Abstract: A method for recognizing polluted seawater areas based on high-resolution remote sensing images includes performing automatic sea and land classification on a remote sensing image by using a supervised learning algorithm. The classification result reaches a higher precision level by processized iterative clustering compared to conventional methods. The method further includes combining a chlorophyll-associated normalized difference vegetation index, a brightness-associated normalized difference water shadow index, a segmentation-based image interpretation thought and a human visual saliency-based mechanism in remote sensing interpretation by virtue of a chlorophyll concentration difference of a seawater polluted area and surrounding seawater and a brightness difference of pollutant shadows. The seawater polluted area is extracted by threshold segmentation. An area where the water quality is good and a heavily polluted area are extracted. A pollution transition area is further extracted.

Abstract: A conveyance unit mounted to a machine for initial processing of natural raw rubber into aged rubber product, includes: a discharge delivery belt connected with the machine to receive the aged rubber product; a vibration delivery device connected to the discharge delivery belt to selectively delivery the aged rubber product from the discharge delivery belt; a drying and cooling device, comprising an elongated channel body and a circulation system mounted therein, wherein the rubber product is entered from one end of the elongated channel body while being dewatered and left from the other end of the elongated channel body, wherein the circulation system is operated to provide wind inside the elongated channel body for drying and cooling the rubber product; and a cutting device connected to the elongated channel body of the drying and cooling device to cut the dried rubber product into aged product.

Abstract: The present invention discloses a cathode material for a sodium ion battery and a preparation method and application thereof. The general chemical formula of the cathode material is Na1+aMyZnxO2+c, where ?0.40?a?0.25, 0.1<x?0.22, 0.78<y?0.93, ?0.3<c<0.3. M is one or a combination of two or more selected from the group consisting of Mn, Fe, Ni, Co, Al, Zr, Y, Ca, Li, Rb, Cs, W, Ce, Mo, Ba, Ti, Mg, Ta, Nb, V, Sc, Sr, B and Cu. In the powder X-ray diffraction graph, there are at least five diffraction peaks exist when 2? is 30°-40°. A minor strong peak exist when 2? is around 16° and a major strong peak exists when 2? is around 41°. The sodium ion cathode material of the present invention has a low residual alkali content and avoids the occurrence of gelation phenomenon in the battery slurrying process. In addition, the capacity and rate of the sodium ion battery prepared therefrom are at a relatively high level.

Abstract: Techniques related to training and implementing a bidirectional pairing architecture for object detection are discussed. Such techniques include generating a first enhanced feature map for each frame of a video sequence by processing the frames in a first direction, generating a second enhanced feature map for frame by processing the frames in a second direction opposite the first, and determining object detection information for each frame using the first and second enhanced feature map for the frame.

Abstract: A high-nickel cathode material for lithium ion batteries and a preparation method and application thereof. The high-nickel cathode material contains elements shown in and constituting the chemical formula 1 thereof Li1+aNibMncAdO2, where 0.01?a?0.24, 0.79<b?0.96, 0.01<c?0.20, 0<d?0.06; and A is selected from any one or two or more of Mn, Co, Al, Zr, Y, Rb, Cs, W, Ce, Mo, Ba, Ti, Mg, Ta, Nb, Ca, V, Sc, Sr and B, or from a phosphorus-containing compound containing at least one of Ti, Al, Mg, Zr, La and Li. The high-nickel cathode material of the lithium ion battery of the present invention has better cycling performance, higher capacity, and a relatively small increase in resistance during cycling of the battery.

Abstract: Described and provided herein are novel antibodies for Claudin 18.2. Also described and provided are pharmaceutical compositions of the antibodies and methods of use for the treatment of cancer.

Abstract: Disclosed are a composition for use in photoelectronic component encapsulated, an encapsulation structure and a photoelectronic component. The composition includes 10%˜70% of a photocurable monomer; 10%˜70% of a monofunctional or trifunctional silicon-containing monomer; and 0.5%˜10% of an initiator. The use of the silicon-containing monomer, on the one hand, because of the strong distensibility of Si—O—Si chain segment of self, provides a stress dispersing effect upon impact, reduces internal stress, and increases the mechanical performance of the organic encapsulation composition; and on the other hand, effectively increases the thermal performance and hydrophobicity of the organic encapsulation composition. Film packaging for use in the photoelectronic component may effectively increase the service life of the component.

Abstract: A data annotation method for image segmentation includes performing training using an annotated training sample set to obtain a data annotation model, inputting an original image sample to the data annotation model to obtain an automatic annotation result corresponding to the original image sample, visually presenting the automatic annotation result together with the original image sample based on a preset annotation strategy, receiving correction to the automatic annotation result and converting the received correction into a corrected annotation result based on the annotation strategy, and optimizing the data annotation model using the corrected annotation result and the original image sample together as a new annotated training sample.

