Abstract: The present application relates to the field of stereophonic devices and discloses a wearable stereophonic device comprising a right shell, a center shell and a left shell, wherein two sides of the center shell are connected to the right shell and the left shell via adjustment slide strips (3), respectively. In the present invention, 5.0 surround sound is supported; a massage function can be provided while enjoying music; the interferences from external noise is reduced by open-ear active noise cancelling control; and, the wearable stereophonic device can be cooperatively connected and used with other advanced application technologies such as Virtual Reality (VR), Augmented Reality (AR) and Mixed Reality (MR), and compatible to other applications and devices such as electronic sports, smart motorbikes or smart bikes.

Abstract: The present application relates to the field of stereophonic devices and discloses a wearable stereophonic device comprising a right shell, a center shell and a left shell, wherein two sides of the center shell are connected to the right shell and the left shell via adjustment slide strips (3), respectively. In the present invention, 5.0 surround sound is supported; a massage function can be provided while enjoying music; the interferences from external noise is reduced by open-ear active noise cancelling control; and, the wearable stereophonic device can be cooperatively connected and used with other advanced application technologies such as Virtual Reality (VR), Augmented Reality (AR) and Mixed Reality (MR), and compatible to other applications and devices such as electronic sports, smart motorbikes or smart bikes.

Abstract: A cooling and ventilation device (10), a cooling hat (20), a cooling shoe and a cooling backpack. The cooling and ventilation device (10) comprises: a housing (100), a ventilation assembly (200), a heat conduction frame (300) and a cooling assembly (400). Two ends of the housing (100) are respectively provided with an air inlet (110) and an air outlet (120). The ventilation assembly (200) is arranged at the position of the air inlet (110), and is used for bringing air into the housing (100). The heat conduction frame (300) is arranged within the housing (100). The cooling assembly (400) comprises semiconductor cooling plates (410) and heat conduction film layers (420), the semiconductor cooling plates (410) being arranged on the heat conduction frame (300), the heat conduction film layers (420) being attached to the side surfaces of the semiconductor cooling plates (410) away from the heat conduction frame (300).