Patents by Inventor Lori D. Dennis

Lori D. Dennis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip module hybrid integrated circuit with multiple power zones that provide cold spare support
    Patent number: 10854586
    Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: December 1, 2020
    Assignee: BAE Systems Information and Electronics Systems Integration Inc.
    Inventors: Lori D. Dennis, Jamie A. Bernard, Alan F. Dennis, Jane O. Gilliam, Jason F. Ross, Keith K. Sturcken, Dale A Rickard
  • MULTI-CHIP MODULE HYBRID INTEGRATED CIRCUIT WITH MULTIPLE POWER ZONES THAT PROVIDE COLD SPARE SUPPORT
    Publication number: 20200373286
    Abstract: A multi-chip module hybrid integrated circuit (MCM-HIC) provides cold spare support to an apparatus comprising a plurality of ICs and/or other circuits that are not cold spare compliant. At least one core IC and at least one cold spare chiplet are installed on an interconnecting substrate having a plurality of power zones to which power can be applied and withdrawn as needed. When powered, the cold spare chiplets serve as mediators and interfaces between the non cold spare compliant circuits. When the cold spare chiplets are at least partly unpowered, they protect all interconnected circuits, and ensure that interconnected circuits that remain powered are not hindered by unpowered interconnected circuits. Cold spare chiplets can extend across boundaries between power zones. External circuits can be exclusively interfaced to a subset of the power zones. Separate power circuits within a power zone can be sequenced during application and withdrawal of power.
    Type: Application
    Filed: May 24, 2019
    Publication date: November 26, 2020
    Applicant: BAE SYSTEMS Information and Electronic Systems Integration Inc.
    Inventors: Lori D. Dennis, Jamie A. Bernard, Alan F. Dennis, Jane O. Gilliam, Jason F. Ross, Keith K. Sturcken, Dale A Rickard