Patents by Inventor Low Peng Wang

Low Peng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and methods for forming wire bonds
    Patent number: 8444044
    Abstract: A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: May 21, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Low Peng Wang, Mitchell Ong, Lee Choon Kuan
  • Package structure for multiple die stack
    Patent number: 7906853
    Abstract: A die module and method for assembling such a die module is provided. For example, present embodiments include providing a substrate and coupling a first sub-stack to the substrate, wherein the first sub-stack includes two or more die arranged in a first shingle stack configuration relative to one another such that an upper portion of each die in the first sub-stack is accessible, the first shingle stack configuration having a first skew. Further, present embodiments include stacking a second sub-stack on top of the first sub-stack, wherein the second sub-stack includes two or more die arranged in a second shingle stack configuration relative to one another such that an upper portion of each die in the second sub-stack is accessible, the second shingle stack configuration having a second skew that is different than the first skew.
    Type: Grant
    Filed: September 6, 2007
    Date of Patent: March 15, 2011
    Assignee: Micron Technology, Inc.
    Inventor: Low Peng Wang
  • APPARATUS AND METHODS FOR FORMING WIRE BONDS
    Publication number: 20090223937
    Abstract: A wire bonding apparatus includes a processing block, a bond head assembly and an infrared radiation source for selectively heating the bond pad areas of one or more semiconductor dies and/or bonding sites on a substrate. Methods for forming wire bonds using selective heating of the bond pad areas of one or more semiconductor dies and/or bonding sites on the substrate are also disclosed.
    Type: Application
    Filed: April 4, 2008
    Publication date: September 10, 2009
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Low Peng Wang, Mitchell Ong, Lee Choon Kuan
  • Package structure for multiple die stack
    Publication number: 20090065948
    Abstract: A die module and method for assembling such a die module is provided. For example, present embodiments include providing a substrate and coupling a first sub-stack to the substrate, wherein the first sub-stack includes two or more die arranged in a first shingle stack configuration relative to one another such that an upper portion of each die in the first sub-stack is accessible, the first shingle stack configuration having a first skew. Further, present embodiments include stacking a second sub-stack on top of the first sub-stack, wherein the second sub-stack includes two or more die arranged in a second shingle stack configuration relative to one another such that an upper portion of each die in the second sub-stack is accessible, the second shingle stack configuration having a second skew that is different than the first skew.
    Type: Application
    Filed: September 6, 2007
    Publication date: March 12, 2009
    Inventor: Low Peng Wang