Abstract: A method for making a nanodiamond article includes applying an adhesion promoting layer to a substrate, and electrophoretically depositing a nanodiamond film on the substrate with the adhesion promoting layer thereon in a solution to make the nanodiamond article. The nanodiamond article may include a substrate, a nanodiamond film over the substrate, and the adhesion promoting layer between the substrate and the nanodiamond film.

Abstract: A method of forming a nanodiamond article includes forming a continuous film on a substrate using electrophoretic deposition. The continuous film includes greater than 50% nanodiamond concentration by volume. A nanodiamond article includes a continuous film on a substrate having greater than 50% nanodiamond concentration by volume.

Abstract: Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate (202) having a first surface (202a) and a second substrate (208) having a second surface (208a) facing the first surface. The system also includes a plurality of battery cell layers (106-112) disposed on a plurality of laterally spaced areas on the first and second surfaces (203, 209). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells (206, 212) on the first and the second surfaces that are laterally spaced apart and that define one or more batteries.

Abstract: Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate (202) having a first surface (202a) and a second substrate (208) having a second surface (208a) facing the first surface. The system also includes a plurality of battery cell layers (106-112) disposed on a plurality of laterally spaced areas on the first and second surfaces (203, 209).

Abstract: Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate (202) having a first surface (202a) and a second substrate (208) having a second surface (208a) facing the first surface. The system also includes a plurality of battery cell layers (106-112) disposed on a plurality of laterally spaced areas on the first and second surfaces (203, 209). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells (206, 212) on the first and the second surfaces that are laterally spaced apart and that define one or more batteries (200).

Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof.

Abstract: A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof.

Abstract: A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.

Abstract: Methods for fabrication of electronic systems and systems therefrom are provided. An electronic system includes a first substrate (202) having a first surface (202a) and a second substrate (208) having a second surface (208a) facing the first surface. The system also includes a plurality of battery cell layers (106-112) disposed on a plurality of laterally spaced areas on the first and second surfaces (203, 209). In the system, portions of the battery cell layers on the first surface are in physical contact with portions of the battery cell layers on the second surface and the battery cell layers on the first surface and the second surface form a plurality of electrically interconnected battery cells (206, 212) on the first and the second surfaces that are laterally spaced apart and that define one or more batteries (200).

Abstract: A method for forming a circuit board is provided. The method includes forming a circuit board substrate (112) from a circuit board material. The method also includes positioning the circuit board substrate on a rigid structure (114) having a three dimensional contoured surface (300). The method further includes applying heat and applying pressure to the circuit board substrate to at least partially conform the circuit board substrate to the three dimensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit board substrate prior to the steps of applying heat and applying pressure. However, if the circuit board substrate (112) is an unclad circuit board substrate, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.