Patents by Inventor Louis Vintro

Louis Vintro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
    Patent number: 8494802
    Abstract: Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.
    Type: Grant
    Filed: June 19, 2009
    Date of Patent: July 23, 2013
    Assignee: KLA-Tencor Corp.
    Inventors: Haiguang Chen, Daniel Kavaldjiev, Louis Vintro, George Kren
  • Computer-implemented methods for inspecting and/or classifying a wafer
    Patent number: 8269960
    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
    Type: Grant
    Filed: July 24, 2008
    Date of Patent: September 18, 2012
    Assignee: KLA-Tencor Corp.
    Inventors: Juergen Reich, Louis Vintro, Prasanna Dighe, Andrew Steinbach, Daniel Kavaldjiev, Stephen Biellak
  • COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS FOR DETERMINING ONE OR MORE CHARACTERISTICS OF A WAFER
    Publication number: 20110196639
    Abstract: Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.
    Type: Application
    Filed: June 19, 2009
    Publication date: August 11, 2011
    Applicant: Kla-Tencor Corporation
    Inventors: Haiguang Chen, Daniel Kavaldjiev, Louis Vintro, George Kren
  • COMPUTER-IMPLEMENTED METHODS FOR INSPECTING AND/OR CLASSIFYING A WAFER
    Publication number: 20100060888
    Abstract: Computer-implemented methods for inspecting and/or classifying a wafer are provided. One computer-implemented includes detecting defects on a wafer using one or more defect detection parameters, which are determined based on a non-spatially localized characteristic of the wafer that is determined using output responsive to light scattered from the wafer generated by an inspection system. Another computer-implemented method includes classifying a wafer based on a combination of a non-spatially localized characteristic of the wafer determined using output responsive to light scattered from the wafer generated by an inspection system and a spatially localized characteristic of the wafer determined using the output.
    Type: Application
    Filed: July 24, 2008
    Publication date: March 11, 2010
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Juergen Reich, Louis Vintro, Prasanna Dighe, Andrew Steinbach, Daniel Kavaldjiev, Stephen Biellak