Abstract: An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.

Abstract: An electric machine for a vehicle comprising a shaft, a first one-way-clutch between the shaft and a driving member; and a second one-way-clutch between the shaft and a driven member is provided. The shaft is rotatably received within the electric machine. The first one-way-clutch transmits a first torque from the shaft to the driving member, but does not transmit a second torque from the driving member to the shaft. The second one-way-clutch transmits the second torque from the driven member to the shaft, but does not transmit the first torque from the shaft to the driven member.