Abstract: A display substrate and a display panel are provided, the display substrate includes a first gate driver circuit and a second gate driver circuit that are respectively arranged on a first side and a second side of a display region; the first gate driver circuit includes a plurality of first shift register units arranged in a first direction, each first shift register unit includes a first thin film transistor; the second gate driver circuit includes a plurality of second shift register units arranged in the first direction, each second shift register unit includes a second thin film transistor having the same function as the first thin film transistor; an average turn-on current of at least one first thin film transistor is Ion1, and an average turn-on current of at least one second thin film transistor is Ion2, Ion1>Ion2.

Abstract: Provided is a thin film transistor and a method for manufacturing thereof, a display panel, and a display device, which relates to the field of display technologies. The thin film transistor includes an active layer, source and drain electrodes, and an oxygen supplementation layer. As an orthogonal projection of the oxygen supplementation layer on the base substrate is at least partially overlapped with an orthogonal projection of a target portion of the active layer on the base substrate, oxygen introduced in forming the oxygen supplementation layer in the thin film transistor is capable of diffusing to the target portion of the active layer, such that a defect in the target portion of the active layer is reduced, and a property of the thin film transistor is greater.

Abstract: A terminal device includes a housing and a metal line that is disposed on an outer surface of the housing or is embedded in the housing, and the metal line is configured to receive or send an electromagnetic wave signal. The metal line acts as an antenna of the terminal device.

Abstract: This application prides relates to a foldable support plate, a flexible display module, and a foldable electronic device. In an example, a foldable support plate includes a first support portion, a foldable support portion, and a first transition support portion. When the foldable support plate is folded, the first support portion is in a flat state. The foldable support portion is in a bent state when the foldable support plate is folded. The first transition support portion is connected between the first support portion and the foldable support portion. A bending radian of the first transition support portion is less than a bending radian of the foldable support portion when the foldable support plate is folded.

Abstract: The present disclosure provides an array substrate, an electronic device and a manufacturing method of the array substrate. The array substrate includes a base substrate, and a first transistor and a second transistor on the base substrate, a first electrode of the first transistor being connected to a second electrode of the second transistor; the array substrate further includes a photodiode including a first electrode, a second electrode, and a photosensitive layer between the first electrode and the second electrode, and the first electrode is electrically connected to a gate of the first transistor. In the arrangement, the first transistor and the second transistor are connected in series to form one control unit, and the uniformity and stability of the control unit are greatly improved.

Abstract: A displaying base plate and a manufacturing method thereof, and a displaying device. The displaying base plate includes a substrate, and a first electrode layer disposed on one side of the substrate, wherein the first electrode layer includes a first electrode pattern; a first planarization layer disposed on one side of the first electrode layer that is away from the substrate, wherein the first planarization layer is provided with a through hole, and the through hole penetrates the first planarization layer, to expose the first electrode pattern; and a second electrode layer, a second planarization layer and a third electrode layer that are disposed in stack on one side of the first planarization layer that is away from the substrate, wherein the second electrode layer is disposed closer to the substrate, the second electrode layer is connected to the first electrode pattern and the third electrode layer.

Abstract: A mobile terminal includes: a housing having a side wall that is provided with an accommodation cavity, where the accommodation cavity has a first side wall and a second side wall, the first side wall is provided with an avoidance groove, and the avoidance groove is disposed on a side of the first side wall close to the accommodation cavity and is in communication with the accommodation cavity; a display screen, mounted in the housing; and a trigger portion that at least partly protrudes into the accommodation cavity and is movably connected to the accommodation cavity, where the trigger portion includes a cable board, where the avoidance groove is configured to accommodate the cable

Abstract: The middle frame assembly includes a middle frame, connectors, and a vapor chamber. The middle frame is provided with a through hole, the connectors are fixedly connected to the middle frame, and some of the connectors are exposed to form a welding part. The vapor chamber includes a vapor chamber body and a surrounding edge surrounding the vapor chamber body. The vapor chamber is accommodated in the through hole, and the surrounding edge is welded to the welding part. In this application, the connectors are used to connect the middle frame and the vapor chamber, and the connectors and the vapor chamber are welded, to implement a high-strength and ultra-thin connection between the middle frame and the vapor chamber, and enable good thermal conduction performance between the vapor chamber and the middle frame.

Abstract: A cover includes a cover body and a first line layer. The cover body is made of an insulating material, and the first line layer is made of a conductive material. The first line layer is completely built into the cover body, and the first line layer is configured to form a radiator, and is coupled to a radio frequency transceiver circuit of an electronic device. The first line layer includes a plurality of first conducting wires and a plurality of second conducting wires. The plurality of first conducting wires are arranged at intervals in a first direction, and the plurality of second conducting wires are arranged at intervals in a second direction. The plurality of first conducting wires and the plurality of second conducting wires are disposed intersecting each other. The first direction is different from the second direction.

