Patents by Inventor Louis A. DeRosa

Louis A. DeRosa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10302516
    Abstract: A tunable pressure transducer assembly that comprises a sensing element disposed within a housing, wherein the sensing element is adapted to output a signal substantially indicative of an applied pressure, and a filter assembly also disposed within the housing. In one example embodiment, a method includes receiving, at a filter assembly having a tube, a cap and a cavity defined by a housing, a pressure, wherein the cap is positioned to set a predetermined volume of the cavity and the tube is associated with an application of the pressure to the cavity, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the tube and the cavity, at least a portion of the dynamic pressure component of the pressure to obtain a filtered pressure; outputting, from the filter assembly, the filtered pressure; and wherein the filtered pressure is used to determine the static pressure component of the pressure.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: May 28, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner
  • Patent number: 10295426
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a front seal. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; a screen joined to an adaptor and coupled to the housing, wherein a first gap separates the adaptor and the sensing element and a second gap separates the adaptor and the header; and wherein a stress applied at a front surface of the adaptor is transferred to the housing, and the first gap is used to isolate the sensing element from the stress and the second gap is used to isolate the header from the stress.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: May 21, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Publication number: 20190145844
    Abstract: The disclosed technology is a pressure transducer with a bleed valve built into the body of the transducer for purging liquid systems. The transducer assembly includes a body, a bleed valve port defined in the body and configured to accept a bleed valve, an interface port attached to the body, an adapter attached to a portion of the interface port, a header attached to the adapter and the body, a pressure transducer mounted to the header, and an internal cavity in communication with the interface port, the pressure transducer, and the bleed valve port. The bleed valve port is configured to vent a gas from the internal cavity. A bleed valve disposed in the bleed valve port is configured to controllably vent a gas from the internal cavity.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Louis DeRosa, Leo Geras, Robert Gardner
  • Publication number: 20190025145
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adapter coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adapter and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.
    Type: Application
    Filed: September 20, 2018
    Publication date: January 24, 2019
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Patent number: 10101229
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adaptor coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adaptor and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.
    Type: Grant
    Filed: February 3, 2016
    Date of Patent: October 16, 2018
    Assignee: Kulito Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Publication number: 20180238762
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a front seal. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; a screen joined to an adaptor and coupled to the housing, wherein a first gap separates the adaptor and the sensing element and a second gap separates the adaptor and the header; and wherein a stress applied at a front surface of the adaptor is transferred to the housing, and the first gap is used to isolate the sensing element from the stress and the second gap is used to isolate the header from the stress.
    Type: Application
    Filed: April 25, 2018
    Publication date: August 23, 2018
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Patent number: 9964460
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a front seal. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; a screen joined to an adaptor and coupled to the housing, wherein a first gap separates the adapter and the sensing element and a second gap separates the adapter and the header; and wherein a stress applied at a front surface of the adapter is transferred to the housing, and the first gap is used to isolate the sensing element from the stress and the second gap is used to isolate the header from the stress.
    Type: Grant
    Filed: May 2, 2016
    Date of Patent: May 8, 2018
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Publication number: 20180052069
    Abstract: The disclosed technology includes a transducer assembly having a first transducer element. The transducer assembly includes a first filter element adjacent to least of portion of the first transducer element such that a first cavity is defined between the first filter element and the first transducer element. The first filter element includes a plurality of machined passageways in communication with the first cavity. The transducer assembly also includes an inlet passage having a first end in communication with a first external portion of the transducer assembly and a second end in communication with the plurality of machined passageways.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 22, 2018
    Inventors: Robert Gardner, Louis DeRosa
  • Publication number: 20180038756
    Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.
    Type: Application
    Filed: October 20, 2017
    Publication date: February 8, 2018
    Inventors: Richard Martin, Louis DeRosa, Robert Gardner
  • Publication number: 20170363496
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.
