Patents by Inventor Lu Fei
Lu Fei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240137465Abstract: A computer-implemented method for managing information during a web conference is provided. The computer-implemented method includes collecting and formatting meeting application information at a processor of a computing device having a screen being shared with attendees of the web conference and collecting and formatting to-be-popup application information at the processor. The computer-implemented method further includes analyzing, by the processor, an urgency of the to-be-popup application information and a correlation between the to-be-popup application information and the meeting application information and determining, by the processor, whether to share the to-be-popup application information with a user of the computing device and with the attendees based on results of the analyzing.Type: ApplicationFiled: October 18, 2022Publication date: April 25, 2024Inventors: Jia Liu, Zhan Peng Huo, Qi Li, Yan Fei Qin, Lu Yan Li
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Patent number: 11699615Abstract: A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.Type: GrantFiled: August 25, 2021Date of Patent: July 11, 2023Assignee: GlobalWafers Co., Ltd.Inventors: Igor Peidous, Lu Fei, Jeffrey L. Libbert, Andrew M. Jones, Alex Usenko, Gang Wang, Shawn George Thomas, Srikanth Kommu
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Publication number: 20210384070Abstract: A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.Type: ApplicationFiled: August 25, 2021Publication date: December 9, 2021Inventors: Igor Peidous, Lu Fei, Jeffrey L. Libbert, Andrew M. Jones, Alex Usenko, Gang Wang, Shawn George Thomas, Srikanth Kommu
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Patent number: 11139198Abstract: A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.Type: GrantFiled: December 28, 2018Date of Patent: October 5, 2021Assignee: GlobalWafers Co., Ltd.Inventors: Igor Peidous, Lu Fei, Jeffrey L. Libbert, Andrew M. Jones, Alex Usenko, Gang Wang, Shawn George Thomas, Srikanth Kommu
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Publication number: 20200347513Abstract: This application provides an epitaxial wafer processing method, the processing method comprises providing an epitaxial wafer; measuring the flatness of the epitaxial wafer; performing vapor phase etching for the epitaxial wafer not meet the standard; growing epitaxial layer on the epitaxial wafer after the vapor phase etching. Compared with the traditional polishing rework process, the vapor phase etching for the epitaxial wafer of this application is much simpler and faster, therefore it can improve the production yield.Type: ApplicationFiled: April 6, 2020Publication date: November 5, 2020Inventors: Huajie Wang, Lu Fei, Gongbai Cao, Chihhsin Lin
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Patent number: 10529590Abstract: The present disclosure provides an annealing method for improving interface bonding strength of a wafer. The method includes: providing a substrate, the substrate having a bonding interface; performing a first annealing step, wherein the first annealing step is practiced in an oxygen-containing atmosphere, and an oxidation protection layer is formed on a surface of the substrate through the annealing step; and performing a second annealing step upon the first annealing step, wherein a temperature of the second annealing step is higher than that of the first annealing step, and the second annealing step is practiced in a nitrogen-free environment.Type: GrantFiled: February 27, 2018Date of Patent: January 7, 2020Assignee: Shanghai Simgui Technology Co., Ltd.Inventors: Xing Wei, Yongwei Chang, Meng Chen, Guoxing Chen, Lu Fei, Xi Wang
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Patent number: 10483152Abstract: A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.Type: GrantFiled: November 16, 2015Date of Patent: November 19, 2019Assignee: GlobalWafers Co., Ltd.Inventors: Igor Peidous, Lu Fei, Jeffrey L. Libbert, Andrew M. Jones, Alex Usenko, Gang Wang, Shawn George Thomas, Srikanth Kommu
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Patent number: 10475973Abstract: A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.Type: GrantFiled: June 5, 2017Date of Patent: November 12, 2019Assignee: LUMILEDS LLCInventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
