Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface..

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: A method of manufacturing semiconductor devices includes: coupling first and the second substrates by coupling a back surface of the second substrate with a front surface of the first substrate, thereby producing a step-like structure, with an uncovered portion of the front surface of the first substrate left uncovered by the second substrate coupling a first integrated circuit with the uncovered portion of the front surface of the first substrate; and coupling a second integrated circuit with the second substrate and the first integrated circuit by arranging the second integrated circuit extending bridge—like between the second substrate and the first integrated circuit.

Abstract: An optoelectronic device may include a package having a component for sending/receiving optical signals along a first direction, and a chip of semiconductor material housed within the package. The chip may have a main surface and a portion exposed on the main surface for sending/receiving the optical signals along a second direction different from the first direction. The optoelectronic device may further include a component for deflecting the optical signals between the first direction and the second direction, the component being mounted on the main surface.

Abstract: A device for extracting to atmosphere the air from the interior of an automobile passenger compartment, comprising at least one air outlet aperture (12) provided in a wall (11) of the luggage compartment (10), and at least one non-return valve (14) engaged with said aperture (12), said valve (14) formed from a framework (16) comprising a grid (19) and a casing (18), and from a diaphragm (20) which is rotatably supported in the casing of the framework and which, when in the rest state, adheres to the grid (19). The framework (16) is mounted in the aperture (12) in the wall (11) of the luggage compartment (10), with the framework (18) and grid (19) disposed mainly within the interior of the luggage compartment (10).

Abstract: The device comprises an integrated unit formed by a container element having an opening for the filler, a door hinged onto the container element and subject to the action of an opening spring and an electrically actuatable lock for the door. The container element with the door and the lock mounted thereon are fastened as a single unit to the metal sheet of the bodywork.