicle window assembly, a first signal element, and a first protective element. The vehicle window assembly comprises a first protective substrate, a second protective substrate, and a display panel. The display panel is disposed between the first protective substrate and the second protective substrate. The first signal element is electrically connected to the display panel. The first protective element covers at least one portion of the first signal element.

Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.

Abstract: An electroporation system including one or more of a pipette, a pipette tip, a pipette docking assembly, and a pulse generator. The pipette docking assembly includes a pipette station, a pipette station guard, and a reservoir (e.g., a buffer tube). A method for transfecting a cell with a payload including providing an electroporation system, providing the cell, providing the payload, introducing the cell and the payload into a pipette tip, and electroporating the cell within the pipette tip by operating the electroporation system.

Abstract: A method for forming a semiconductor device structure is provided. The semiconductor device includes forming nanowire structures stacked over a substrate and spaced apart from one another, and forming a dielectric material surrounding the nanowire structures. The dielectric material has a first nitrogen concentration. The method also includes treating the dielectric material to form a treated portion. The treated portion of the dielectric material has a second nitrogen concentration that is greater than the first nitrogen concentration. The method also includes removing the treating portion of the dielectric material, thereby remaining an untreated portion of the dielectric material as inner spacer layers; and forming the gate stack surrounding nanowire structures and between the inner spacer layers.

Abstract: A semiconductor device includes a first diode, a second diode, a clamp circuit and a third diode. The first diode is coupled between an input/output (I/O) pad and a first voltage terminal. The second diode is coupled with the first diode, the I/O pad and a second voltage terminal. The clamp circuit is coupled between the first voltage terminal and the second voltage terminal. The second diode and the clamp circuit are configured to direct a first part of an electrostatic discharge (ESD) current flowing between the I/O pad and the first voltage terminal. The third diode, coupled to the first voltage terminal, and the second diode include a first semiconductor structure configured to direct a second part of the ESD current flowing between the I/O pad and the first voltage terminal.

Abstract: A method includes forming a fin structure over a substrate, wherein the fin structure comprises first semiconductor layers and second semiconductor layers alternately stacked over a substrate; forming a dummy gate structure over the fin structure; removing a portion of the fin structure uncovered by the dummy gate structure; performing a selective etching process to laterally recess the first semiconductor layers, including injecting a hydrogen-containing gas from a first gas source of a processing tool to the first semiconductor layers and the second semiconductor layers; and injecting an F2 gas from a second gas source of the processing tool to the first semiconductor layers and the second semiconductor layers; forming inner spacers on opposite end surfaces of the laterally recessed first semiconductor layers of the fin structure; and replacing the dummy gate structure and the first semiconductor layers with a metal gate structure.

Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.

Abstract: A chip packaging structure and a chip packaging method are provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate, and the image sensing chip has an image sensing region. The supporting member is disposed on an upper surface of the image sensing chip and surrounds the image sensing region. The supporting member is formed by stacking microstructures with each other, so that the supporting member has pores. The second substrate is disposed on an upper surface of the supporting member, and the second substrate, the supporting member, and the image sensing chip define an air cavity. The encapsulant is attached to the upper surface of the first substrate and a side surface of the second substrate and filled into the pores.

Abstract: In some embodiments, a semiconductor device is provided, including a first doped region of a first conductivity type configured as a first terminal of a first diode, a second doped region of a second conductivity type configured as a second terminal of the first diode, wherein the first and second doped regions are coupled to a first voltage terminal; a first well of the first conductivity type surrounding the first and second doped regions in a layout view; a third doped region of the first conductivity type configured as a first terminal, coupled to an input/output pad, of a second diode; and a second well of the second conductivity type surrounding the third doped region in the layout view. The second and third doped regions, the first well, and the second well are configured as a first electrostatic discharge path between the I/O pad and the first voltage terminal.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A presentation document is provided for display at a user device. An addition of a content object into the presentation document is identified. A theme of the presentation document is identified based on the content object. A subset of the presentation document templates is provided for selection based on the identified theme. A user interaction associated with the presentation document is identified. Responsive to identifying the user interaction associated with the presentation document, suggested content for insertion into the presentation document are provided for presentation at the user device. A selection of a suggested content object from the suggested content is received. The selected suggested content object is applied to the presentation document.

Abstract: A testing equipment is provided, in which at least one testing module is disposed on a machine, and the testing module includes a circuit board, a testing carrier disposed on the circuit board and carrying a target object, and a processor disposed on the circuit board and electrically connected to the testing carrier, such that the testing module can operate and process a target information of the target object by itself via the processor, without connecting to an external computer to operate and process the target information of the target object, so as to quickly obtain a detecting information of the target object.

Abstract: A presentation document is provided for display at a user device. An addition of a content object into the presentation document is identified. A theme of the presentation document is identified based on the content object. A subset of the presentation document templates is provided for selection based on the identified theme. A user interaction associated with the presentation document is identified. Responsive to identifying the user interaction associated with the presentation document, suggested content for insertion into the presentation document are provided for presentation at the user device. A selection of a suggested content object from the suggested content is received. The selected suggested content object is applied to the presentation document.

Abstract: A presentation document is provided for display at a user device. An addition of a content object into the presentation document is identified. A theme of the presentation document is identified based on the content object. A subset of the presentation document templates is provided for selection based on the identified theme. A user interaction associated with the presentation document is identified. Responsive to identifying the user interaction associated with the presentation document, suggested content for insertion into the presentation document are provided for presentation at the user device. A selection of a suggested content object from the suggested content is received. The selected suggested content object is applied to the presentation document.

Abstract: A presentation document is provided for display at a user device. An addition of a content object into the presentation document is identified. A theme of the presentation document is identified based on the content object. A subset of the presentation document templates is provided for selection based on the identified theme. A user interaction associated with the presentation document is identified. Responsive to identifying the user interaction associated with the presentation document, suggested content for insertion into the presentation document are provided for presentation at the user device. A selection of a suggested content object from the suggested content is received. The selected suggested content object is applied to the presentation document.

Abstract: A computer-implemented method for providing templates for a document to a user, the method comprising detecting a first object in the document, generating a score for each document template in a plurality of document templates, by applying a ranking scheme to the document templates, wherein the ranking scheme is based on the first object placed in the document, providing to the user, a first subset of the plurality of document templates based on each document template's respective score, receiving a selection of a document template from the first subset of the plurality of document templates from the user, and applying the selected document template to the first object in the document.

Abstract: A computer-implemented method for providing templates for a document to a user, the method comprising detecting a first object in the document, generating a score for each document template in a plurality of document templates, by applying a ranking scheme to the document templates, wherein the ranking scheme is based on the first object placed in the document, providing to the user, a first subset of the plurality of document templates based on each document template's respective score, receiving a selection of a document template from the first subset of the plurality of document templates from the user, and applying the selected document template to the first object in the document.

Abstract: The present invention discloses a high efficiency charging system and a charging circuit therein. The high efficiency charging system includes a power supplier and a power receiver, which are connected via a transmission wire so that power is transmitted from the power supplier to the power receiver. The power receiver includes a voltage conversion circuit and a control circuit. The voltage conversion circuit converts an adjustable input voltage provided by the power supplier to an output voltage and generates an output current for charging a battery. The voltage conversion circuit adaptively adjusts the output current according to a voltage drop between the adjustable input voltage and the output voltage. The control circuit senses the adjustable input voltage and the output voltage and instructs the power supplier to adjust the output voltage according to the voltage drop between the adjustable input voltage and output voltage.