Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.

Abstract: A semiconductor package and a method of manufacturing a semiconductor package.

Abstract: A flex circuit package includes a package body enclosing an electronic component and a first surface of the substrate. Columns are physically and electrically connected to first traces of the substrate, the columns extending through the package body. A flexible circuit connector has first terminals connected to the columns. The flexible circuit connector further includes second terminals that provide an electrical interconnection structure for electrical connection to a second electronic component structure. By connecting the flexible circuit connector to the columns extending through the package body, special routing of traces of the substrate of the flex circuit package to provide an interface for the flexible circuit connector is avoided.

Abstract: A method of forming a stackable plasma cleaned via package includes forming interconnection balls on terminals. The interconnection balls are encapsulated in a package body, e.g., molding compound. Via apertures are formed through the package body to expose the interconnection balls, wherein a contamination is formed on the interconnection balls. The contamination is removed using a plasma cleaning process. By removing the contamination, robust reflow of the interconnection balls is insured thus maximizing yield. Further, the plasma cleaning process is a cost efficient high volume process with no adverse effect on package reliability.

Abstract: A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the first surface of the die pad is at least one electronic component which is electrically connected to at least one of the contacts either directly or via one or more of the traces. A first encapsulation part covers the second surfaces of the die pad and the traces, with the second surfaces of the contacts being exposed in the first encapsulation part. A second encapsulation part covers the electronic component and the first surfaces of the die pad, the contacts, and the traces. The first and second encapsulation parts collectively define a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

Abstract: A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to each other and each define opposed first and second surfaces. Mounted to the first surface of the die pad is at least one electronic component which is electrically connected to at least one of the contacts either directly or via one or more of the traces. A first encapsulation part covers the second surfaces of the die pad and the traces, with the second surfaces of the contacts being exposed in the first encapsulation part. A second encapsulation part covers the electronic component and the first surfaces of the die pad, the contacts, and the traces. The first and second encapsulation parts collectively define a body of the memory card which includes a bottom surface having the second surfaces of the contacts exposed therein.

Abstract: A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within the central opening. Each leadframe further includes a plurality of leads which are attached to the outer frame and extend toward the die pad in spaced relation to each other. The outer frames are integrally connected to each other and collectively define connecting bars which extend in multiple rows and columns and define saw streets. Semiconductor dies are attached to respective ones of the die pads, with the semiconductor dies being mechanically and electrically connected to the leads of respective ones of the leadframes. Thereafter, an encapsulant material is applied to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes, the semiconductor dies, and the conductive wires.

Abstract: A lead frame strip for use in the manufacture of integrated circuit chip packages. The strip comprises at least one array defining a multiplicity of lead frames. The lead frames each include an outer frame defining a central opening having a die pad disposed therein. Attached to the outer frame and extending toward the die pad in spaced relation to each other are a plurality of leads. The outer frames are integrally connected to each other such that the lead frames are arranged in a matrix wherein the leads thereof extend in multiple rows and columns. The leads of the lead frames within each of the rows and columns are arranged in sets which are disposed in spaced relation to each other. A plurality of openings are formed within the strip between and in alignment with the leads of each of the lead frames within each of the rows and columns.

Abstract: A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.

Abstract: A side headrest for the upper sides of seats to constrain the head of a user comprising a chair having a generally horizontally oriented seat portion with a rear edge and having a generally vertically oriented back portion with a lower edge adjacent to the rear edge of the seat portion and an upper edge adapted to support the head of a user, the back portion having side edges extending from the lower edge to the upper edge; a short pivot shaft rotatably coupled with respect to each side edge adjacent to its upper edge; a long support shaft coupled to each pivot shaft, the pivot shaft adapted to rotate the support shaft between a lower generally horizontal orientation and a raised generally vertical orientation; limit means for limiting the rotation of each pivot shaft and support shaft; and elastomeric over the pivot shaft and support shaft for providing softness.