Abstract: A wheel speed sensor includes at least one sensor element, at least one signal processing circuit, as well as at least one first plastics-material housing which houses or at least partially exposes the sensor element and the signal processing circuit, wherein the sensor has a cap, in particular from metal, wherein the sensor has a clamping device which is connected so as to be integral to the cap and/or is integrated in the cap.

Abstract: A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Abstract: A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Abstract: A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Abstract: A wheel speed sensor includes at least one sensor element, at least one signal processing circuit, as well as at least one first plastics-material housing which houses or at least partially exposes the sensor element and the signal processing circuit, wherein the sensor has a cap, in particular from metal, wherein the sensor has a clamping device which is connected so as to be integral to the cap and/or is integrated in the cap.

Abstract: A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.

Abstract: A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.

Abstract: A sensor element for a motor vehicle, includes a sensor circuit for detecting a physical variable, a first housing, in which the sensor circuit is arranged, a second housing, in which the first housing is arranged, a thermoplastic, which at least partially encloses the first housing and fixes the first housing in the second housing in a positioning position, at least two positioning recesses for receiving positioning pins being formed in the first housing in order to fix the first housing in the positioning position while the first housing is being enveloped by the thermoplastic.

Abstract: A method for producing a sensor includes a circuit carrier which includes an assembly island which supports a sensor circuit for emitting a sensor signal dependent on a physical transmitting field, and an interface which is electrically connected to the assembly island and which transmits the sensor signal to a superordinate signal processing device. The method includes: Enveloping one part of the circuit carrier containing the assembly island and the sensor circuit in a first protective compound; connecting a signal transmission element to the interface; enveloping at least one part of the first protective compound and the interface to at least one part of the signal transmission element connected thereto in a second protective compound.

Abstract: A conductor track which is designed in particular for use with ultrasonic welding. The invention also relates to an associated method and to an associated use.

Abstract: A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.

Abstract: A tool for the primary shaping of a housing for a sensor which is designed to capture, via a sensing element, a physical area that is dependent on a variable to be measured, and to emit an electrical output signal on the basis of the captured physical area, including: —a mold cavity for receiving a material that molds the housing, and the sensing element, and —a box having a wall that bounds the mold cavity, wherein at least a part of the wall that bounds the mold cavity is mounted in a displaceable manner.

Abstract: A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.

Abstract: A sensor for outputting an electrical signal on the basis of a detected physical variable, including: a measuring circuit accommodated in a circuit housing and capable of contacting an external circuit by an electric signal connection; and a protective body consisting of a protective compound with an opening, the compound surrounding the circuit housing and the opening exposing part of the circuit housing. The surface of the circuit housing has a moulded element which is surrounded by the protective compound.

Abstract: A method for producing a sensor includes a circuit carrier which includes an assembly island which supports a sensor circuit for emitting a sensor signal dependent on a physical transmitting field, and an interface which is electrically connected to the assembly island and which transmits the sensor signal to a superordinate signal processing device. The method includes: Enveloping one part of the circuit carrier containing the assembly island and the sensor circuit in a first protective compound; connecting a signal transmission element to the interface; enveloping at least one part of the first protective compound and the interface to at least one part of the signal transmission element connected thereto in a second protective compound.

Abstract: A sensor for sensing a physical transmitter field dependent on a physical quantity to be measured, including: a sensor circuit for sensing the transmitter field and for outputting a sensor signal dependent on the transmitter field a circuit carrier having a first region in which at least a part of the sensor circuit is supported and a second region in which at least a first mechanical interface and a second mechanical interface for connecting the circuit carrier to a retainer are arranged, and a noise resistance element, which is arranged between the first region and the second region and which is designed to conduct structure-borne noise entering via the first mechanical interface to the second mechanical interface.

Abstract: A wiring device for wiring an electronic apparatus including an interface, a conductor track and a component fitting island that is connected to the interface via the conductor track that is set up to carry an electronic component and to make electrical contact with the interface via the electrical conductor track, wherein the component fitting island is free of a web element that is set up to hold the component fitting island on a support element during a housing process housing the component fitting island.

Abstract: The invention relates to a method for producing a sensor. In the method, a sensor element having an IC is pre-overmolded to produce a preform, wherein the preform is designed in such a way that the preform can accommodate electrical contacts for the sensor having various dimensions and/or in various positions by press fitting. The electrical contacts are pressed into holes/recesses of the preform, the connections of the IC of the sensor are connected to the electrical contacts, and the preform is inserted into an injecting mold and is overmolded to produce the finished sensor. In this way, sensors for different applications can be produced in a substantially standardized manner. The invention further relates to a sensor.

Abstract: A method for producing an electronic device, the method including: encasing an electronic assembly with a first casing material; holding the first electronic assembly encased by the first casing material over a holding element such that the holding element is spaced apart from the electronic assembly above the first casing material, and encasing the assembly retained on the holding element with a second casing material.

Abstract: A tool for the primary shaping of a housing for a sensor which is designed to capture, via a sensing element, a physical area that is dependent on a variable to be measured, and to emit an electrical output signal on the basis of the captured physical area, including:—a mould cavity for receiving a material that moulds the housing, and the sensing element, and—a box having a wall that bounds the mould cavity, wherein at least a part of the wall that bounds the mould cavity is mounted in a displaceable manner.