Abstract: A method is provided for producing a stencil having a relief with multiple openings on its upper side. The contours correspond to a desired pattern and to a stencil of this type. The stencil has a body with at least one non-perforated non-metal relief layer, which allows greater relief heights and increased freedom of design. The relief layer is removed according to the pattern by laser or plasma radiation to form the multiple openings. Through-openings extending to a rear side opposite the upper side are provided at least in the bottom region of the openings of the relief. A stencil with a stencil body may be obtained, having at least one non-metal relief layer, formed in the upper side of which is a relief with multiple openings, the contours of which correspond to a desired pattern. Through-openings extending to a rear side opposite from the upper side are provided.

Abstract: A method is provided for producing a stencil having a relief with multiple openings on its upper side. The contours correspond to a desired pattern and to a stencil of this type. The stencil has a body with at least one non-perforated non-metal relief layer, which allows greater relief heights and increased freedom of design. The relief layer is removed according to the pattern by laser or plasma radiation to form the multiple openings. Through-openings extending to a rear side opposite the upper side are provided at least in the bottom region of the openings of the relief. A stencil with a stencil body may be obtained, having at least one non-metal relief layer, formed in the upper side of which is a relief with multiple openings, the contours of which correspond to a desired pattern. Through-openings extending to a rear side opposite from the upper side are provided.

Abstract: Process for producing multilayer composite structures, which comprises carrying out the following operations in succession: (a) use of power-modulated laser engraving to provide, to a female or male mold, a surface structure in the form of an image or of a pattern, where this has at least one element (D) which is not a geometric element, not a numeral, and not a letter, and where, within the surface structure, there are differences in screen angles, in depression depth, or in taper values, (b) optional molding of a female mold from the male mold, (c) spray-application of a plastics formulation onto the female mold, where the temperature of the female mold is in the range from 50 to 200° C., (d) solidification of the plastics formulation to give a film, (e) bonding the film to a substrate (A), (f) and removal of the mold, where the operations (e) and (f) can be carried out in any desired sequence.

Abstract: A method for producing a stencil, which has on its upper side a relief with a multiplicity of openings, the contours of which correspond to a desired pattern, and to a stencil of this type. In order to permit greater relief heights, and consequently increased freedom of design of patterns to be applied, the stencil is provided with a body having at least one non-perforated non-metal relief layer. The material of the relief layer is removed according to the pattern by laser or plasma radiation to form the multiplicity of openings of the relief. Through-openings which extend to a rear side opposite from the upper side are provided at least in the bottom region of the openings of the relief. A stencil with a stencil body (10) may be obtained, which has at least one non-metal relief layer, formed in the upper side of which is a relief with a multiplicity of openings, the contours of which correspond to a desired pattern.

Abstract: The invention relates to a device and to a method for applying a medium in the form of liquid, powder or paste to a substrate, having a container for the medium and a transport device which takes the medium from the container and discretely distributes it. In a propelling device the medium is selectively transferred from the transport device to the substrate with a propellant which is separate from the medium, or in the propelling device the medium is selectively removed from the transport device, and the remaining medium is transferred from the transport device to the substrate.

Abstract: A method and apparatus for continuously treating a web of fabric in a first treatment section and a second treatment section through which the web of fabric passes. The first treatment section includes a desizing station. The desizing station includes an application stage having a plurality of spray nozzles, a dwell stage, a mechanical liquid removal device and a wash stage. A first return conduit fluidly connects the wash stage to the application stage. The method includes applying a size containing size carrier on the web of fabric to desize the web of fabric. The size containing size carrier is removed from the web of fabric after the size carrier has taken effect upon the web of fabric. At least a portion of the removed size containing size carrier is added to the size carrier solution before the solution is applied to an upstream portion of the web of fabric.