Patents by Inventor Luigi Giussani

Luigi Giussani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array module
    Patent number: 6994803
    Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: February 7, 2006
    Assignee: International Business Machines Corporation
    Inventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
  • Ball grid array module
    Publication number: 20030188430
    Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimetre) of a paste very soluble in water and washing it off.
    Type: Application
    Filed: May 12, 2003
    Publication date: October 9, 2003
    Applicant: International Business Machines Corporation
    Inventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
  • Ball grid array module
    Patent number: 6574860
    Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.
    Type: Grant
    Filed: September 20, 2000
    Date of Patent: June 10, 2003
    Assignee: International Business Machines Corporation
    Inventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon