Abstract: A magnetic device includes a base plate, a cover plate, a first winding column, a second winding column, a primary winding, a secondary winding and a supporting column. The base plate, having a first concave portion, is opposite to the cover plate. The first winding column and the second winding column are disposed between the bottom plate and the cover plate, respectively. The primary winding and the secondary winding are wound around the first winding column and the second winding column. The supporting column is disposed between the base plate and the cover plate. A first concave portion concaves from a first side of the base plate towards the first winding column and the second winding column along multiple directions. The primary winding and the secondary winding are wound and stacking along an extension direction of the first winding column and the second winding column.

Abstract: The embodiments of the present disclosure provides a display substrate, including: an active region and a peripheral region, the active region is provided therein with a plurality of pixel units arranged in an array, all the pixel units are divided into n pixel unit groups, the peripheral region is provided therein with a driver block including a first gate drive circuit having n+x first signal output terminals configured to sequentially output first gate drive signals in an active level and the first gate line provided for an ith pixel unit group is electrically connected to a (i+x)th first signal output terminal, and the reset signal line provided for the ith pixel unit group is electrically connected to an ith first signal output terminal, with i being a positive integer and i?n.

Abstract: A display substrate and a display device are provided. The display substrate includes a shift register unit, a first clock signal line and a first power line, the shift register unit includes a charge pump circuit, and the charge pump circuit includes a first capacitor, a first transistor and a second capacitor. The charge pump circuit is electrically connected with a first input node and a first node, respectively. A first electrode plate of the first capacitor is connected with the first clock signal line, a second electrode plate of the first capacitor is connected with the first input node, a first electrode plate of the second capacitor is connected with the first power line, a second electrode plate of the second capacitor is connected with the first node, a gate electrode of the first transistor is connected with a first electrode or a second electrode of the first transistor.

Abstract: Embodiments of the disclosure disclose a display substrate, a manufacturing method thereof and a display apparatus. The display substrate includes: a base, having a wire routing region; a first wire routing layer, located on the base, where the first wire routing layer in the wire routing region includes a plurality of first routing wires arranged at intervals, and a space between adjacent first routing wires is smaller than 2 um; an insulation layer, located on a side of the first wire routing layer facing away from the base and having a plurality of first via holes corresponding to the first routing wires; a first flat layer, located on a side of the insulation layer facing away from the base and having second via holes corresponding to the first via holes, where the second via holes at least partially overlap with the first via holes.

Abstract: The utility model relates to a grounded shrapnel structure of an H-MTD male connector, including a housing of a hollow structure, a shrapnel in an arch shape, and a guide block. The front end of the housing is provided with an opening. The guide block is arranged horizontally. One end of the guide block is connected to one end of the opening. The other end of the guide block is connected to one end of the shrapnel. The structure uses only two surfaces at top and bottom that are grounded, thereby reducing the number of openings, improving the strength of a sidewall, and enhancing the shielding effect. In addition, the guide block can play the function of anti-scratching during assembly, which can effectively avoid the damage to the shrapnel during assembly and improve yield.

Abstract: The utility model relates to a ring-shaped shrapnel structure of an H-MTD male connector, including a housing, a ring-shaped sheet, and a shrapnel. The housing is a stepped hollow structure. The ring-shaped sheet is connected to the front end of the housing. The shrapnel in an arch-shape protrudes and is arranged on the ring-shaped sheet. The structure uses a split design to separate the shrapnel from the housing, thereby reducing production difficulties and improving yields, while complementing the shielding effect of the connector.

Abstract: A battery pack, a vehicle, and an energy storage device are provided. The battery pack includes a cell array and a support member, where the cell array includes a plurality of cells, the cell has a first dimension, and the first dimension is a maximum spacing between two imaginary parallel planes sandwiching the cell; and at least one of the cells 600 mm?first dimension?2500 mm the at least one cell includes a casing and a core located inside the casing, a supporting region is formed on the casing, and the cell is connected to the support member through the supporting region and is supported by the support member. The support member is connected to the supporting region to support the cell.

