Abstract: An antenna package for use in a wireless communications device. The package includes a metallic leadframe section having a plurality of leads and a paddle shaped as a planar antenna, and dielectric material encapsulating the paddle and portions of the leads.

Abstract: Reservoir cavities have been used successfully to achieve proper mold filling of large area substrate packages with severe leading and lagging of flow fronts in the cavity halves, The additional plastic required to fill the reservoir cavities and the additional work in removing the reservoir culls is minimal, Reservoir cavities have been shown to eliminate void problems in molded packages with large printed wiring board substrates,

Abstract: As the size and consequent thickness of IC packages shrink bowing of the package due to differential contractions becomes a problem. The solution according to this invention is to mold strain relief grooves into the surface of the plastic package.

Abstract: An optical communication arrangement is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. A first molding operation is then performed to encapsulate the electronics. If necessary, a metallic plate may then be attached to the housed electronics to provide EMI shielding. An optical device is then coupled to the leadframe, where a separate subassembly may be used to house the optical device. The encapsulated electronics and optics are then simultaneously covered during a second molding operation to form the final package. In one embodiment, an optical subassembly incorporating a connector receptacle may be utilized, where the second molding operation is performed such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.

Abstract: Disclosed is a planar optical waveguide that is manufacturable by the compression molding or embossing of a multilayer film of polymeric material. In one embodiment, the waveguide comprises a core layer of relatively high refractive index included between cladding layers of lower refractive index. The waveguiding channels are bounded by regions where the cladding layers are in contact and from which core material has been excluded.

Abstract: An article comprised of a body having a conductor pattern on at least one non-planar and non-flexible surface thereof. The article is prepared by using a three-dimensional mask having an interior surface which is a mirror image replica of the surface of the body on which the conductors are to be formed. The surface of the body is provided with material which is capable of initiating conductor formation. The interior surface of the mask then is placed over the body and in substantial registry therewith. The mask and the body then are exposed to radiation or moving material to delineate the conductor pattern. Subsequently, the mask is removed and conductors are formed.

Abstract: Articles made by the reaction injection molding process obtain a reduced residence time in the mold, hence increasing the production rate, by choosing processing and material parameters according to the inventive method. This method makes use of material parameters and processing conditions, including temperature and cavity shape for determining the viscosity of prepolymer material as it solidifies in the cavity. This information is used to optimize fluid injection rates, temperature of the fluid or cavity wall, choice of reactive fluid, or shape of the cavity. Articles having more complex geometries than previously obtained can be produced when the cavity filling is mathematically simulated according to the present procedure, typically by means of a computer. This can ensure against blockage of critical passages in the cavity, polymer degradation, etc.

Abstract: Silicon tetrachloride is processed to ultrahigh purity by subjecting it to a specific succession of purification steps. These steps include the photochlorination of the SiCl.sub.4 using a reactor that allows a long residence time for the SiCl.sub.4. After photochlorination, highly volatile products such as HCl are removed and the remaining impurities are then separated by a distillation technique.