Abstract: A process for manufacturing an array of cells, including: implanting, in a body of semiconductor material of a first conductivity type, a common conduction region of the first conductivity type; forming, in the body, above the common conduction region, a plurality of active area regions of a second conductivity type and a first doping level; forming, on top of the body, an insulating layer having first and second openings; implanting first portions of the active area regions through the first openings with a doping agent of the first conductivity type, thereby forming, in the active area regions, second conduction regions of the first conductivity type; implanting second portions of the active area regions through the second openings with a doping agent of the second conductivity type, thereby forming control contact regions of the second conductivity type and a second doping level, higher than the first doping level; forming, on top of the body, a plurality of storage components, each storage component havin

Abstract: A memory device is proposed. The memory device includes a plurality of memory cells, wherein each memory cell includes a storage element and a selector for selecting the corresponding storage element during a reading operation or a programming operation. The selector includes a unipolar element and a bipolar element. The memory device further includes control means for prevalently enabling the unipolar element during the reading operation or the bipolar element during the programming operation.

Abstract: A method and a relative test structure for measuring the coupling capacitance between two interconnect lines exploits the so-called cross-talk effect and keeps an interconnect line at a constant reference voltage. This approach addresses the problem of short-circuit currents that affect known test structures, and allows a direct measurement of the coupling capacitance between the two interconnect lines. Capacitance measurements may also be used for determining points of interruption of interconnect lines. When a line is interrupted, the measured coupling capacitance is the capacitance of a single conducting branch. The position of points of interruption of an interconnect line is determined by measuring the coupling capacitance of all segments of the line with a second conducting line.

Abstract: A memory device is proposed. The memory device includes a plurality of memory cells, wherein each memory cell includes a storage element and a selector for selecting the corresponding storage element during a reading operation or a programming operation. The selector includes a unipolar element and a bipolar element. The memory device further includes control means for prevalently enabling the unipolar element during the reading operation or the bipolar element during the programming operation.

Abstract: A process for manufacturing an array of cells, including: implanting, in a body of semiconductor material of a first conductivity type, a common conduction region of the first conductivity type; forming, in the body, above the common conduction region, a plurality of active area regions of a second conductivity type and a first doping level; forming, on top of the body, an insulating layer having first and second openings; implanting first portions of the active area regions through the first openings with a doping agent of the first conductivity type, thereby forming, in the active area regions, second conduction regions of the first conductivity type; implanting second portions of the active area regions through the second openings with a doping agent of the second conductivity type, thereby forming control contact regions of the second conductivity type and a second doping level, higher than the first doping level; forming, on top of the body, a plurality of storage components, each storage component havin

Abstract: A process for manufacturing an array of cells, including: implanting, in a body of semiconductor material of a first conductivity type, a common conduction region of the first conductivity type; forming, in the body, above the common conduction region, a plurality of active area regions of a second conductivity type and a first doping level; forming, on top of the body, an insulating layer having first and second openings; implanting first portions of the active area regions through the first openings with a doping agent of the first conductivity type, thereby forming, in the active area regions, second conduction regions of the first conductivity type; implanting second portions of the active area regions through the second openings with a doping agent of the second conductivity type, thereby forming control contact regions of the second conductivity type and a second doping level, higher than the first doping level; forming, on top of the body, a plurality of storage components, each storage component havin

Abstract: An electrically erasable and programmable memory cell is provided. The memory cell includes a floating gate MOS transistor and a bipolar transistor for injecting an electric charge into the floating gate. The floating gate transistor has a source region and a drain region formed in a first well with a channel defined between the drain and source regions, a control gate region, and a floating gate extending over the channel and the control gate region. The bipolar transistor has an emitter region formed in the first well, a base region consisting of the first well, and a collector region consisting of the channel. The memory cell includes a second well that is insulated from the first well, and the control gate region is formed in the second well. Further embodiments of the present invention provide a memory including at least one such memory cell, an electronic device including such a memory, and methods of integrating a memory cell and erasing a memory cell.

