Patents by Inventor Lucky F. Marty

Lucky F. Marty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers
    Patent number: 5655951
    Abstract: The present invention is a method for selectively reconditioning a polishing pad used in chemical-mechanical planarization of semiconductor wafers. A desired polishing rate is selected based upon a set of operating parameters for a specific wafer. The set of operating parameters may be different from those of previously planarized wafers. A desired change in the thickness of the pad material is estimated for reconditioning the pad to achieve a desired polishing rate. The estimate of the desired change in pad thickness is based upon the desired polishing rate and a predetermined correlation between wafer polishing rates and changes in pad thickness per conditioning cycle. A layer of material having a thickness substantially equal to the desired change in thickness is then removed from the planarizing surface to create a new planarizing surface.
    Type: Grant
    Filed: September 29, 1995
    Date of Patent: August 12, 1997
    Assignee: Micron Technology, Inc.
    Inventors: Scott G. Meikle, Lucky F. Marty