Abstract: An imprinting, texturing or embossing system for a roll-to-plate process including at least one roller and at least one device capable to exert a resetting force to the starting position of the imprinting process after imprinting wherein the roller is a freely rotating roller.

Abstract: A process and equipment texture substrates. A discrete substrate and a resilient stamp with a patterned outer surface having openings and elevations are coated with a formable imprint lacquer and the stamp is bent around an axis of an imaginary cylinder parallel to the plane of the substrate and perpendicular to the imprint direction to obtain a bent resilient stamp having a particular imprint-curvature. The bent stamp contacts formable imprint lacquer to apply imprint pressure onto a substrate contact area. The imprint pressure is generated by a resilience force of the stamp. The substrate and/or stamp move relative to one another while pressing the outer surface openings/elevations with the imprint pressure into the lacquer to attain an imprint texture while maintaining constant imprint-curvature. The formable imprint lacquer with the imprint texture solidifies on the substrate, and the stamp is separated from the textured substrate.

Abstract: An apparatus for texturing or patterning discrete substrates by imprinting a curable lacquer with a discrete flexible stamp and curing the imprinted lacquer resulting in an additional functional textured layer on a discrete substrate is provided having at least a first and a second clamp, a first roller and at least one driven belt connected with the first clamp and with the second clamp and capable of moving the clamped flexible stamp wherein either the roller is not able to cause its own rotation, but is driven by the stamp which in turn is driven by the belt which in turn is driven by a belt driving device, or the roller is driven at the same speed as the belt by a roller driving device which follows the belt driving device in a master slave configuration.

Abstract: A process and equipment texture substrates. A discrete substrate and a resilient stamp with a patterned outer surface having openings and elevations are coated with a formable imprint lacquer and the stamp is bent around an axis of an imaginary cylinder parallel to the plane of the substrate and perpendicular to the imprint direction to obtain a bent resilient stamp having a particular imprint-curvature. The bent stamp contacts formable imprint lacquer to apply imprint pressure onto a substrate contact area. The imprint pressure is generated by a resilience force of the stamp. The substrate and/or stamp move relative to one another while pressing the outer surface openings/elevations with the imprint pressure into the lacquer to attain an imprint texture while maintaining constant imprint-curvature. The formable imprint lacquer with the imprint texture solidifies on the substrate, and the stamp is separated from the textured substrate.

Abstract: An apparatus for texturing or patterning discrete substrates by imprinting a curable lacquer with a discrete flexible stamp and curing the imprinted lacquer resulting in an additional functional textured layer on a discrete substrate is provided having at least a first and a second clamp, a first roller and at least one driven belt connected with the first clamp and with the second clamp and capable of moving the clamped flexible stamp wherein either the roller is not able to cause its own rotation, but is driven by the stamp which in turn is driven by the belt which in turn is driven by a belt driving device, or the roller is driven at the same speed as the belt by a roller driving device which follows the belt driving device in a master slave configuration.

Abstract: A chip resistor having a value ranging from 10 Ohm to 100 kOhm and having a low temperature coefficient a low noise level and a high stability. The resistor is manufactured by means of the thin-fil technique. For this purpose, an NiCrAl-resistance layer is applied to one side of a flat ceramic support, and contact strips of Ni or an Ni-alloy, possibly preceded by an intermediate layer, are provided at two ends of the said support. An insulating lacquer layer is then applied to the resistance layer and partly overlaps the contact strips. The solderable supply strips are provided on the exposed metal portions.

Abstract: A metal film resistors consisting of an Ni-Al alloy with an Al content of at least 14.5 and at most 22% by weight with a maximum of 2.5% by weight of compatible contaminants are disclosed. Those can be used in the resistance range between 0.5 Ohm and 5 KOhm, are very stable and can be obtained with a low temperature coefficient of the resistance below .+-.50 ppm/.degree. C. between -55.degree. C.-+150.degree. C.

Abstract: A resistor having an insulating substrate bearing a thin layer of the alloy CrSi.sub.x, where 1.ltoreq.x.ltoreq.5 and which layer is doped with nitrogen. The doping may be spread homogeneously throughout the thickness or be concentrated in one or two thickness zones on the outside and/or on the side adjoining the substrate. As a result of the nitrogen doping an improvement of the stability of the resistor is obtained.

Abstract: A resistor having of an insulating substrate bearing a thin layer of the alloy CrSi.sub.x, where 1.ltoreq.x.ltoreq.5 and which layer is doped with nitrogen. The doping may be spread homogeneously throughout the thickness or be concentrated in one or two thickness zones on the outside and/or on the side adjoining the substrate. As a result of the nitrogen doping an improvement of the stability of the resistor is obtained.