Abstract: A method and a relative test structure for measuring the coupling capacitance between two interconnect lines exploits the so-called cross-talk effect and keeps an interconnect line at a constant reference voltage. This approach addresses the problem of short-circuit currents that affect known test structures, and allows a direct measurement of the coupling capacitance between the two interconnect lines. Capacitance measurements may also be used for determining points of interruption of interconnect lines. When a line is interrupted, the measured coupling capacitance is the capacitance of a single conducting branch. The position of points of interruption of an interconnect line is determined by measuring the coupling capacitance of all segments of the line with a second conducting line.

Abstract: A process for manufacturing an array of cells, including: implanting, in a body of semiconductor material of a first conductivity type, a common conduction region of the first conductivity type; forming, in the body, above the common conduction region, a plurality of active area regions of a second conductivity type and a first doping level; forming, on top of the body, an insulating layer having first and second openings; implanting first portions of the active area regions through the first openings with a doping agent of the first conductivity type, thereby forming, in the active area regions, second conduction regions of the first conductivity type; implanting second portions of the active area regions through the second openings with a doping agent of the second conductivity type, thereby forming control contact regions of the second conductivity type and a second doping level, higher than the first doping level; forming, on top of the body, a plurality of storage components, each storage component havin

Abstract: An electrically erasable and programmable memory cell is provided. The memory cell includes a floating gate MOS transistor and a bipolar transistor for injecting an electric charge into the floating gate. The floating gate transistor has a source region and a drain region formed in a first well with a channel defined between the drain and source regions, a control gate region, and a floating gate extending over the channel and the control gate region. The bipolar transistor has an emitter region formed in the first well, a base region consisting of the first well, and a collector region consisting of the channel. The memory cell includes a second well that is insulated from the first well, and the control gate region is formed in the second well. Further embodiments of the present invention provide a memory including at least one such memory cell, an electronic device including such a memory, and methods of integrating a memory cell and erasing a memory cell.

Abstract: A transistor includes a substrate region (14) of a first type (P) of conductivity in a semiconductor material layer of the same type (P) of conductivity, at least a first contact region (13) of the first type (P+) of conductivity inside the substrate region (14) and adjacent to a first terminal (C) of the transistor, a well (11) of second type (N) of conductivity placed inside the substrate region (14), wherein the well (11) of second type (N) of conductivity includes at least a second contact region (12) of a second type of conductivity (N+) adjacent to a region of a second terminal (B) of the transistor, and a plurality of third contact regions (10) of the first type of conductivity (P+) adjacent to a plurality of regions of a third terminal (E1, . . . , E3) of the transistor interposed each one (10) and other (12) by proper insulating shapes (20).

Abstract: A bipolar transistor is produced by processes employed in the manufacture of CMOS nonvolatile memory devices, and is part of an integrated circuit. The integrated circuit includes a semiconductor substrate having a first type of conductivity, a PMOS transistor formed in said substrate, an NMOS transistor formed in said substrate, and the bipolar transistor.

Abstract: A transistor includes a substrate region (14) of a first type (P) of conductivity in a semiconductor material layer of the same type (P) of conductivity, at least a first contact region (13) of the first type (P+) of conductivity inside the substrate region (14) and adjacent to a first terminal (C) of the transistor, a well (11) of second type (N) of conductivity placed inside the substrate region (14), wherein the well (11) of second type (N) of conductivity includes at least a second contact region (12) of a second type of conductivity (N+) adjacent to a region of a second terminal (B) of the transistor, and a plurality of third contact regions (10) of the first type of conductivity (P+) adjacent to a plurality of regions of a third terminal (E1, . . . , E3) of the transistor interposed each one (10) and other (12) by proper insulating shapes (20).

Abstract: A bipolar transistor is produced by processes employed in the manufacture of CMOS nonvolatile memory devices, and is part of an integrated circuit. The integrated circuit includes a semiconductor substrate having a first type of conductivity, a PMOS transistor formed in said substrate, an NMOS transistor formed in said substrate, and the bipolar transistor.