Abstract: Systems and methods are provided for determining a deformation event in a battery pack. The battery pack may comprise a conductive path coupled to a first electrical connector and a second electrical connector. Processing circuitry may be configured to detect a change in an electrical characteristic of the conductive path indicating a transition from a first circuit state of the conductive path to a second circuit state of the conductive path. The processing circuitry may be configured to determine, in response to the detecting, a deformation event in the battery pack.

Abstract: A method is disclosed for connecting a plurality of battery strings to a direct-current (DC) bus. The method may include sorting the plurality of battery strings in an order based on respective output voltage values of the battery strings. The sorted plurality of battery strings may include, in the order, at least a first battery string and a second battery string. The method may also include connecting the first battery string to a pre-charge circuit. The method may further include pre-charging the DC bus using the first battery string and the pre-charge circuit. The method may further include connecting the first battery string to the DC bus. The method may further include connecting the second battery string to the DC bus.

Abstract: A system is disclosed for connecting a battery string to a direct-current (DC) bus of a vehicle. The system may include a pre-charge circuit coupled between the battery string and the DC bus. The pre-charge circuit may include a first transistor. The system may also include a first contactor connected to the pre-charge circuit in series. The system may further include a controller configured to close the first contactor and switch on the first transistor.

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract: Fan-out wafer-level packaging (WLP) using metal foil lamination is provided. An example wafer-level package incorporates a metal foil, such as copper (Cu), to relocate bonding pads in lieu of a conventional deposited or plated RDL. A polymer such as an epoxy layer adheres the metal foil to the package creating conductive contacts between the metal foil and metal pillars of a die. The metal foil may be patterned at different stages of a fabrication process. An example wafer-level package with metal foil provides relatively inexpensive electroplating-free traces that replace expensive RDL processes. Example techniques can reduce interfacial stress at fan-out areas to enhance package reliability, and enable smaller chips to be used. The metal foil provides improved fidelity of high frequency signals. The metal foil can be bonded to metallic pillar bumps before molding, resulting in less impact on the mold material.

Abstract: A system for detecting a condition of a contactor configured to connect a battery string to a direct-current bus in a vehicle may include a controller configured to open or close the contactor. The system may also include an alternating-current (AC) signal source configured to provide an AC test signal when the controller opens the contactor. The system may further include an AC coupling circuit. The AC coupling circuit may include a primary side of the AC coupling circuit connected to the AC test signal source, and a secondary side connected to the contactor. The system may also include a detection circuit configured to receive an AC return signal corresponding to the AC test signal, and determine a defective condition of the contactor based on the AC return signal.

Abstract: Systems and methods for disengaging a battery are disclosed. The systems and methods may be used to disengage a battery from a direct-current (DC) bus of a vehicle when the DC bus is under a load. In one implementation, the system includes one or more contactors between the battery string and the DC bus. The system also includes a controller. The controller is configured to reduce a current limit of a power train of the vehicle to a first current level. The controller is also configured to open the one or more contactors. The controller is further configured to increase the current limit of the power train of the vehicle to a second current level.

Abstract: A system for detecting a condition of a contactor configured to connect a battery string to a direct-current bus in a vehicle may include a controller configured to open or close the contactor. The system may also include an alternating-current (AC) signal source configured to provide an AC test signal when the controller opens the contactor. The system may further include an AC coupling circuit. The AC coupling circuit may include a primary side of the AC coupling circuit connected to the AC test signal source, and a secondary side connected to the contactor. The system may also include a detection circuit configured to receive an AC return signal corresponding to the AC test signal, and determine a defective condition of the contactor based on the AC return signal.

Abstract: A method is disclosed for connecting a plurality of battery strings to a direct-current (DC) bus. The method may include sorting the plurality of battery strings in an order based on respective output voltage values of the battery strings. The sorted plurality of battery strings may include, in the order, at least a first battery string and a second battery string. The method may also include connecting the first battery string to a pre-charge circuit. The method may further include pre-charging the DC bus using the first battery string and the pre-charge circuit. The method may further include connecting the first battery string to the DC bus. The method may further include connecting the second battery string to the DC bus.

Abstract: A system is disclosed for connecting a battery string to a direct-current (DC) bus of a vehicle. The system may include a pre-charge circuit coupled between the battery string and the DC bus. The pre-charge circuit may include a first transistor. The system may also include a first contactor connected to the pre-charge circuit in series. The system may further include a controller configured to close the first contactor and switch on the first transistor.