Abstract: A power battery pack includes: a pack body; a plurality of cells, disposed in the pack body; the cell having a length L0, a width H0, and a thickness D0, where at least one cell meets: L0>H0?D0, a length direction of the cell is arranged along a width direction of a vehicle body of the electric vehicle, and in the width direction of the electric vehicle, the length L0 of the cell and a size W of the vehicle body of the electric vehicle in the width direction meet: 46%?L0/W?76%; or at least one cell meets: L0>H0?D0, a length direction of the cell is arranged along a length direction of a vehicle body of the electric vehicle, and in the length direction of the electric vehicle, the length L0 of the cell and a size X of the vehicle body of the electric vehicle in the length direction meet: 40%?L0/W?76%.

Abstract: The present invention provides compositions and methods of their use in treating muscular dystrophy and other disorders.

Abstract: An inductor device including a frame portion, a first winding set, a second winding set and a first common magnetic core I piece is provided. The first winding set, the second winding set and the first common magnetic core I piece are disposed in the frame portion. The first common magnetic core I piece substantially connects the first winding set and the second winding set and the frame portion. The material of the two winding sets is different from that of the first common magnetic core I piece.

Abstract: The three-state spintronic device includes: a bottom electrode, a magnetic tunnel junction and a top electrode from bottom to top. The magnetic tunnel junction includes: a spin-orbit coupling layer, a ferromagnetic free layer, a barrier tunneling layer, a ferromagnetic reference layer, three local magnetic domain wall pinning centers and domain wall nucleation centers. An antisymmetric exchange interaction is modulated, and the magnetic domain wall pinning centers are embedded in an interface between a heavy metal and the ferromagnetic free layer. The magnetic domain wall nucleation centers are at two ends of the ferromagnetic free layer. A current pulse flows through the spin-orbit coupling layer to generate a spin current and the spin current is injected into the ferromagnetic free layer. Under a control of all-electrical controlled, an effective field of a spin-orbit torque drives domain wall to move and displace.

Abstract: A shift register circuit includes a first control sub-circuit and a first output sub-circuit. The first control sub-circuit is configured to: adjust a voltage of a first node to a turn-on voltage due to an influence of a first direct current voltage signal from a first clock signal terminal, an initial voltage signal from an initial signal terminal and a second direct current voltage signal from a second clock signal terminal; and maintain the voltage of the first node at the turn-on voltage due to an influence of a first clock signal from the first clock signal terminal and a second clock signal from the second clock signal terminal. The first output sub-circuit is configured to be turned on under a control of the turn-on voltage of the first node to transmit a first voltage signal from a first voltage terminal to a signal output terminal.

Abstract: A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: Provided are methods of treating a disease or disorder in a subject in need thereof and associated compositions. An effective amount of ribitol is administered, thereby restoring and/or enhancing functional glycosylation of ?-DG and/or treating the disease or disorder.

Abstract: An electronic device package and a method for manufacturing an electronic device package are provided. The electronic device package includes electronic device structure which includes a first electronic device and a first encapsulant, a second electronic device, and a second encapsulant. The first encapsulant encapsulates the first electronic device. The second electronic device is adjacent to the electronic device structure. The second encapsulant encapsulates the electronic device structure and the second electronic device. A first extension line along a lateral surface of the first electronic device and a second extension line along a lateral surface of the first encapsulant define a first angle, the second extension line along the lateral surface of the first encapsulant and a third extension line along a lateral surface of the second electronic device define a second angle, and the first angle is different from the second angle.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first module, a second module, a first intermediate circuit layer, a first conductive transmission path and a second conductive transmission path. The second module is stacked on the first module. The first intermediate circuit layer is arranged between the first module and the second module. The first conductive transmission is configured to electrically connect the first semiconductor module with the first intermediate circuit layer. The second conductive transmission path is configured to electrically connect the first intermediate circuit layer with the second semiconductor module.

Abstract: A package structure includes a base material, at least one electronic device, at least one encapsulant and a plurality of dummy pillars. The electronic device is electrically connected to the base material. The encapsulant covers the electronic device. The dummy pillars are embedded in the encapsulant. At least two of the dummy pillars have different heights.