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Patent number: 10388529Abstract: A method for preparing a substrate with an insulating buried layer includes: providing a substrate, the substrate having a supporting layer and an insulating layer arranged on a surface of the supporting layer; performing first ion implantation, implanting modified ions into the substrate, wherein a distance from an interface between the insulating layer and the supporting layer to a Gaussian distribution peak of modified ion concentration is less than 50 nm, such that the modified ions form a nano cluster in the insulating layer; and performing a second ion implantation, continuing to implant the modified ions into the insulating layer, wherein the ions are implanted in the same way as the first ion implantation, and a distance from a Gaussian distribution peak of modified ion concentration in this step to the Gaussian distribution peak of modified ion concentration in the first ion implantation is less than 80 nm.Type: GrantFiled: February 26, 2018Date of Patent: August 20, 2019Assignee: SHANGHAI SIMGUI TECHNOLOGY CO., LTD.Inventors: Xing Wei, Yongwei Chang, Meng Chen, Guoxing Chen, Lu Fei, Xi Wang
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Patent number: 10361114Abstract: The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: implanting bubbling ions into the semiconductor substrate to form a splitting layer, and implanting modified ions into the insulating layer to form a nano cluster; providing a supporting substrate; bonding the supporting substrate to the semiconductor substrate by using the insulating layer as an intermediate layer; performing a first heat treatment for the bonded substrate such that a splitting layer is formed at the position where the bubbling ions are implanted, and causing the semiconductor substrate to split at the position of the splitting layer; performing rapid thermal annealing for the substrate; and performing a second heat treatment for the rapidly thermally annealed semiconductor substrate to consolidate the bonding interface and form the nano cluster at the position where the modified ions are implanted.Type: GrantFiled: February 26, 2018Date of Patent: July 23, 2019Assignee: SHANGHAI SIMGUI TECHNOLOGY CO., LTD.Inventors: Xing Wei, Yongwei Chang, Meng Chen, Guoxing Chen, Lu Fei, Xi Wang
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Publication number: 20190139818Abstract: A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.Type: ApplicationFiled: December 28, 2018Publication date: May 9, 2019Inventors: Igor Peidous, Lu Fei, Jeffrey L. Libbert, Andrew M. Jones, Alex Usenko, Gang Wang, Shawn George Thomas, Srikanth Kommu
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Publication number: 20180330964Abstract: The present disclosure provides an annealing method for improving interface bonding strength of a wafer. The method includes: providing a substrate, the substrate having a bonding interface; performing a first annealing step, wherein the first annealing step is practiced in an oxygen-containing atmosphere, and an oxidation protection layer is formed on a surface of the substrate through the annealing step; and performing a second annealing step upon the first annealing step, wherein a temperature of the second annealing step is higher than that of the first annealing step, and the second annealing step is practiced in a nitrogen-free environment.Type: ApplicationFiled: February 27, 2018Publication date: November 15, 2018Applicant: Shanghai Simgui Tehcnology Co., Ltd.Inventors: Xing WEI, Yongwei CHANG, Meng CHEN, Guoxing CHEN, Lu FEI, Xi WANG
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Publication number: 20180197741Abstract: A method for preparing a substrate with an insulating buried layer includes: providing a substrate, the substrate having a supporting layer and an insulating layer arranged on a surface of the supporting layer; performing first ion implantation, implanting modified ions into the substrate, wherein a distance from an interface between the insulating layer and the supporting layer to a Gaussian distribution peak of modified ion concentration is less than 50 nm, such that the modified ions form a nano cluster in the insulating layer; and performing a second ion implantation, continuing to implant the modified ions into the insulating layer, wherein the ions are implanted in the same way as the first ion implantation, and a distance from a Gaussian distribution peak of modified ion concentration in this step to the Gaussian distribution peak of modified ion concentration in the first ion implantation is less than 80 nm.Type: ApplicationFiled: February 26, 2018Publication date: July 12, 2018Applicant: Shanghai Simgui Tehcnology Co., Ltd.Inventors: Xing WEI, Yongwei CHANG, Meng CHEN, Guoxing CHEN, Lu FEI, Xi WANG