Abstract: A method for fabricating memory device includes: providing a substrate having a bottom electrode layer therein, forming a buffer layer and a mask layer on the buffer layer over the substrate, in contact with the bottom electrode layer, performing an advanced oxidation process on a sidewall of the buffer layer to form a resistive layer, which surrounds the whole sidewall of the buffer layer and extends upward vertically from the substrate, and forming, over the substrate, a noble metal layer and a top electrode layer on the noble metal layer, fully covering the resistive layer and the mask layer.

Abstract: The present application relates to an image processing method and system. The method includes: determining an enhanced image of a target object of an input image based on a segmentation algorithm, where the enhanced image of the target object comprises an image in which each pixel classified as the target object is displayed in an enhanced manner; and determining a positioning image of the target object by applying an integral image algorithm to the enhanced image of the target object.

Abstract: Embodiments of this application provide a short-range communications apparatus, a chip, and a control method. The apparatus includes: a gain unit, coupled to an antenna; a first radio frequency RF receive channel, coupled to the gain unit; a first baseband processor, coupled to the first RF receive channel, and configured to receive a first signal from the antenna through the first RF receive channel; a second RF receive channel, coupled to the gain unit; and a second baseband processor, coupled to the second RF receive channel, and configured to receive a second signal from the antenna through the second RF receive channel.

Abstract: A substrate is described with a thermal dissipation structure sintered to thermal vias. In one example, a microelectronic module includes a recess between first and second substrate surfaces. One or more thermal vias extend between the first substrate surface and the interior recess surface, wherein each of the thermal vias has an interior end exposed at the interior recess surface. A sintered metal layer is in the recess and in physical contact with the interior end of the thermal vias and a thermal dissipation structure is in the recess over the sintered metal layer. The thermal dissipation structure is attached to the substrate within the recess by the sintered metal layer, and the thermal dissipation structure is thermally coupled to the thermal vias through the sintered metal layer.

Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.

Abstract: A touch control test device and a touch control test method are provided, and the touch control test device includes: a telescopic mechanism with an adjustable length; a touch control component connected to the telescopic mechanism so that the telescopic mechanism is configured to drive the touch control component to tap the touch screen; an acquisition unit configured to acquire an actual detection coordinate point where the touch control component taps the touch screen; a calculation unit configured to calculate a touch control coordinate error between a target coordinate point corresponding to the actual detection coordinate point where the touch control component taps the touch screen and the actual detection coordinate point. The touch test device can achieve a tap touch control test of the touch screen.

Abstract: Radio frequency (RF) packages containing multilevel power substrates and associated fabrication methods are disclosed. In an embodiment, the method includes producing a multilevel substrate panel by obtaining a base panel level containing prefabricated base structures and having a surface through which metallic surfaces of the prefabricated base structures are exposed. A secondary panel level is formed on the base layer to include patterned metal features embedded in a secondary dielectric body and electrically contacting the exposed metallic surfaces of the prefabricated base structures at a direct plated interface. The presingulated array of multilevel power substrates is separated into singulated multilevel power substrates each including a base substrate level formed from a singulated piece of the base panel level and a secondary substrate level formed from a singulated piece of the secondary substrate level.

Abstract: Provided is a vision sensing device including a housing, a camera, a laser pattern generator, an inertial measurement unit, and at least one processor configured to project a laser pattern within the field of view of the camera, capture inertial data from the inertial measurement unit as a user moves the housing, capture visual data from the field of view with the camera as the user moves the housing, capture depth data with the laser pattern generator as the user moves the housing, and generate an RGB-D point cloud based on the visual data, the inertial data, and the depth data.

Abstract: Radio frequency (RF) packages containing substrates having coefficient of thermal expansion (CTE) matched mount pads are disclosed, as are methods for fabricating RF packages and substrates. In embodiments, the RF package contains a high thermal performance substrate including a metallic base structure, which has a frontside facing a first RF power die and a first die attach region on the frontside of the base structure. A first CTE matched mount pad is bonded to the metallic base structure and covers the first die attach region. The first CTE mount pad has a CTE greater than the CTE of RF power die and less than the CTE of the metallic base structure. An electrically-conductive bonding material attaches the RF power die to the first CTE matched mount pad, while RF circuitry integrated into first RF power die is electrically coupled to the metallic base structure through the mount pad.

Abstract: A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.

Abstract: A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

Abstract: A circuit board and a display device are provided. The circuit board has a device area and a peripheral area surrounding the device area. The circuit board includes a substrate, a metal layer, a first insulating layer, an adhesive layer, and an adhesive overflow detection line. The metal layer, the first insulating layer, and the adhesive layer are disposed at a same side of the substrate. The metal layer and the first insulating layer cover at least a part of the peripheral area. The metal layer is disposed between the first insulating layer and the substrate. The adhesive layer is disposed at a side of the first insulating layer away from the substrate and in the peripheral area.