Abstract: This application provides a terminal device which includes a housing and a metal line. The metal line is disposed on an outer surface of the housing or embedded in the housing, and the metal line is configured to receive or send an electromagnetic wave signal. In the terminal device provided in this application, the metal line (an antenna) of the terminal device is disposed on the outer surface of the housing of the terminal device or embedded in the housing. This can increase a distance from the metal line to a circuit board of the terminal device, thereby reducing interference of a metal component on the circuit board to radiation of the metal line (radiation of the antenna) and improving operating bandwidth and efficiency of the antenna. This improves operating efficiency of the antenna of the terminal device, thereby improving signal receiving and signal sending quality of the terminal device.

Abstract: Methods and computer-readable media are provided herein for implementing custom application programming interfaces (API) for creating, managing, and provisioning packages of online applications. An offer management service API is implemented that provides methods for creating and modifying offers for packages of online applications. An offer provisioning API is implemented that provides methods enabling the provisioning of online applications for subscribers to offers. An application provider API is published and utilized to provision and maintain individual instances of online applications provided by application providers.

Abstract: Methods and computer-readable media are provided herein for implementing custom application programming interfaces (API) for creating, managing, and provisioning packages of online applications. An offer management service API is implemented that provides methods for creating and modifying offers for packages of online applications. An offer provisioning API is implemented that provides methods enabling the provisioning of online applications for subscribers to offers. An application provider API is published and utilized to provision and maintain individual instances of online applications provided by application providers.

Abstract: Methods and computer-readable media are provided herein for implementing custom application programming interfaces (API) for creating, managing, and provisioning packages of online applications. An offer management service API is implemented that provides methods for creating and modifying offers for packages of online applications. An offer provisioning API is implemented that provides methods enabling the provisioning of online applications for subscribers to offers. An application provider API is published and utilized to provision and maintain individual instances of online applications provided by application providers.

Abstract: The reliable writing of data to multiple data stores using a write agent. The overall write operation is managed by a write manager that is communicatively coupled to the write agent and to a certain data store. Upon determined that multiple data stores are to be written to, the write manager first instructs the write agent to perform a delay write to other data store(s). The delay write means that the write agents waits a delay time before performing the write unless instructed in the meantime to more immediately perform the write, and if a delay passes, does not perform the write without first checking that the write has been made to the certain data store. After instructing the write agent to delay write, the write manager attempts to write to the certain data store. Upon successfully writing to the certain data store, the write manager may instruct the write agent to proceed immediately.

Abstract: The reliable writing of data to multiple data stores using a write agent. The overall write operation is managed by a write manager that is communicatively coupled to the write agent and to a certain data store. Upon determined that multiple data stores are to be written to, the write manager first instructs the write agent to perform a delay write to other data store(s). The delay write means that the write agents waits a delay time before performing the write unless instructed in the meantime to more immediately perform the write, and if a delay passes, does not perform the write without first checking that the write has been made to the certain data store. After instructing the write agent to delay write, the write manager attempts to write to the certain data store. Upon successfully writing to the certain data store, the write manager may instruct the write agent to proceed immediately.

Abstract: Methods and computer-readable media are provided herein for implementing custom application programming interfaces (API) for creating, managing, and provisioning packages of online applications. An offer management service API is implemented that provides methods for creating and modifying offers for packages of online applications. An offer provisioning API is implemented that provides methods enabling the provisioning of online applications for subscribers to offers. An application provider API is published and utilized to provision and maintain individual instances of online applications provided by application providers.

Abstract: The invention discloses an injection synchronization narrowband regenerative phase-locked loop (ISNRPLL) circuit. The circuit includes a synchronous oscillation loop composed by the connecting of an injection synchronization narrowband regenerative voltage-controlled oscillator (ISNRVCO) and an exclusive-OR double frequency circuit; a phase-locked loop composed by the connecting of a digital phase detector, a charge pump and a loop filter, and a D type flip-flop for outputting data. The ISNRVCO does not ask much of the syntonic loop, and can be implemented by integrating inductance on a chip. Preferably, it can be integrated completely by using the deep submicron digital CMOS technology, so there are only a few external elements. Simulation shows that the capture range, capture time and phase noise etc. of the INSRPLL are all better than the conventional phase-locked loop circuit and can be used in GHz level high-speed clock recovery integrated circuit.

Abstract: The invention discloses an injection synchronization narrowband regenerative phase-locked loop (ISNRPLL) circuit. The circuit includes a synchronous oscillation loop composed by the connecting of an injection synchronization narrowband regenerative voltage-controlled oscillator (ISNRVCO) and an exclusive-OR double frequency circuit; a phase-locked loop composed by the connecting of a digital phase detector, a charge pump and a loop filter, and a D type flip-flop for outputting data. The ISNRVCO does not ask much of the syntonic loop, and can be implemented by integrating inductance on a chip. Preferably, it can be integrated completely by using the deep submicron digital CMOS technology, so there are only a few external elements. Simulation shows that the capture range, capture time and phase noise etc. of the INSRPLL are all better than the conventional phase-locked loop circuit and can be used in GHz level high-speed clock recovery integrated circuit.