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Publication number: 20180190539Abstract: The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: implanting bubbling ions into the semiconductor substrate to form a splitting layer, and implanting modified ions into the insulating layer to form a nano cluster; providing a supporting substrate; bonding the supporting substrate to the semiconductor substrate by using the insulating layer as an intermediate layer; performing a first heat treatment for the bonded substrate such that a splitting layer is formed at the position where the bubbling ions are implanted, and causing the semiconductor substrate to split at the position of the splitting layer; performing rapid thermal annealing for the substrate; and performing a second heat treatment for the rapidly thermally annealed semiconductor substrate to consolidate the bonding interface and form the nano cluster at the position where the modified ions are implanted.Type: ApplicationFiled: February 26, 2018Publication date: July 5, 2018Applicant: Shanghai Simgui Tehcnology Co., Ltd.Inventors: Xing WEI, Yongwei CHANG, Meng CHEN, Guoxing CHEN, Lu FEI, Xi WANG
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Publication number: 20180182662Abstract: The present disclosure provides a method for preparing a substrate with a carrier trapping center. The method includes: injecting bubbling ions into the semiconductor substrate to form a splitting layer, and injecting modified ions into the insulating layer to form a nano cluster; providing a supporting substrate; bonding the supporting substrate to the semiconductor substrate by using the insulating layer as an intermediate layer; performing a first heat treatment for the bonded substrate such that a splitting layer is formed at the position where the bubbling ions are injected, and causing the semiconductor substrate to split at the position of the splitting layer; thinning a splitting surface of the split semiconductor substrate; and performing a second heat treatment for the thinned semiconductor substrate to consolidate the bonding interface and form the nano cluster at the position where the modified ions are injected.Type: ApplicationFiled: February 23, 2018Publication date: June 28, 2018Applicant: Shanghai Simgui Tehcnology Co., Ltd.Inventors: Xing WEI, Yongwei CHEN, Meng CHEN, Guoxing CHEN, Lu FEI, Xi WANG
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Publication number: 20170316968Abstract: A semiconductor on insulator multilayer structure is provided. The multilayer comprises a high resistivity single crystal semiconductor handle substrate, an optionally relaxed semiconductor layer comprising silicon, germanium, or silicon germanium, an optional polycrystalline silicon layer, a dielectric layer, and a single crystal semiconductor device layer.Type: ApplicationFiled: November 16, 2015Publication date: November 2, 2017Applicant: SunEdison Semiconductor Limited (UEN201334164H)Inventors: Igor Peidous, Lu Fei, Jeffrey L. Libbert, Andrew M. Jones, Alex Usenko, Gang Wang, Shawn George Thomas, Srikanth Kommu
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Publication number: 20170288109Abstract: A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.Type: ApplicationFiled: June 5, 2017Publication date: October 5, 2017Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
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Patent number: 9691959Abstract: A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.Type: GrantFiled: January 7, 2015Date of Patent: June 27, 2017Assignee: Koninklijke Philips N.V.Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
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Publication number: 20160315237Abstract: A packaged light emitting device die includes a package body having a profiled leadframe embedded in a body of reflecting material. The leadframe is exposed on mounting surface only on at least one solder bonding area. Solder is present only on the at least one solder bonding area and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe. Moreover, the reflecting material can function as a solder resist to self-align the solder to the at least one solder bonding area.Type: ApplicationFiled: January 7, 2015Publication date: October 27, 2016Inventors: Paul Dijkstra, Aernout Reints Bok, Pascal Johannes Theodorus Lambertus Oberndorff, Lu Fei Zhang, Boudewijn Ruben De Jong, Marcus Franciscus Donker
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Patent number: 9343379Abstract: This invention generally relates to a process for detecting grown-in-defects in a semiconductor silicon substrate. The process includes contacting a surface of the semiconductor silicon substrate with a gaseous acid in a reducing atmosphere at a temperature and duration sufficient to grow grown-in -defects disposed in the semiconductor silicon substrate to a size capable of being detected by an optical detection device.Type: GrantFiled: October 4, 2011Date of Patent: May 17, 2016Assignee: SunEdison Semiconductor LimitedInventors: Jeffrey L. Libbert, Lu Fei