Abstract: Fan-out wafer-level packaging (WLP) using metal foil lamination is provided. An example wafer-level package incorporates a metal foil, such as copper (Cu), to relocate bonding pads in lieu of a conventional deposited or plated RDL. A polymer such as an epoxy layer adheres the metal foil to the package creating conductive contacts between the metal foil and metal pillars of a die. The metal foil may be patterned at different stages of a fabrication process. An example wafer-level package with metal foil provides relatively inexpensive electroplating-free traces that replace expensive RDL processes. Example techniques can reduce interfacial stress at fan-out areas to enhance package reliability, and enable smaller chips to be used. The metal foil provides improved fidelity of high frequency signals. The metal foil can be bonded to metallic pillar bumps before molding, resulting in less impact on the mold material.

Abstract: Fan-out wafer-level packaging (WLP) using metal foil lamination is provided. An example wafer-level package incorporates a metal foil, such as copper (Cu), to relocate bonding pads in lieu of a conventional deposited or plated RDL. A polymer such as an epoxy layer adheres the metal foil to the package creating conductive contacts between the metal foil and metal pillars of a die. The metal foil may be patterned at different stages of a fabrication process. An example wafer-level package with metal foil provides relatively inexpensive electroplating-free traces that replace expensive RDL processes. Example techniques can reduce interfacial stress at fan-out areas to enhance package reliability, and enable smaller chips to be used. The metal foil provides improved fidelity of high frequency signals. The metal foil can be bonded to metallic pillar bumps before molding, resulting in less impact on the mold material.

Abstract: Systems and methods for disengaging a battery are disclosed. The systems and methods may be used to disengage a battery from a direct-current (DC) bus of a vehicle when the DC bus is under a load. In one implementation, the system includes one or more contactors between the battery string and the DC bus. The system also includes a controller. The controller is configured to reduce a current limit of a power train of the vehicle to a first current level. The controller is also configured to open the one or more contactors. The controller is further configured to increase the current limit of the power train of the vehicle to a second current level.

Abstract: Fan-out wafer-level packaging (WLP) using metal foil lamination is provided. An example wafer-level package incorporates a metal foil, such as copper (Cu), to relocate bonding pads in lieu of a conventional deposited or plated RDL. A polymer such as an epoxy layer adheres the metal foil to the package creating conductive contacts between the metal foil and metal pillars of a die. The metal foil may be patterned at different stages of a fabrication process. An example wafer-level package with metal foil provides relatively inexpensive electroplating-free traces that replace expensive RDL processes. Example techniques can reduce interfacial stress at fan-out areas to enhance package reliability, and enable smaller chips to be used. The metal foil provides improved fidelity of high frequency signals. The metal foil can be bonded to metallic pillar bumps before molding, resulting in less impact on the mold material.

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract: A fan-out microelectronic package is provided in which bond wires electrically couple bond pads on a microelectronic element, e.g., a semiconductor chip which may have additional traces thereon, with contacts at a fan-out area of a dielectric element adjacent an edge surface of the chip. The bond wires mechanically decouple the microelectronic element from the fan-out area, which can make the electrical interconnections less prone to reliability issues due to effects of differential thermal expansion, such as caused by temperature excursions during initial package fabrication, bonding operations or thermal cycling. In addition, mechanical decoupling provided by the bond wires may also remedy other mechanical issues such as shock and possible delamination of package elements.

Abstract: Systems and methods for disengaging a battery are disclosed. The systems and methods may be used to disengage a battery from a direct-current (DC) bus of a vehicle when the DC bus is under a load. In one implementation, the system includes one or more contactors between the battery string and the DC bus. The system also includes at least one transistor connected to the one or more contactors in series. The system further includes a controller configured to switch off the transistor and open the one or more contactors.

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract: Filtering loop and method for maintaining synchronization between a receiver and a transmitter reduces overhead and enables more robust operation. The method includes the step of receiving an error signal corresponding to a synchronization parameter. A first order filter is applied to the error signal such that a residual signal results. The method further provides for compensating the residual signal for drift such that the compensated residual signal estimates a rate of change in the residual signal. By compensating the residual signal for drift, difficulties associated with time lag and signal degradation are obviated.