Abstract: A method and apparatus for regulating a temperature of a device in a tool used in a wellbore is disclosed. The device generally includes a substrate and a heat source associated with the substrate that induces heat into the substrate. The substrate includes a fluid channel therein. A fluid system provides the fluid into the fluid channel and out of the fluid channel to control the temperature of the component.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

Abstract: The invention relates to a method of singulating thin chips from a sawn wafer, comprising the steps of glueing the wafer first onto a carrier and sawing it then into individual chips on said carrier. Subsequently, the chips are detached from the carrier individually or in groups. The method is so conceived that carrier is a rigid board and the adhesive is heat-soluble, the adhesive being deactivated with the aid of heat passing either through the chip itself or through the carrier prior to the detachment of said chips, whereupon the respective chip is detached.

Abstract: The invention relates to a method for the connection of micro-chip modules to antennas arranged on a first carrier tape for the manufacture of a transponder, in which the chip modules are first applied to a second carrier tape and both carrier tapes are wound off the reel and brought one above the other, whereby the chip modules are released from the second carrier tape and placed at a predetermined point on the first carrier tape. Release is implemented in a simple manner in that the second carrier tape is diverted at a sharp edge and peels off the back of the chip module.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

Abstract: For the engraving of a pattern into the surface of a work piece by a laser beam which is directed onto the surface and controlled in its intensity in a location-dependent manner in dependence on the pattern, one surface area of a design pattern is, first of all, scanned optically or mechanically, and the surface information which is thus obtained is converted into electrical control signals. The laser beam is, by these control signals, controlled in a surface area which corresponds to the surface area of the design pattern. Different patterns can be engraved rapidly and easily by changing the design pattern. The scanning of the design pattern can be carried out finely and with high resolution, so that the engraving also has a correspondingly high resolution. The pattern of the design patterns can be as irregular as desired, so that complicated and irregular patterns can be engraved.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.