Patents by Inventor Lothar Maier

Lothar Maier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8076181
    Abstract: A packaging technique is described for QFNs, DFN, and other surface mount packages that allows the sides of leads to be plated with a wettable metal prior to the lead frames being singulated from the lead frame sheet. The leads of the lead frames in the sheet are shorted together and to the body of the lead frame sheet by a sacrificial interconnect structure. Chips are mounted to the lead frames and encapsulated, leaving the bottoms of the leads exposed. The lead frame sheet is then sawed along boundaries of the lead frames but not sawed through the interconnect structure. The sawing exposes at least a portion of the sides of the leads. The leads are then electroplated while the leads are biased with a bias voltage via the interconnect structure. After the plating, the lead frame sheet is sawed completely thorough the interconnect structure to singulate the lead frames and prevent the interconnect structure from shorting the leads together.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: December 13, 2011
    Assignee: Linear Technology Corporation
    Inventors: David A. Pruitt, Lothar Maier
  • Patent number: 5665639
    Abstract: A rapid thermal anneal (RTA) process minimizes the intermixing of materials between a bump and a bonding pad so as to provide for a more reliable and durable interconnect between the bump and the bonding pad and so as to allow the probing of wafers prior to bumping. A barrier layer is formed over the bonding pads of devices formed over a semiconductor substrate. Bumps are then formed over the bonding pads and are annealed for a short time at a high temperature so as to soften the bumps for later assembly in a semiconductor package. As a result of this quick annealing process, the intermixing of materials between the bumps and the bonding pads is minimized. This is so despite any decreased step coverage of the barrier layer over probe marks on the bonding pads which resulted from testing the wafer. Accordingly, wafers may now be tested prior to bumping, thus saving the cost, time, and process steps typically incurred in bumping wafers having a zero or low yield of properly functioning semiconductor devices.
    Type: Grant
    Filed: February 23, 1994
    Date of Patent: September 9, 1997
    Assignee: Cypress Semiconductor Corp.
    Inventors: Bryan R. Seppala, Todd G. Backer, Lothar Maier
  • Patent number: 5621197
    Abstract: A device for disconnecting the flow of current in the positive or impregnated battery cable of a motor vehicle has an electrically conductive plug-in connection that can be placed in the positive or impregnated battery cable in the form of a housing and a plug connector. The housing contains a gas generator of the kind used, for example, for belt tighteners. The gas generator is arranged in the housing in such a way that the propellant gas produced when the gas generator is ignited electrically separates the connector from the housing and this in turn interrupts the flow of current in the positive or impregnated battery cable. Consequently, a short circuit that might occur in the event of an accident and which could otherwise lead to damage of the cable tree and then set the vehicle on fire, is avoided in good time.
    Type: Grant
    Filed: May 17, 1995
    Date of Patent: April 15, 1997
    Assignees: TEMIC Bayern-Chemie Airbag GmbH, Bayerische Motoren Werke Aktiengesellschaft
    Inventors: Richard Bender, Christian Herget, Lothar Maier, Alfred Krappel, Robert Albiez, Maximilian Grobmair
  • Patent number: 5556131
    Abstract: Gas generator for an airbag that provides protection against side impact in a vehicle. The gas generator has a housing with a flange for attaching the gas generator to a part of the vehicle, in particular to the backrest of a vehicle seat, and for fixing the airbag. The gas generator also has a sealed fluid-tight propellant tank that acts as combustion chamber. The propellant tank is arranged concentrically in the housing such that an annular chamber is formed between the housing and the propellant tank to allow afterburning. The annular chamber can be connected on the one hand to the inside of the propellant tank through the passage that opens as a result of the burning process and on the other hand to the inside of the airbag through the outlet apertures provided in the housing wall, but otherwise it is sealed fluid-tight. The construction of the generator is therefore very simple and it is of very small size.
    Type: Grant
    Filed: March 13, 1995
    Date of Patent: September 17, 1996
    Assignee: Temic Bayern-Chemie Airbag GmbH
    Inventors: Richard Bender, Lothar Maier
  • Patent number: 3958757
    Abstract: An injection valve for the injection of fuel during a low pressure phase into a space subjected to pressure fluctuations, which includes an injection nozzle equipped with a nozzle seat that is provided with at least one nozzle aperture; the nozzle aperture is adapted to be covered off by a nozzle needle which is adapted to be lifted and is limited in its lifting movement by an abutment at least in its opening direction; the nozzle seat is thereby movable in the lifting direction of the nozzle needle.
    Type: Grant
    Filed: April 9, 1975
    Date of Patent: May 25, 1976
    Assignee: Daimler-Benz Aktiengesellschaft
    Inventors: Robert Happel, Lothar Maier
  • Pen
    Patent number: D649189
    Type: Grant
    Filed: January 11, 2011
    Date of Patent: November 22, 2011
    Assignee: Swarovski Aktiengesellschaft
    Inventor: Lothar Maier