Patents by Inventor Lucianna Capello

Lucianna Capello has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for stabilizing a bonding interface, located within a structure which comprises an oxide layer and structure obtained
    Patent number: 9659777
    Abstract: The invention relates to a process for stabilizing a bonding interface, located within a structure for applications in the fields of electronics, optics and/or optoelectronics and that comprises an oxide layer buried between an active layer and a receiver substrate, the bonding interface having been obtained by molecular adhesion. In accordance with the invention, the process further comprises irradiating this structure with a light energy flux provided by a laser, so that the flux, directed toward the structure, is absorbed by the energy conversion layer and converted to heat in this layer, and in that this heat diffuses into the structure toward the bonding interface, so as to thus stabilize the bonding interface.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: May 23, 2017
    Assignee: Soitec
    Inventors: Didier Landru, Carole David, Ionut Radu, Lucianna Capello, Yann Sinquin
  • PROCESS FOR STABILIZING A BONDING INTERFACE, LOCATED WITHIN A STRUCTURE WHICH COMPRISES AN OXIDE LAYER AND STRUCTURE OBTAINED
    Publication number: 20140357093
    Abstract: The invention relates to a process for stabilizing a bonding interface, located within a structure for applications in the fields of electronics, optics and/or optoelectronics and that comprises an oxide layer buried between an active layer and a receiver substrate, the bonding interface having been obtained by molecular adhesion. In accordance with the invention, the process further comprises irradiating this structure with a light energy flux provided by a laser, so that the flux, directed toward the structure, is absorbed by the energy conversion layer and converted to heat in this layer, and in that this heat diffuses into the structure toward the bonding interface, so as to thus stabilize the bonding interface.
    Type: Application
    Filed: December 13, 2012
    Publication date: December 4, 2014
    Inventors: Didier Landru, Carole David, Ionut Radu, Lucianna Capello, Yann Sinquin