    Type: Application
    Filed: August 29, 2017
    Publication date: December 21, 2017
    Inventors: Louis DeRosa, Robert Gardner, Richard Martin
  • Patent number: 9835512
    Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: December 5, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Richard Martin, Louis DeRosa, Robert Gardner
  • Publication number: 20170328801
    Abstract: A tunable pressure transducer assembly that comprises a sensing element disposed within a housing, wherein the sensing element is adapted to output a signal substantially indicative of an applied pressure, and a filter assembly also disposed within the housing. In one example embodiment, a method includes receiving, at a filter assembly having a tube, a cap and a cavity defined by a housing, a pressure, wherein the cap is positioned to set a predetermined volume of the cavity and the tube is associated with an application of the pressure to the cavity, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the tube and the cavity, at least a portion of the dynamic pressure component of the pressure to obtain a filtered pressure; outputting, from the filter assembly, the filtered pressure; and wherein the filtered pressure is used to determine the static pressure component of the pressure.
    Type: Application
    Filed: August 2, 2017
    Publication date: November 16, 2017
    Inventors: Louis DeRosa, Robert Gardner
  • Patent number: 9772244
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: September 26, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Richard Martin
  • Patent number: 9772248
    Abstract: This disclosure provides example systems and methods for high pressure flat plate transducer assemblies. A first example embodiment of the transducer assembly is provided, which includes a transducer, a housing, and a transducer header. The transducer header can be configured for accepting the transducer and for mating with the housing at an interface between the header back side and the housing. The first embodiment of the transducer assembly is configured such that a pressure exerted on the transducer compresses the interface between the header back side and the housing. A second example embodiment is provided that includes a one-piece housing having a built-in header portion configured for accepting the transducer. In this second embodiment, the interface adapter is configured for attaching to a mating surface and to the housing. In the second example embodiment, the transducer assembly is configured such that the pressure presses the transducer against the housing.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: September 26, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Robert Gardner, Louis DeRosa, Leo Geras, Dick Martin
  • Patent number: 9766146
    Abstract: Systems and methods for an internally switched multiple range transducer are provided. In one embodiment, a method comprises receiving, at a first sensor, a pressure, wherein the first sensor is associated with a first pressure range; measuring, at the first sensor, the pressure to generate a first pressure signal; in response to determining that the first pressure signal is not associated with the first pressure range, activating a second sensor, wherein the second sensor is associated with a second pressure range that is different from the first pressure range; and measuring, at the second sensor, the pressure to generate a second pressure signal.
    Type: Grant
    Filed: February 16, 2016
    Date of Patent: September 19, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Anthony D. Kurtz, Louis DeRosa
  • Patent number: 9752948
    Abstract: A tunable pressure transducer assembly that comprises a sensing element disposed within a housing, wherein the sensing element is adapted to output a signal substantially indicative of an applied pressure, and a filter assembly also disposed within the housing. In one example embodiment, a method includes receiving, at a filter assembly having a tube, a cap and a cavity defined by a housing, a pressure, wherein the cap is positioned to set a predetermined volume of the cavity and the tube is associated with an application of the pressure to the cavity, wherein the pressure includes a static pressure component and a dynamic pressure component; filtering, by the tube and the cavity, at least a portion of the dynamic pressure component of the pressure to obtain a filtered pressure; outputting, from the filter assembly, the filtered pressure; and wherein the filtered pressure is used to determine the static pressure component of the pressure.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: September 5, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner
  • Patent number: 9723719
    Abstract: This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.
    Type: Grant
    Filed: September 13, 2016
    Date of Patent: August 1, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner
  • Patent number: 9709452
    Abstract: Systems, methods, and apparatus for compensation of a sensor are presented. A method is provided that includes determining a response of a sensor. For example, a temperature response of a pressure sensor may be characterized. In an example implementation, the sensor may be coupled to one or more input terminals, for example, that are configured for connecting to an input voltage source. The sensor may also be coupled to one or more configurable resistor networks. The sensor may further be coupled to one or more output terminals configured for providing an output signal. The method further includes determining one or more compensation resistance values for compensating the determined response of the sensor. The method includes selectively configuring, based at least in part on determining the one or more compensation resistance values, the one or more configurable resistor networks for compensating the response of the sensor.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: July 18, 2017
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Haig Norian, Louis DeRosa, Joseph VanDeWeert
  • Publication number: 20170115176
    Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.
    Type: Application
    Filed: January 6, 2017
    Publication date: April 27, 2017
    Inventors: Richard Martin, Louis DeRosa, Robert Gardner
  • Publication number: 20170074739
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.
    Type: Application
    Filed: November 4, 2016
    Publication date: March 16, 2017
    Inventors: Louis DeRosa, Robert Gardner, Richard Martin